JP4553392B2 - 液晶ディスプレイ用ボトム基板の製作方法 - Google Patents
液晶ディスプレイ用ボトム基板の製作方法 Download PDFInfo
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- JP4553392B2 JP4553392B2 JP2006341273A JP2006341273A JP4553392B2 JP 4553392 B2 JP4553392 B2 JP 4553392B2 JP 2006341273 A JP2006341273 A JP 2006341273A JP 2006341273 A JP2006341273 A JP 2006341273A JP 4553392 B2 JP4553392 B2 JP 4553392B2
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- 239000000758 substrate Substances 0.000 title claims description 57
- 238000004519 manufacturing process Methods 0.000 title claims description 47
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 42
- 239000010410 layer Substances 0.000 claims description 185
- 229910052751 metal Inorganic materials 0.000 claims description 83
- 239000002184 metal Substances 0.000 claims description 83
- 238000000034 method Methods 0.000 claims description 72
- 229920002120 photoresistant polymer Polymers 0.000 claims description 32
- 239000010409 thin film Substances 0.000 claims description 29
- 238000005530 etching Methods 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 8
- 238000001312 dry etching Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000000788 chromium alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910004304 SiNy Inorganic materials 0.000 description 1
- 229910010421 TiNx Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
- G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
(A)基板を1つ提供する、
(B)その基板上にパターン化された第一金属層、絶縁層、半導体層を形成し、その内、そのパターン化された第一金属層はその絶縁層と基板の間に位置する、
(C)その半導体層上方に第二金属層を形成する、
(D)その第二金属層にフォトレジストを塗布する、
(E)一回露光現像プロセスを利用して該フォトレジストの第一領域に第一厚さを持たせ、該フォトレジストの第二領域に第二厚さを持たせ、且つ該第一厚さを該第二厚さより小さくする、
(F)該フォトレジストと該第二金属層をエッチングし、パターン化された第二金属層を形成し、該パターン化された第二金属層は、第三領域に第三厚さを持ち、該パターン化された第二金属層の第四領域は第四厚さを持ち、該パターン化された第二金属層の該第三領域は薄膜トランジスタのソース或いはドレインとし、該パターン化された第二金属層の該第四領域は補助コンデンサの電極とし、且つ該第三厚さは該第四厚さより小さくする、 (G)該パターン化された第二金属層上に高分子層を塗布する、
(H)該高分子層を照射して硬化させ、平坦層を形成する、
(I)該第二金属層の該第四領域が露出するまで該平坦層をエッチングする、
(J)該平坦層と該パターン化された第二金属層の表面に、パターン化された透明電極層を形成することを特徴とする液晶ディスプレイ用ボトム基板の製造方法としている。
請求項2の発明は、請求項1記載の液晶ディスプレイ用ボトム基板の製造方法において、(F)のステップで、該フォトレジストと該第二金属層をエッチングし、パターン化された第二金属層を形成した後に、(G)のステップで高分子層を塗布する前に、該パターン化された第二金属層表面に保護層を形成するステップを含むことを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項3の発明は、当該ステップ(F)のエッチングを乾式或いは湿式エッチングとすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項4の発明は、当該照射を紫外線光の照射とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項5の発明は、当該パターン化された第一金属層が薄膜トランジスタのゲートと補助コンデンサの電極を含むことを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項6の発明は、当該ステップ(I)のエッチングを乾式エッチングとすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項7の発明は、当該絶縁層を酸化ケイ素或いは窒化ケイ素とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項8の発明は、当該半導体層をアモルファスシリコン層とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項9の発明は、さらにその半導体層の表層にオーミック接触層を形成するステップを含むことを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項10の発明は、当該透明電極層をIZO層或いはITO層とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項11の発明は、当該露光現像プロセス中、半調光マスクを使用することを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
請求項12の発明は、当該第三厚さとその第四厚さの差が約1000Åであることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法としている。
32 第一金属層
34 絶縁層
36 半導体層
38 オーミック接触層
42 第二金属層
44 第一フォトレジスト層
46 保護層
48 第二フォトレジスト層
50 透明電極層
60 接触エリア
62 コンタクトホール
100 半調光マスク
Claims (12)
- 以下のステップを包括する、
(A)基板を1つ提供する、
(B)その基板上にパターン化された第一金属層、絶縁層、半導体層を形成し、その内、そのパターン化された第一金属層はその絶縁層と基板の間に位置する、
(C)その半導体層上方に第二金属層を形成する、
(D)その第二金属層にフォトレジストを塗布する、
(E)一回露光現像プロセスを利用して該フォトレジストの第一領域に第一厚さを持たせ、該フォトレジストの第二領域に第二厚さを持たせ、且つ該第一厚さを該第二厚さより小さくする、
(F)該フォトレジストと該第二金属層をエッチングし、パターン化された第二金属層を形成し、該パターン化された第二金属層は、第三領域に第三厚さを持ち、該パターン化された第二金属層の第四領域は第四厚さを持ち、該パターン化された第二金属層の該第三領域は薄膜トランジスタのソース或いはドレインとし、該パターン化された第二金属層の該第四領域は補助コンデンサの電極とし、且つ該第三厚さは該第四厚さより小さくする、 (G)該パターン化された第二金属層上に高分子層を塗布する、
(H)該高分子層を照射して硬化させ、平坦層を形成する、
(I)該第二金属層の該第四領域が露出するまで該平坦層をエッチングする、
