CN1309096C - 用于退火多种处理物的装置和方法 - Google Patents

用于退火多种处理物的装置和方法 Download PDF

Info

Publication number
CN1309096C
CN1309096C CNB008173818A CN00817381A CN1309096C CN 1309096 C CN1309096 C CN 1309096C CN B008173818 A CNB008173818 A CN B008173818A CN 00817381 A CN00817381 A CN 00817381A CN 1309096 C CN1309096 C CN 1309096C
Authority
CN
China
Prior art keywords
annealing
energy
tempering
treatment
energy source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB008173818A
Other languages
English (en)
Chinese (zh)
Other versions
CN1411613A (zh
Inventor
V·普罗布斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shell Renewable Energy Co Ltd
Original Assignee
Siemens and Shell Solar GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Shell Solar GmbH filed Critical Siemens and Shell Solar GmbH
Publication of CN1411613A publication Critical patent/CN1411613A/zh
Application granted granted Critical
Publication of CN1309096C publication Critical patent/CN1309096C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/128—Annealing
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/74—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Heat Treatment Of Articles (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
CNB008173818A 1999-10-20 2000-10-20 用于退火多种处理物的装置和方法 Expired - Lifetime CN1309096C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19950498 1999-10-20
DE19950498.9 1999-10-20

Publications (2)

Publication Number Publication Date
CN1411613A CN1411613A (zh) 2003-04-16
CN1309096C true CN1309096C (zh) 2007-04-04

Family

ID=7926265

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008173818A Expired - Lifetime CN1309096C (zh) 1999-10-20 2000-10-20 用于退火多种处理物的装置和方法

Country Status (9)

Country Link
US (1) US6787485B1 (enExample)
EP (1) EP1277238B1 (enExample)
JP (1) JP4524438B2 (enExample)
CN (1) CN1309096C (enExample)
AT (1) ATE481741T1 (enExample)
AU (1) AU780287B2 (enExample)
DE (1) DE50015996D1 (enExample)
ES (1) ES2353106T3 (enExample)
WO (1) WO2001029902A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7442413B2 (en) * 2005-11-18 2008-10-28 Daystar Technologies, Inc. Methods and apparatus for treating a work piece with a vaporous element
DE102005062977B3 (de) 2005-12-28 2007-09-13 Sulfurcell Solartechnik Gmbh Verfahren und Vorrichtung zur Umsetzung metallischer Vorläuferschichten zu Chalkopyritschichten von CIGSS-solarzellen
EP2180534B1 (en) * 2008-10-27 2013-10-16 Corning Incorporated Energy conversion devices and methods
US20110203655A1 (en) * 2010-02-22 2011-08-25 First Solar, Inc. Photovoltaic device protection layer
CA2705650A1 (en) * 2010-05-27 2011-11-27 Pyromaitre Inc. Heat treatment furnace
KR101590684B1 (ko) * 2010-08-27 2016-02-01 쌩-고벵 글래스 프랑스 복수의 다층체를 열처리하기 위한 장치 및 방법
US20120264072A1 (en) * 2011-02-03 2012-10-18 Stion Corporation Method and apparatus for performing reactive thermal treatment of thin film pv material
ITRE20110055A1 (it) * 2011-07-25 2013-01-26 Keraglass Engineering S R L Forno per la ricottura di lastre di vetro
US10100402B2 (en) * 2011-10-07 2018-10-16 International Business Machines Corporation Substrate holder for graphene film synthesis
US20130344646A1 (en) * 2011-12-21 2013-12-26 Intermolecular, Inc. Absorbers for High-Efficiency Thin-Film PV
US11655515B2 (en) 2014-06-06 2023-05-23 Nippon Steel & Sumikin Texeng. Co., Ltd. Far-infrared radiation heating furnace for steel sheet for hot stamping
CN104810300A (zh) * 2015-03-31 2015-07-29 山西南烨立碁光电有限公司 新型Wafer Bonding设备
JP2017216397A (ja) * 2016-06-01 2017-12-07 株式会社アルバック アニール処理装置およびアニール処理方法
JP6673778B2 (ja) * 2016-08-02 2020-03-25 光洋サーモシステム株式会社 金属部品の製造方法、および、熱処理装置
EP3690962A1 (de) * 2019-01-31 2020-08-05 (CNBM) Bengbu Design & Research Institute for Glass Industry Co., Ltd. Anordnung, vorrichtung und verfahren zum wärmebehandeln eines mehrschichtkörpers
KR102766394B1 (ko) 2019-12-24 2025-02-11 삼성디스플레이 주식회사 유리 제품의 가공 장치, 유리 제품의 제조 방법, 유리 제품, 및 유리 제품을 포함하는 디스플레이 장치
KR102686945B1 (ko) * 2021-12-08 2024-07-22 한화모멘텀 주식회사 복층식 열처리로
US12080569B1 (en) 2022-06-23 2024-09-03 Cnbm Research Institute For Advanced Glass Materials Group Co., Ltd. Energy-saving heat treatment device for metal substrate in corrosive gas
DE102023117945A1 (de) * 2023-07-07 2025-01-09 Singulus Technologies Aktiengesellschaft Schleusenkammer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246277A (ja) * 1996-03-13 1997-09-19 Japan Radio Co Ltd 電磁加熱型活性化アニール装置
US5871688A (en) * 1997-08-06 1999-02-16 North American Manufacturing Company Multi-stack annealer
CN1224924A (zh) * 1997-12-26 1999-08-04 佳能株式会社 热处理soi衬底的方法和设备及利用其制备soi衬底的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022835B2 (ja) 1978-08-17 1985-06-04 株式会社村田製作所 圧電性磁器の製造方法
US5090898A (en) 1979-11-16 1992-02-25 Smith Thomas M Infra-red heating
US4368111A (en) * 1980-12-17 1983-01-11 Phillips Petroleum Company Oil recovery from tar sands
JPS57183041A (en) * 1981-05-06 1982-11-11 Nec Corp Annealing method for chemical semiconductor
JPS61129834A (ja) 1984-11-28 1986-06-17 Dainippon Screen Mfg Co Ltd 光照射型熱処理装置
US5011794A (en) * 1989-05-01 1991-04-30 At&T Bell Laboratories Procedure for rapid thermal annealing of implanted semiconductors
WO1994007269A1 (de) * 1992-09-22 1994-03-31 Siemens Aktiengesellschaft Schnelles verfahren zur erzeugung eines chalkopyrit-halbleiters auf einem substrat
JPH0778830A (ja) 1993-09-07 1995-03-20 Hitachi Ltd 半導体製造装置
JP2932918B2 (ja) 1993-12-22 1999-08-09 日本鋼管株式会社 α＋β型チタン合金押出材の製造方法
DE4413215C2 (de) * 1994-04-15 1996-03-14 Siemens Solar Gmbh Solarmodul mit Dünnschichtaufbau und Verfahren zu seiner Herstellung
JP2875768B2 (ja) 1994-11-30 1999-03-31 新日本無線株式会社 半導体基板の熱処理方法
US5861609A (en) 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US5851929A (en) * 1996-01-04 1998-12-22 Micron Technology, Inc. Controlling semiconductor structural warpage in rapid thermal processing by selective and dynamic control of a heating source
KR100377825B1 (ko) * 1996-10-09 2003-07-16 나가다 죠스게 반도체디바이스
US6171982B1 (en) * 1997-12-26 2001-01-09 Canon Kabushiki Kaisha Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same
US6127202A (en) * 1998-07-02 2000-10-03 International Solar Electronic Technology, Inc. Oxide-based method of making compound semiconductor films and making related electronic devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246277A (ja) * 1996-03-13 1997-09-19 Japan Radio Co Ltd 電磁加熱型活性化アニール装置
US5871688A (en) * 1997-08-06 1999-02-16 North American Manufacturing Company Multi-stack annealer
CN1224924A (zh) * 1997-12-26 1999-08-04 佳能株式会社 热处理soi衬底的方法和设备及利用其制备soi衬底的方法

