JP4536345B2 - 多結晶化用マスク及びこれを利用した薄膜トランジスタの製造方法 - Google Patents
多結晶化用マスク及びこれを利用した薄膜トランジスタの製造方法 Download PDFInfo
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- JP4536345B2 JP4536345B2 JP2003323656A JP2003323656A JP4536345B2 JP 4536345 B2 JP4536345 B2 JP 4536345B2 JP 2003323656 A JP2003323656 A JP 2003323656A JP 2003323656 A JP2003323656 A JP 2003323656A JP 4536345 B2 JP4536345 B2 JP 4536345B2
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- 239000010409 thin film Substances 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 239000010408 film Substances 0.000 claims description 57
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 55
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 50
- 238000000034 method Methods 0.000 description 42
- 239000013078 crystal Substances 0.000 description 20
- 238000002425 crystallisation Methods 0.000 description 19
- 230000008025 crystallization Effects 0.000 description 19
- 239000007790 solid phase Substances 0.000 description 15
- 239000007791 liquid phase Substances 0.000 description 13
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 238000002834 transmittance Methods 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 8
- 238000006356 dehydrogenation reaction Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910020177 SiOF Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021344 molybdenum silicide Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
Description
前記第1領域のスリットパターンと前記第2領域のスリットパターンとは、半ピッチずらして配置されている。
前記第1領域及び第2領域において、前記スリットパターンは二列に配列されている。
20 半導体層
22 ソース領域
23 ドレーン領域
25 多結晶シリコン薄膜
30 ゲート絶縁膜
40 ゲート電極
50 層間絶縁膜
52、53、72 接触孔
62 ソース電極
63 ドレーン電極
70 保護膜
80 画素電極
90 平坦化膜
111 スリットパターン
120 絶縁基板
130 非晶質シリコン層
131、134 液相領域
133、133’ 多結晶シリコン層
Claims (7)
- 非晶質シリコン薄膜を溶融させることができるエネルギーの光を照射して、スリットパターンの透過領域に前記光を局部的に通過させて非晶質シリコンを多結晶シリコンに結晶化するために使用する多結晶化用マスクであって、
前記スリットパターンの透過領域は、半透過膜からなる第1領域と、開口部からなる第2領域とを含み、前記第1及び第2領域は交互に配置されている多結晶化用マスク。 - 前記第1領域のスリットパターンと前記第2領域のスリットパターンとは、半ピッチずらして配置されている、請求項1に記載の多結晶化用マスク。
- 前記第1領域及び第2領域において、前記スリットパターンは二列に配列されている、請求項2に記載の多結晶化用マスク。
- 絶縁基板の上に非晶質シリコン薄膜を形成する段階と、
請求項1〜3のいずれかに記載の多結晶化用マスクを利用して、前記非晶質シリコン薄膜を溶融させることができるエネルギーの光を、前記半透過膜を通過させて局部的に照射して、前記非晶質シリコン膜中の水素を除去する段階と、
前記光を、前記開口部を通過させて局部的に照射して、前記水素を除去した非晶質シリコン薄膜を結晶化して多結晶シリコン薄膜を形成する段階と、
前記光を、前記半透過膜を通過させて局部的に照射して、前記多結晶シリコン膜の一部を溶融させることによって、前記多結晶シリコン膜表面に形成された突起を除去する段階と、
前記突起が除去された多結晶シリコン薄膜をパターニングして半導体層を形成する段階と、
前記半導体層を覆うゲート絶縁膜を形成する段階と、
前記半導体層の前記ゲート絶縁膜の上にゲート電極を形成する段階と、
前記半導体層に不純物を注入して前記ゲート電極を中心として両側にソース及びドレーン領域を形成する段階と、
前記ソース及びドレーン領域と各々電気的に連結されるソース及びドレーン電極を各々形成する段階と、を含む薄膜トランジスタの製造方法。 - 前記ドレーン電極を露出させる接触孔を有する保護膜を形成する段階と、
前記接触孔を通じて前記ドレーン電極と連結されている画素電極を形成する段階と、
をさらに含む、請求項4に記載の薄膜トランジスタの製造方法。 - 前記第1領域のスリットパターンと前記第2領域のスリットパターンとは、半ピッチずらして配置されている、請求項4に記載の薄膜トランジスタの製造方法。
- 前記第1領域及び第2領域において、前記スリットパターンは二列に配列されている、請求項6に記載の薄膜トランジスタの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020020056138A KR100878240B1 (ko) | 2002-09-16 | 2002-09-16 | 다결정용 마스크 및 이를 이용한 박막 트랜지스터의 제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2004111972A JP2004111972A (ja) | 2004-04-08 |
JP4536345B2 true JP4536345B2 (ja) | 2010-09-01 |
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JP2003323656A Expired - Fee Related JP4536345B2 (ja) | 2002-09-16 | 2003-09-16 | 多結晶化用マスク及びこれを利用した薄膜トランジスタの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7011911B2 (ja) |
JP (1) | JP4536345B2 (ja) |
KR (1) | KR100878240B1 (ja) |
CN (1) | CN100361271C (ja) |
TW (1) | TWI322446B (ja) |
Families Citing this family (19)
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US20040077605A1 (en) * | 2001-06-20 | 2004-04-22 | Salvati Mark E. | Fused heterocyclic succinimide compounds and analogs thereof, modulators of nuclear hormone receptor function |
