JP4551251B2 - 真空コーティングプラント用のロックチャンバー装置およびその動作プロセス - Google Patents

真空コーティングプラント用のロックチャンバー装置およびその動作プロセス Download PDF

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Publication number
JP4551251B2
JP4551251B2 JP2005075753A JP2005075753A JP4551251B2 JP 4551251 B2 JP4551251 B2 JP 4551251B2 JP 2005075753 A JP2005075753 A JP 2005075753A JP 2005075753 A JP2005075753 A JP 2005075753A JP 4551251 B2 JP4551251 B2 JP 4551251B2
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Prior art keywords
lock chamber
pump
pump set
stage
lock
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Expired - Fee Related
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Japanese (ja)
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JP2005290558A (ja
Inventor
ゲベル トーマス
ヘンリッヒ ユルゲン
ヴァイマン マンフレッド
Original Assignee
アプライド マテリアルズ ゲーエムベーハー ウント ツェーオー カーゲー
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Application filed by アプライド マテリアルズ ゲーエムベーハー ウント ツェーオー カーゲー filed Critical アプライド マテリアルズ ゲーエムベーハー ウント ツェーオー カーゲー
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F04D17/168—Pumps specially adapted to produce a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Physical Vapour Deposition (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Breeding Of Plants And Reproduction By Means Of Culturing (AREA)
  • Control Of Heat Treatment Processes (AREA)
  • ing And Chemical Polishing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
JP2005075753A 2004-03-31 2005-03-16 真空コーティングプラント用のロックチャンバー装置およびその動作プロセス Expired - Fee Related JP4551251B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04007820.6A EP1582607B2 (de) 2004-03-31 2004-03-31 Schleusenanordnung für eine Vakuumbehandlungsanlage und Verfahren zum Betreiben von dieser

Publications (2)

Publication Number Publication Date
JP2005290558A JP2005290558A (ja) 2005-10-20
JP4551251B2 true JP4551251B2 (ja) 2010-09-22

Family

ID=34878226

Family Applications (1)

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JP2005075753A Expired - Fee Related JP4551251B2 (ja) 2004-03-31 2005-03-16 真空コーティングプラント用のロックチャンバー装置およびその動作プロセス

Country Status (10)

Country Link
US (1) US20050217993A1 (ko)
EP (1) EP1582607B2 (ko)
JP (1) JP4551251B2 (ko)
KR (1) KR20060044866A (ko)
CN (1) CN100529173C (ko)
AT (1) ATE412789T1 (ko)
DE (1) DE502004008341D1 (ko)
ES (1) ES2316892T3 (ko)
PL (1) PL1582607T3 (ko)
TW (1) TWI284699B (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112008001620B4 (de) * 2007-07-03 2021-08-26 VON ARDENNE Asset GmbH & Co. KG Verfahren und Vorrichtung zum Schleusen überlanger Substrate in einer Vakuumbeschichtungsanlage, Vakuumbeschichtungsanlage und Verfahren zu deren Betrieb
CN101428973B (zh) * 2008-11-19 2013-01-30 苏州新爱可镀膜设备有限公司 镀膜玻璃用真空磁控镀膜室
CN101428972B (zh) * 2008-11-19 2013-01-30 苏州新爱可镀膜设备有限公司 镀膜玻璃用磁控镀膜真空腔室
AR076167A1 (es) * 2009-03-30 2011-05-26 Sumitomo Metal Ind Aparato y metodo para la aplicacion de un lubricante a una porcion roscada de una tuberia de acero
DE102011114852A1 (de) 2010-10-06 2012-05-03 Von Ardenne Anlagentechnik Gmbh Einschleusvorrichtung für eine Vakuumanlage
GB2497957B (en) * 2011-12-23 2018-06-27 Edwards Ltd Vacuum pumping
JP5099573B1 (ja) * 2012-01-23 2012-12-19 有限会社スコットプランニング 複数の真空装置の省エネルギ−化を図る真空ポンプシステム
DE202012012359U1 (de) * 2012-12-22 2014-03-24 Oerlikon Leybold Vacuum Gmbh Pumpstand zum Pumpen leichter Gase
DE102013205709B4 (de) * 2013-03-28 2017-03-09 Von Ardenne Gmbh Schleusenverfahren und Vakuumsubstratbehandlungsanlage
US20150206741A1 (en) 2014-01-17 2015-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for in situ steam generation
CN104556723B (zh) * 2014-12-23 2017-10-27 深圳达实智能股份有限公司 玻璃镀膜出口分锅控制方法及系统
DE102015116965B4 (de) * 2015-10-06 2024-05-08 VON ARDENNE Asset GmbH & Co. KG Kammeranordnung und Verfahren
DE102016107830B4 (de) * 2016-04-27 2022-02-03 VON ARDENNE Asset GmbH & Co. KG Vakuumkammeranordnung und Verfahren zum Betreiben einer Vakuumkammeranordnung
RU2651838C2 (ru) * 2016-09-08 2018-04-24 Акционерное общество "КВАРЦ" Заслонка
DE102018004086A1 (de) * 2018-05-18 2019-11-21 Singulus Technologies Ag Durchlaufanlage und Verfahren zum Beschichten von Substraten
DE102018112853A1 (de) * 2018-05-29 2019-12-05 Meyer Burger (Germany) Gmbh Belüftungsvorrichtung und Vakuumproduktionsanlage
EP3590551A1 (en) * 2018-07-04 2020-01-08 Koninklijke Philips N.V. A pump arrangement, configured to be used with a breast pump device
JP6808690B2 (ja) * 2018-07-25 2021-01-06 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、基板処理装置および減圧乾燥方法
CN113169094A (zh) 2018-09-28 2021-07-23 朗姆研究公司 避免沉积副产物积聚的真空泵保护
CN110964599B (zh) * 2019-10-22 2022-10-28 江西开源香料有限公司 橡苔提纯装置及其使用方法和应用
CN110645809B (zh) * 2019-10-23 2024-04-19 国家能源集团科学技术研究院有限公司 一种直接空冷机组超低背压运行的抽真空系统

