JP4563508B1 - Cu−Mg−P系銅合金条材及びその製造方法 - Google Patents
Cu−Mg−P系銅合金条材及びその製造方法 Download PDFInfo
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- JP4563508B1 JP4563508B1 JP2010038516A JP2010038516A JP4563508B1 JP 4563508 B1 JP4563508 B1 JP 4563508B1 JP 2010038516 A JP2010038516 A JP 2010038516A JP 2010038516 A JP2010038516 A JP 2010038516A JP 4563508 B1 JP4563508 B1 JP 4563508B1
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- Prior art keywords
- copper alloy
- alloy strip
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- rolling
- Prior art date
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000013078 crystal Substances 0.000 claims abstract description 60
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000005259 measurement Methods 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 238000001887 electron backscatter diffraction Methods 0.000 claims abstract 2
- 238000005096 rolling process Methods 0.000 claims description 27
- 238000000137 annealing Methods 0.000 claims description 17
- 238000005098 hot rolling Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 238000005097 cold rolling Methods 0.000 claims description 13
- 238000002003 electron diffraction Methods 0.000 claims description 12
- 230000009467 reduction Effects 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 5
- 238000012360 testing method Methods 0.000 description 9
- 230000006872 improvement Effects 0.000 description 7
- 229910000906 Bronze Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010038516A JP4563508B1 (ja) | 2010-02-24 | 2010-02-24 | Cu−Mg−P系銅合金条材及びその製造方法 |
PCT/JP2010/072808 WO2011104982A1 (ja) | 2010-02-24 | 2010-12-17 | Cu-Mg-P系銅合金条材及びその製造方法 |
KR1020127023850A KR101724561B1 (ko) | 2010-02-24 | 2010-12-17 | Cu-Mg-P계 동합금봉 및 그 제조 방법 |
CN201080063568.8A CN102753712B (zh) | 2010-02-24 | 2010-12-17 | Cu-Mg-P系铜合金条材及其制造方法 |
TW099144991A TWI480394B (zh) | 2010-02-24 | 2010-12-21 | Cu-Mg-P copper alloy strip and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010038516A JP4563508B1 (ja) | 2010-02-24 | 2010-02-24 | Cu−Mg−P系銅合金条材及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4563508B1 true JP4563508B1 (ja) | 2010-10-13 |
JP2011174127A JP2011174127A (ja) | 2011-09-08 |
Family
ID=43048784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010038516A Active JP4563508B1 (ja) | 2010-02-24 | 2010-02-24 | Cu−Mg−P系銅合金条材及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4563508B1 (zh) |
KR (1) | KR101724561B1 (zh) |
CN (1) | CN102753712B (zh) |
TW (1) | TWI480394B (zh) |
WO (1) | WO2011104982A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013150627A1 (ja) | 2012-04-04 | 2013-10-10 | 三菱伸銅株式会社 | 優れた耐疲労特性を有するCu-Mg-P系銅合金板及びその製造方法 |
US20170283910A1 (en) * | 2014-08-25 | 2017-10-05 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Conductive material for connection parts which has excellent minute slide wear resistance |
CN115735018A (zh) * | 2020-06-30 | 2023-03-03 | 三菱综合材料株式会社 | 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条、引线框架及散热基板 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101369693B1 (ko) | 2010-05-14 | 2014-03-04 | 미쓰비시 마테리알 가부시키가이샤 | 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재 |
JP5054160B2 (ja) * | 2010-06-28 | 2012-10-24 | 三菱伸銅株式会社 | Cu−Mg−P系銅合金条材及びその製造方法 |
JP5903832B2 (ja) | 2011-10-28 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品 |
JP5903838B2 (ja) * | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品 |
JP5903842B2 (ja) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
JP5908796B2 (ja) * | 2012-06-05 | 2016-04-26 | 三菱伸銅株式会社 | 機械的な成形性に優れたCu−Mg−P系銅合金板及びその製造方法 |
JP6370692B2 (ja) * | 2013-11-26 | 2018-08-08 | 三菱伸銅株式会社 | Cu−Zr系銅合金板及びその製造方法 |
CN107709585B (zh) | 2015-09-09 | 2020-12-04 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条 |
JP5910790B1 (ja) * | 2015-12-01 | 2016-04-27 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
CN107636179B (zh) | 2015-09-09 | 2020-06-16 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条 |