Also Published As

Publication number Publication date
JP4524438B2 (ja) 2010-08-18
AU780287B2 (en) 2005-03-10
US6787485B1 (en) 2004-09-07
EP1277238B1 (de) 2010-09-15
DE50015996D1 (de) 2010-10-28
WO2001029902A3 (de) 2002-11-07
WO2001029902A2 (de) 2001-04-26
AU2345001A (en) 2001-04-30
ATE481741T1 (de) 2010-10-15
JP2003524745A (ja) 2003-08-19
CN1411613A (zh) 2003-04-16
EP1277238A2 (de) 2003-01-22
ES2353106T3 (es) 2011-02-25

Similar Documents

Publication Publication Date Title
CN1309096C (zh) 用于退火多种处理物的装置和方法
CN1263166C (zh) 多层物体退火处理的装置和方法
CN1187842C (zh) 恒温处理至少一种处理物体的装置和方法
US8137465B1 (en) Single-chamber sequential curing of semiconductor wafers
KR101590684B1 (ko) 복수의 다층체를 열처리하기 위한 장치 및 방법
CN1854839A (zh) 负载锁定装置及处理方法
CN1507648A (zh) 用于集成电路的快速热处理系统
CN1547757A (zh) 快速热处理的快速环境转换系统和方法
KR20120054636A (ko) 열처리장치
KR101943181B1 (ko) 기판 온도 조절 장치 및 기판 처리 장치
KR20150031182A (ko) 기판 온도 조절 장치 및 그것을 사용한 기판 처리 장치
KR20100138984A (ko) 열처리 장치
KR101500820B1 (ko) 다층체의 가공을 위한 장치, 시스템 및 방법
JP2013520790A (ja) 縮小チャンバ空間を形成する装置、および多層体を位置決めする方法
CN1833312A (zh) 放置台结构以及具有该放置台结构的热处理装置
US20120258018A1 (en) Substrate processing apparatus, and transport device
KR101720884B1 (ko) 열 공정에서의 유리 휨의 회피
CN101822122A (zh) 用于辐射单元的装置
JPH09199477A (ja) プロセスチャンバウィンドウ
CN1496585A (zh) 基板的处理方法和基板的处理装置
KR20140085584A (ko) 기판 처리 장치 및 그것을 이용한 기판 처리 방법
JP2000058534A (ja) 基板熱処理装置
JP5235934B2 (ja) 半導体製造装置及び半導体装置の製造方法
CN1878889A (zh) 具有交叉流衬套的热处理系统

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SHELL YANGGUANG CO., LTD.

Free format text: FORMER OWNER: SIEMENS AG

Effective date: 20040917

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20040917

Address after: Munich, Germany

Applicant after: Siemens Und Shell Solar GmbH

Address before: Munich, Germany

Applicant before: Siemens AG

C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SHELL RENEWABLE SOURCES CO., LTD.

Free format text: FORMER OWNER: SHELL YANGGUANG CO., LTD.

Effective date: 20080215

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20080215

Address after: hamburg

Patentee after: Shell Renewable Energy Co Ltd

Address before: Munich, Germany

Patentee before: Siemens Und Shell Solar GmbH

CX01 Expiry of patent term

Granted publication date: 20070404

CX01 Expiry of patent term