JP4524438B2 - 複数の被処理物を熱処理する装置及び方法 - Google Patents

複数の被処理物を熱処理する装置及び方法 Download PDF

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Publication number
JP4524438B2
JP4524438B2 JP2001531149A JP2001531149A JP4524438B2 JP 4524438 B2 JP4524438 B2 JP 4524438B2 JP 2001531149 A JP2001531149 A JP 2001531149A JP 2001531149 A JP2001531149 A JP 2001531149A JP 4524438 B2 JP4524438 B2 JP 4524438B2
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Prior art keywords
heat treatment
energy source
energy
chamber
gas
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Expired - Lifetime
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JP2001531149A
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Japanese (ja)
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JP2003524745A5 (enExample
JP2003524745A (ja
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プロープスト フォルカー
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Saint Gobain Glass France SAS
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Saint Gobain Glass France SAS
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/128—Annealing
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/74—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Heat Treatment Of Articles (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
JP2001531149A 1999-10-20 2000-10-20 複数の被処理物を熱処理する装置及び方法 Expired - Lifetime JP4524438B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19950498 1999-10-20
DE19950498.9 1999-10-20
PCT/DE2000/003720 WO2001029902A2 (de) 1999-10-20 2000-10-20 Vorrichtung und verfahren zum temperieren mehrerer prozessiergüter

Publications (3)

Publication Number Publication Date
JP2003524745A JP2003524745A (ja) 2003-08-19
JP2003524745A5 JP2003524745A5 (enExample) 2010-04-30
JP4524438B2 true JP4524438B2 (ja) 2010-08-18

Family

ID=7926265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001531149A Expired - Lifetime JP4524438B2 (ja) 1999-10-20 2000-10-20 複数の被処理物を熱処理する装置及び方法

Country Status (9)

Country Link
US (1) US6787485B1 (enExample)
EP (1) EP1277238B1 (enExample)
JP (1) JP4524438B2 (enExample)
CN (1) CN1309096C (enExample)
AT (1) ATE481741T1 (enExample)
AU (1) AU780287B2 (enExample)
DE (1) DE50015996D1 (enExample)
ES (1) ES2353106T3 (enExample)
WO (1) WO2001029902A2 (enExample)

Cited By (1)

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KR20230086427A (ko) * 2021-12-08 2023-06-15 주식회사 한화 복층식 열처리로

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US7442413B2 (en) * 2005-11-18 2008-10-28 Daystar Technologies, Inc. Methods and apparatus for treating a work piece with a vaporous element
DE102005062977B3 (de) 2005-12-28 2007-09-13 Sulfurcell Solartechnik Gmbh Verfahren und Vorrichtung zur Umsetzung metallischer Vorläuferschichten zu Chalkopyritschichten von CIGSS-solarzellen
EP2180534B1 (en) * 2008-10-27 2013-10-16 Corning Incorporated Energy conversion devices and methods
US20110203655A1 (en) * 2010-02-22 2011-08-25 First Solar, Inc. Photovoltaic device protection layer
CA2705650A1 (en) * 2010-05-27 2011-11-27 Pyromaitre Inc. Heat treatment furnace
KR101590684B1 (ko) * 2010-08-27 2016-02-01 쌩-고벵 글래스 프랑스 복수의 다층체를 열처리하기 위한 장치 및 방법
US20120264072A1 (en) * 2011-02-03 2012-10-18 Stion Corporation Method and apparatus for performing reactive thermal treatment of thin film pv material
ITRE20110055A1 (it) * 2011-07-25 2013-01-26 Keraglass Engineering S R L Forno per la ricottura di lastre di vetro
US10100402B2 (en) * 2011-10-07 2018-10-16 International Business Machines Corporation Substrate holder for graphene film synthesis
US20130344646A1 (en) * 2011-12-21 2013-12-26 Intermolecular, Inc. Absorbers for High-Efficiency Thin-Film PV
US11655515B2 (en) 2014-06-06 2023-05-23 Nippon Steel & Sumikin Texeng. Co., Ltd. Far-infrared radiation heating furnace for steel sheet for hot stamping
CN104810300A (zh) * 2015-03-31 2015-07-29 山西南烨立碁光电有限公司 新型Wafer Bonding设备
JP2017216397A (ja) * 2016-06-01 2017-12-07 株式会社アルバック アニール処理装置およびアニール処理方法
JP6673778B2 (ja) * 2016-08-02 2020-03-25 光洋サーモシステム株式会社 金属部品の製造方法、および、熱処理装置
EP3690962A1 (de) * 2019-01-31 2020-08-05 (CNBM) Bengbu Design & Research Institute for Glass Industry Co., Ltd. Anordnung, vorrichtung und verfahren zum wärmebehandeln eines mehrschichtkörpers
KR102766394B1 (ko) 2019-12-24 2025-02-11 삼성디스플레이 주식회사 유리 제품의 가공 장치, 유리 제품의 제조 방법, 유리 제품, 및 유리 제품을 포함하는 디스플레이 장치
US12080569B1 (en) 2022-06-23 2024-09-03 Cnbm Research Institute For Advanced Glass Materials Group Co., Ltd. Energy-saving heat treatment device for metal substrate in corrosive gas
DE102023117945A1 (de) * 2023-07-07 2025-01-09 Singulus Technologies Aktiengesellschaft Schleusenkammer