(J)該平坦層と該パターン化された第二金属層の表面に、パターン化された透明電極層を形成することを特徴とする液晶ディスプレイ用ボトム基板の製造方法。 - 請求項1記載の液晶ディスプレイ用ボトム基板の製造方法において、(F)のステップで、該フォトレジストと該第二金属層をエッチングし、パターン化された第二金属層を形成した後に、(G)のステップで高分子層を塗布する前に、該パターン化された第二金属層表面に保護層を形成するステップを含むことを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該ステップ(F)のエッチングを乾式或いは湿式エッチングとすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該照射を紫外線光の照射とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該パターン化された第一金属層が薄膜トランジスタのゲートと補助コンデンサの電極を含むことを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該ステップ(I)のエッチングを乾式エッチングとすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該絶縁層を酸化ケイ素或いは窒化ケイ素とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該半導体層をアモルファスシリコン層とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- さらにその半導体層の表層にオーミック接触層を形成するステップを含むことを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該透明電極層をIZO層或いはITO層とすることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該露光現像プロセス中、半調光マスクを使用することを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
- 当該第三厚さとその第四厚さの差が約1000Åであることを特徴とする請求項1記載の液晶ディスプレイ用ボトム基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW094147579A TWI273712B (en) | 2005-12-30 | 2005-12-30 | A method for manufacturing a bottom substrate of a liquid crystal display device with three mask processes |
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JP2007183623A JP2007183623A (ja) | 2007-07-19 |
JP4553392B2 true JP4553392B2 (ja) | 2010-09-29 |
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US (1) | US7435632B2 (ja) |
JP (1) | JP4553392B2 (ja) |
KR (1) | KR100875801B1 (ja) |
TW (1) | TWI273712B (ja) |
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JP4740203B2 (ja) * | 2006-08-04 | 2011-08-03 | 北京京東方光電科技有限公司 | 薄膜トランジスタlcd画素ユニットおよびその製造方法 |
TWI346391B (en) | 2007-08-20 | 2011-08-01 | Au Optronics Corp | Liquid crystal display device and the manufacturing method thereof |
KR20120036186A (ko) | 2010-10-07 | 2012-04-17 | 삼성전자주식회사 | 배선, 배선 형성 방법, 상기 배선을 이용한 표시 장치, 및 상기 표시 장치의 제조 방법 |
US8956809B2 (en) * | 2012-08-03 | 2015-02-17 | Applied Materials, Inc. | Apparatus and methods for etching quartz substrate in photomask manufacturing applications |
CN107910300B (zh) * | 2017-11-20 | 2020-04-21 | 合肥京东方光电科技有限公司 | 一种阵列基板的制作方法、阵列基板及显示装置 |
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JP2004311520A (ja) * | 2003-04-02 | 2004-11-04 | Advanced Display Inc | 表示装置の製造方法 |
JP2005338856A (ja) * | 2004-05-27 | 2005-12-08 | Lg Phillips Lcd Co Ltd | 液晶表示装置及びその製造方法 |
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KR100212409B1 (ko) * | 1990-11-21 | 1999-08-02 | 윌리엄 비. 켐플러 | 수직 및 수평 절연 게이트, 전계 효과 트랜지스터 및 그 제조방법 |
KR100372306B1 (ko) * | 1998-11-19 | 2003-08-25 | 삼성전자주식회사 | 박막트랜지스터의제조방법 |
KR100333979B1 (ko) * | 1999-04-26 | 2002-04-24 | 윤종용 | 액정 표시 장치용 박막 트랜지스터 기판 및 그의 제조 방법 |
JP3548711B2 (ja) * | 2000-09-25 | 2004-07-28 | シャープ株式会社 | 液晶用マトリクス基板の製造方法ならびにコンタクトホール形成方法 |
TW546853B (en) * | 2002-05-01 | 2003-08-11 | Au Optronics Corp | Active type OLED and the fabrication method thereof |
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TWI279918B (en) * | 2005-06-29 | 2007-04-21 | Quanta Display Inc | A method for forming a liquid crystal display |
KR20070045824A (ko) * | 2005-10-28 | 2007-05-02 | 삼성전자주식회사 | 박막 트랜지스터, 표시판 및 그 제조 방법 |
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JPH08136951A (ja) * | 1994-11-08 | 1996-05-31 | Matsushita Electric Ind Co Ltd | 液晶パネル用基板とその製造方法 |
JPH11340462A (ja) * | 1998-05-28 | 1999-12-10 | Fujitsu Ltd | 液晶表示装置およびその製造方法 |
JPH11352515A (ja) * | 1998-06-09 | 1999-12-24 | Mitsubishi Electric Corp | 液晶表示装置およびその製造方法 |
JP2004311520A (ja) * | 2003-04-02 | 2004-11-04 | Advanced Display Inc | 表示装置の製造方法 |
JP2005338856A (ja) * | 2004-05-27 | 2005-12-08 | Lg Phillips Lcd Co Ltd | 液晶表示装置及びその製造方法 |
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JP2007183623A (ja) | 2007-07-19 |
KR100875801B1 (ko) | 2008-12-26 |
KR20070072371A (ko) | 2007-07-04 |
US20070155034A1 (en) | 2007-07-05 |
TW200725900A (en) | 2007-07-01 |
TWI273712B (en) | 2007-02-11 |
US7435632B2 (en) | 2008-10-14 |
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