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US2823518A (en) * 1953-11-19 1958-02-18 Thompson Prod Inc Aircraft fuel pumping system
US4504194A (en) * 1982-05-24 1985-03-12 Varian Associates, Inc. Air lock vacuum pumping methods and apparatus
JPS60187485A (ja) * 1984-03-06 1985-09-24 Raifu Technol Kenkyusho 接合装置
AU572375B2 (en) * 1985-01-31 1988-05-05 Boc Group, Inc., The Transporting of workpiece to and from vacuum coating apparatus
US4850806A (en) * 1988-05-24 1989-07-25 The Boc Group, Inc. Controlled by-pass for a booster pump
JPH03183767A (ja) * 1989-12-11 1991-08-09 Canon Inc 薄膜形成装置及びこれを用いた薄膜形成方法
JPH04262865A (ja) * 1991-01-22 1992-09-18 Kenji Kondo はんだ付け装置
JPH0598434A (ja) * 1991-10-04 1993-04-20 Matsushita Electron Corp マルチチヤンバー型スパツタリング装置
DE4207525C2 (de) * 1992-03-10 1999-12-16 Leybold Ag Hochvakuum-Beschichtungsanlage
DE4213763B4 (de) * 1992-04-27 2004-11-25 Unaxis Deutschland Holding Gmbh Verfahren zum Evakuieren einer Vakuumkammer und einer Hochvakuumkammer sowie Hochvakuumanlage zu seiner Durchführung
DE4432730A1 (de) * 1994-09-14 1996-03-21 Emitec Emissionstechnologie Verfahren zur Herstellung einer metallischen Struktur
JP3390579B2 (ja) * 1995-07-03 2003-03-24 アネルバ株式会社 液晶ディスプレイ用薄膜の作成方法及び作成装置
KR0183912B1 (ko) * 1996-08-08 1999-05-01 김광호 다중 반응 챔버에 연결된 펌핑 설비 및 이를 사용하는 방법
JP3763193B2 (ja) * 1997-09-22 2006-04-05 アイシン精機株式会社 多段式真空ポンプ
DE19808163C1 (de) * 1998-02-27 1999-07-15 Ardenne Anlagentech Gmbh Schleusensystem für die Überführungskammer einer Vakuumbeschichtungsanlage
DE10048210B4 (de) * 2000-09-28 2007-02-15 Singulus Technologies Ag Vorrichtung und Verfahren zum Einschleusen eines Werkstücks über eine Vorvakuumkammer in eine Hochvakuumkammer und deren Verwendung

Also Published As

Publication number Publication date
TW200537027A (en) 2005-11-16
EP1582607B2 (de) 2016-07-06
KR20060044866A (ko) 2006-05-16
DE502004008341D1 (de) 2008-12-11
ATE412789T1 (de) 2008-11-15
EP1582607A1 (de) 2005-10-05
CN100529173C (zh) 2009-08-19
JP2005290558A (ja) 2005-10-20
TWI284699B (en) 2007-08-01
CN1676485A (zh) 2005-10-05
PL1582607T3 (pl) 2009-04-30
US20050217993A1 (en) 2005-10-06
EP1582607B1 (de) 2008-10-29
ES2316892T3 (es) 2009-04-16

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