JP4511401B2 - フレキシブルプリント基板およびその製造方法 - Google Patents
フレキシブルプリント基板およびその製造方法 Download PDFInfo
- Publication number
- JP4511401B2 JP4511401B2 JP2005095944A JP2005095944A JP4511401B2 JP 4511401 B2 JP4511401 B2 JP 4511401B2 JP 2005095944 A JP2005095944 A JP 2005095944A JP 2005095944 A JP2005095944 A JP 2005095944A JP 4511401 B2 JP4511401 B2 JP 4511401B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed circuit
- circuit board
- reinforcing plate
- glass fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 32
- 239000003365 glass fiber Substances 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 14
- 239000002759 woven fabric Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005095944A JP4511401B2 (ja) | 2005-03-29 | 2005-03-29 | フレキシブルプリント基板およびその製造方法 |
TW094139925A TW200635450A (en) | 2005-03-29 | 2005-11-14 | Flexible printed circuit board and manufacture method thereof |
CN200510137590A CN100581316C (zh) | 2005-03-29 | 2005-12-30 | 柔性印制电路板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005095944A JP4511401B2 (ja) | 2005-03-29 | 2005-03-29 | フレキシブルプリント基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006278747A JP2006278747A (ja) | 2006-10-12 |
JP4511401B2 true JP4511401B2 (ja) | 2010-07-28 |
Family
ID=37031043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005095944A Active JP4511401B2 (ja) | 2005-03-29 | 2005-03-29 | フレキシブルプリント基板およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4511401B2 (zh) |
CN (1) | CN100581316C (zh) |
TW (1) | TW200635450A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4766331B2 (ja) * | 2006-11-27 | 2011-09-07 | 株式会社ジェイテクト | 一方向クラッチ |
JP4874818B2 (ja) * | 2007-01-19 | 2012-02-15 | 日本メクトロン株式会社 | フレキシブルプリント配線板 |
JP5115116B2 (ja) * | 2007-09-28 | 2013-01-09 | カシオ計算機株式会社 | フレキシブル配線基板 |
JP4538069B2 (ja) | 2008-11-28 | 2010-09-08 | 株式会社東芝 | プリント配線板 |
JP5649439B2 (ja) * | 2010-12-27 | 2015-01-07 | 京セラ株式会社 | サーマルヘッド |
CN102528551B (zh) * | 2011-12-28 | 2013-09-18 | 黄山皖南机床有限公司 | 一种铣床冷却液回流系统 |
CN105578713B (zh) * | 2015-12-11 | 2018-05-15 | 苏州中拓专利运营管理有限公司 | 一种带孔补强片载板的制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0577361A (ja) * | 1991-09-20 | 1993-03-30 | Shin Kobe Electric Mach Co Ltd | 積層板用ガラス繊維不織布および積層板 |
JPH10126015A (ja) * | 1996-10-18 | 1998-05-15 | Nec Home Electron Ltd | プリント基板 |
JP2003238709A (ja) * | 2002-02-22 | 2003-08-27 | Risho Kogyo Co Ltd | フレキシブルプリント配線板用補強材 |
-
2005
- 2005-03-29 JP JP2005095944A patent/JP4511401B2/ja active Active
- 2005-11-14 TW TW094139925A patent/TW200635450A/zh unknown
- 2005-12-30 CN CN200510137590A patent/CN100581316C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0577361A (ja) * | 1991-09-20 | 1993-03-30 | Shin Kobe Electric Mach Co Ltd | 積層板用ガラス繊維不織布および積層板 |
JPH10126015A (ja) * | 1996-10-18 | 1998-05-15 | Nec Home Electron Ltd | プリント基板 |
JP2003238709A (ja) * | 2002-02-22 | 2003-08-27 | Risho Kogyo Co Ltd | フレキシブルプリント配線板用補強材 |
Also Published As
Publication number | Publication date |
---|---|
JP2006278747A (ja) | 2006-10-12 |
CN100581316C (zh) | 2010-01-13 |
TW200635450A (en) | 2006-10-01 |
CN1842247A (zh) | 2006-10-04 |
TWI345934B (zh) | 2011-07-21 |
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