JP2004265897A (ja) * | 2003-01-20 | 2004-09-24 | Sharp Corp | 結晶化半導体素子およびその製造方法ならびに結晶化装置 |
KR100956339B1 (ko) * | 2003-02-25 | 2010-05-06 | 삼성전자주식회사 | 규소 결정화 시스템 및 규소 결정화 방법 |
KR100997971B1 (ko) * | 2003-11-19 | 2010-12-02 | 삼성전자주식회사 | 결정화용 마스크, 이를 이용한 결정화 방법 및 이를포함하는 박막 트랜지스터 표시판의 제조 방법 |
KR100781440B1 (ko) * | 2004-07-20 | 2007-12-03 | 비오이 하이디스 테크놀로지 주식회사 | 다결정실리콘막 형성방법 |
KR101316633B1 (ko) * | 2004-07-28 | 2013-10-15 | 삼성디스플레이 주식회사 | 다결정 규소용 마스크 및 이의 제조방법과, 이를 이용한박막트랜지스터의 제조방법 |
TWI304897B (en) | 2004-11-15 | 2009-01-01 | Au Optronics Corp | Method of manufacturing a polysilicon layer and a mask used thereof |
CN100394548C (zh) * | 2004-11-25 | 2008-06-11 | 友达光电股份有限公司 | 制造多晶硅层的方法及其光罩 |
KR101167662B1 (ko) * | 2005-08-04 | 2012-07-23 | 삼성전자주식회사 | 순차 측면 고상화용 마스크 및 이의 제조 방법 |
TWI271451B (en) * | 2005-12-19 | 2007-01-21 | Ind Tech Res Inst | Method for forming poly-silicon film |
JP2007207896A (ja) * | 2006-01-31 | 2007-08-16 | Sharp Corp | レーザビーム投影マスクおよびそれを用いたレーザ加工方法、レーザ加工装置 |
US20080035548A1 (en) * | 2006-08-01 | 2008-02-14 | Quos, Inc. | Multi-functional filtration and ultra-pure water generator |
US8258441B2 (en) | 2006-05-09 | 2012-09-04 | Tsi Technologies Llc | Magnetic element temperature sensors |
US7794142B2 (en) * | 2006-05-09 | 2010-09-14 | Tsi Technologies Llc | Magnetic element temperature sensors |
US8192080B2 (en) * | 2007-01-23 | 2012-06-05 | Tsi Technologies Llc | Microwire-controlled autoclave and method |
KR101499232B1 (ko) * | 2008-04-10 | 2015-03-06 | 삼성디스플레이 주식회사 | 규소 결정화용 마스크 및 이를 이용한 다결정 규소 박막형성 방법과 박막 트랜지스터의 제조 방법 |
TWI339410B (en) * | 2008-07-09 | 2011-03-21 | Au Optronics Corp | Mask and fabricating method of a polysilicon layer using the same |
CN107861302B (zh) * | 2017-10-25 | 2020-06-23 | 上海中航光电子有限公司 | 一种阵列基板、其制作方法、显示面板及显示装置 |
CN108346562A (zh) * | 2018-03-12 | 2018-07-31 | 深圳市华星光电技术有限公司 | 低温多晶硅、薄膜晶体管及阵列基板的制作方法 |
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JP2004031809A (ja) * | 2002-06-27 | 2004-01-29 | Toshiba Corp | フォトマスク及び半導体薄膜の結晶化方法 |
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US5914202A (en) * | 1996-06-10 | 1999-06-22 | Sharp Microeletronics Technology, Inc. | Method for forming a multi-level reticle |
JP3363835B2 (ja) * | 1999-06-07 | 2003-01-08 | 住友重機械工業株式会社 | 戻り光除去方法と装置 |
JP2001230186A (ja) * | 2000-02-17 | 2001-08-24 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP4954401B2 (ja) * | 2000-08-11 | 2012-06-13 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
KR100400510B1 (ko) * | 2000-12-28 | 2003-10-08 | 엘지.필립스 엘시디 주식회사 | 실리콘 결정화 장치와 실리콘 결정화 방법 |
KR100478758B1 (ko) * | 2002-04-16 | 2005-03-24 | 엘지.필립스 엘시디 주식회사 | 실리콘 결정화방법 |
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- 2003-09-16 CN CNB031649831A patent/CN100361271C/zh not_active Expired - Lifetime
- 2003-09-16 TW TW092125505A patent/TWI322446B/zh not_active IP Right Cessation
- 2003-09-16 US US10/663,081 patent/US7011911B2/en not_active Expired - Lifetime
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JP2004031809A (ja) * | 2002-06-27 | 2004-01-29 | Toshiba Corp | フォトマスク及び半導体薄膜の結晶化方法 |
Also Published As
Publication number | Publication date |
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CN100361271C (zh) | 2008-01-09 |
KR20040024711A (ko) | 2004-03-22 |
CN1501437A (zh) | 2004-06-02 |
KR100878240B1 (ko) | 2009-01-13 |
US7011911B2 (en) | 2006-03-14 |
TW200425221A (en) | 2004-11-16 |
JP2004111972A (ja) | 2004-04-08 |
US20040106241A1 (en) | 2004-06-03 |
TWI322446B (en) | 2010-03-21 |
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