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JPS6022835B2 (ja) 1978-08-17 1985-06-04 株式会社村田製作所 圧電性磁器の製造方法
US5090898A (en) 1979-11-16 1992-02-25 Smith Thomas M Infra-red heating
US4368111A (en) * 1980-12-17 1983-01-11 Phillips Petroleum Company Oil recovery from tar sands
JPS57183041A (en) * 1981-05-06 1982-11-11 Nec Corp Annealing method for chemical semiconductor
JPS61129834A (ja) 1984-11-28 1986-06-17 Dainippon Screen Mfg Co Ltd 光照射型熱処理装置
US5011794A (en) * 1989-05-01 1991-04-30 At&T Bell Laboratories Procedure for rapid thermal annealing of implanted semiconductors
WO1994007269A1 (de) * 1992-09-22 1994-03-31 Siemens Aktiengesellschaft Schnelles verfahren zur erzeugung eines chalkopyrit-halbleiters auf einem substrat
JPH0778830A (ja) 1993-09-07 1995-03-20 Hitachi Ltd 半導体製造装置
JP2932918B2 (ja) 1993-12-22 1999-08-09 日本鋼管株式会社 α＋β型チタン合金押出材の製造方法
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JP3028467B2 (ja) * 1996-03-13 2000-04-04 日本無線株式会社 電磁加熱型活性化アニール装置
KR100377825B1 (ko) * 1996-10-09 2003-07-16 나가다 죠스게 반도체디바이스
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US6171982B1 (en) * 1997-12-26 2001-01-09 Canon Kabushiki Kaisha Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230086427A (ko) * 2021-12-08 2023-06-15 주식회사 한화 복층식 열처리로
KR102686945B1 (ko) 2021-12-08 2024-07-22 한화모멘텀 주식회사 복층식 열처리로

Also Published As

Publication number Publication date
CN1309096C (zh) 2007-04-04
AU780287B2 (en) 2005-03-10
US6787485B1 (en) 2004-09-07
EP1277238B1 (de) 2010-09-15
DE50015996D1 (de) 2010-10-28
WO2001029902A3 (de) 2002-11-07
WO2001029902A2 (de) 2001-04-26
AU2345001A (en) 2001-04-30
ATE481741T1 (de) 2010-10-15
JP2003524745A (ja) 2003-08-19
CN1411613A (zh) 2003-04-16
EP1277238A2 (de) 2003-01-22
ES2353106T3 (es) 2011-02-25

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