WO2017043551A1 (ja) * | 2015-09-09 | 2017-03-16 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
JP6226097B2 (ja) * | 2016-03-30 | 2017-11-08 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
US11203806B2 (en) | 2016-03-30 | 2021-12-21 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
WO2017170733A1 (ja) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
JP6780187B2 (ja) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
MX2020009869A (es) | 2018-03-30 | 2020-10-12 | Mitsubishi Materials Corp | Aleacion de cobre para dispositivo electronico/electrico, material en lamina/tira de aleacion de cobre para dispositivo electronico/electrico, componente para dispositivo electronico/electrico, terminal, y barra colectora. |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203738A (ja) * | 1987-02-18 | 1988-08-23 | Mitsubishi Shindo Kk | Cu合金製電気機器用リレー材 |
JPH01180930A (ja) * | 1988-01-12 | 1989-07-18 | Mitsubishi Shindo Kk | 電子電気機器のCu合金製コネクタ材 |
JPH01309219A (ja) * | 1989-04-04 | 1989-12-13 | Mitsubishi Shindoh Co Ltd | Cu合金製電気機器用端子 |
JPH0582203A (ja) * | 1991-09-20 | 1993-04-02 | Mitsubishi Shindoh Co Ltd | Cu合金製電気ソケツト構造部品 |
JPH06340938A (ja) * | 1992-02-10 | 1994-12-13 | Mitsubishi Shindoh Co Ltd | スタンピング金型を摩耗させることの少ない伸銅合金条材およびその製造法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62227051A (ja) * | 1986-03-28 | 1987-10-06 | Mitsubishi Shindo Kk | Cu合金製電気機器用コネクタ |
JP3796784B2 (ja) | 1995-12-01 | 2006-07-12 | 三菱伸銅株式会社 | コネクタ製造用銅合金薄板およびその薄板で製造したコネクタ |
JP4087307B2 (ja) * | 2003-07-09 | 2008-05-21 | 日鉱金属株式会社 | 延性に優れた高力高導電性銅合金 |
JP5260992B2 (ja) * | 2008-03-19 | 2013-08-14 | Dowaメタルテック株式会社 | 銅合金板材およびその製造方法 |
JP4516154B1 (ja) * | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Cu−Mg−P系銅合金条材及びその製造方法 |
-
2010
- 2010-02-24 JP JP2010038516A patent/JP4563508B1/ja active Active
- 2010-12-17 CN CN201080063568.8A patent/CN102753712B/zh active Active
- 2010-12-17 WO PCT/JP2010/072808 patent/WO2011104982A1/ja active Application Filing
- 2010-12-17 KR KR1020127023850A patent/KR101724561B1/ko active IP Right Grant
- 2010-12-21 TW TW099144991A patent/TWI480394B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203738A (ja) * | 1987-02-18 | 1988-08-23 | Mitsubishi Shindo Kk | Cu合金製電気機器用リレー材 |
JPH01180930A (ja) * | 1988-01-12 | 1989-07-18 | Mitsubishi Shindo Kk | 電子電気機器のCu合金製コネクタ材 |
JPH01309219A (ja) * | 1989-04-04 | 1989-12-13 | Mitsubishi Shindoh Co Ltd | Cu合金製電気機器用端子 |
JPH0582203A (ja) * | 1991-09-20 | 1993-04-02 | Mitsubishi Shindoh Co Ltd | Cu合金製電気ソケツト構造部品 |
JPH06340938A (ja) * | 1992-02-10 | 1994-12-13 | Mitsubishi Shindoh Co Ltd | スタンピング金型を摩耗させることの少ない伸銅合金条材およびその製造法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013150627A1 (ja) | 2012-04-04 | 2013-10-10 | 三菱伸銅株式会社 | 優れた耐疲労特性を有するCu-Mg-P系銅合金板及びその製造方法 |
CN103502486A (zh) * | 2012-04-04 | 2014-01-08 | 三菱伸铜株式会社 | 具有优异的耐疲劳特性的Cu-Mg-P系铜合金板及其制造方法 |
US9169539B2 (en) | 2012-04-04 | 2015-10-27 | Mitsubishi Shindoh Co., Ltd. | Cu-Mg-P-based copper alloy sheet having excellent fatigue resistance characteristic and method of producing the same |
CN103502486B (zh) * | 2012-04-04 | 2016-06-22 | 三菱伸铜株式会社 | 具有优异的耐疲劳特性的Cu-Mg-P系铜合金板及其制造方法 |
US20170283910A1 (en) * | 2014-08-25 | 2017-10-05 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Conductive material for connection parts which has excellent minute slide wear resistance |
CN115735018A (zh) * | 2020-06-30 | 2023-03-03 | 三菱综合材料株式会社 | 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条、引线框架及散热基板 |
CN115735018B (zh) * | 2020-06-30 | 2024-01-26 | 三菱综合材料株式会社 | 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条、引线框架及散热基板 |
Also Published As
Publication number | Publication date |
---|---|
JP2011174127A (ja) | 2011-09-08 |
TW201132768A (en) | 2011-10-01 |
TWI480394B (zh) | 2015-04-11 |
KR20120121402A (ko) | 2012-11-05 |
CN102753712A (zh) | 2012-10-24 |
KR101724561B1 (ko) | 2017-04-07 |
WO2011104982A1 (ja) | 2011-09-01 |
CN102753712B (zh) | 2014-07-23 |
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