JP4511401B2 - Flexible printed circuit board and manufacturing method thereof - Google Patents
Flexible printed circuit board and manufacturing method thereof Download PDFInfo
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- JP4511401B2 JP4511401B2 JP2005095944A JP2005095944A JP4511401B2 JP 4511401 B2 JP4511401 B2 JP 4511401B2 JP 2005095944 A JP2005095944 A JP 2005095944A JP 2005095944 A JP2005095944 A JP 2005095944A JP 4511401 B2 JP4511401 B2 JP 4511401B2
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- flexible printed
- printed circuit
- circuit board
- reinforcing plate
- glass fiber
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 32
- 239000003365 glass fiber Substances 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 14
- 239000002759 woven fabric Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Description
本発明は、フレキシブルプリント基板およびその製造方法に係り、とくに基板の一部を補強する構造およびその製造方法に関する。 The present invention relates to a flexible printed circuit board and a manufacturing method thereof, and more particularly to a structure for reinforcing a part of a board and a manufacturing method thereof.
フレキシブルプリント基板は、その柔軟性を利用した用途が広がっている。一方、フレキシブルプリント基板に部品を搭載したり、コネクタに接続するには、機械的強度を持たせるために何らかの補強、一般には補強板の積層を行なっている（非特許文献１、特許文献１ないし４）。 The use of the flexible printed circuit board is expanding. On the other hand, in order to mount a component on a flexible printed circuit board or connect to a connector, some reinforcement, generally a lamination of a reinforcing plate, is performed to provide mechanical strength (Non-patent Document 1, Patent Document 1 to 4).
この補強板は、厚さ０．１ないし２．０ｍｍ程度の絶縁硬質シート材を所定形状に加工し、フレキシブルプリント基板の少なくとも片面に、接着剤で積層する。材料として用い得るものは数種類あるが、耐熱性、反り特性に優れている点で、ガラス織布を基材とするエポキシ樹脂積層板が汎用されている。
上述のように、ガラス織布を基材とするエポキシ樹脂積層板は、優れた特性を有するものではある。 As described above, an epoxy resin laminate having a glass woven fabric as a base material has excellent characteristics.
しかしながら、ガラス織布を基材とするエポキシ樹脂積層板は、フレキシブルプリント基板と熱膨張係数が異なるため、部品実装後のリフロー半田処理をする際に反りを生じる問題がある。 However, the epoxy resin laminate based on a glass woven fabric has a problem of causing warpage when performing reflow soldering after component mounting because the thermal expansion coefficient is different from that of a flexible printed circuit board.
リフロー後に冷却すると、反りは元に戻るが、部品実装され半田付けされた箇所は反りが戻らず、反ったまま固定されて実装部品が浮いたり、部品と基板との間に隙間ができて半田付けができなかったりする。これも、補強板の寸法が小さい場合は影響が少ないが、長さが１５ｍｍを超えると大きな問題となる。
本発明は、上述の点を考慮してなされたもので、補強板の熱による反りを極力抑えた補強板付きフレキシブルプリント基板およびその製造方法を提供することを目的とする。
When cooling after reflow, the warpage returns to its original state, but the warped part that has been mounted and soldered does not return the warp. I can't put it on. This is also less affected when the size of the reinforcing plate is small, but becomes a major problem when the length exceeds 15 mm.
The present invention has been made in consideration of the above-described points, and an object of the present invention is to provide a flexible printed board with a reinforcing plate that suppresses warping of the reinforcing plate due to heat as much as possible, and a method for manufacturing the same.
上記目的達成のため、本発明では、
部分的に補強板が裏打ちされたフレキシブルプリント基板において、
前記補強板は、経緯方向にガラス繊維が配されてなるガラス織布で強化された樹脂積層板として形成され、前記ガラス繊維の長さが１５ｍｍ以下になるように前記ガラス繊維を切断するための加工穴が配されている
ことを特徴とするフレキシブルプリント基板、
および
経緯各方向に配されたガラス繊維で構成されるガラス織布で強化された樹脂積層板によって部分的に裏打ち補強されたフレキシブルプリント基板の製造方法において、
前記補強板における、部品搭載端子近傍を除く部分に前記ガラス繊維の長さが１５ｍｍ以下となるような間隔で前記ガラス繊維を切断するための加工穴を前記補強板の板面に均等に設け、
前記フレキシブルプリント基板の一部に前記補強板を積層した、
ことを特徴とするフレキシブルプリント基板の製造方法、
を提供するものである。
In order to achieve the above object, in the present invention,
In a flexible printed circuit board partially backed with a reinforcing plate,
The reinforcing plate is formed as a resin laminate glass fiber reinforced with woven glass cloth is formed by arranged in background direction, the glass fiber length for cutting the glass fiber so as to 15mm or less Flexible printed circuit board, characterized by the fact that processed holes are arranged ,
and
In a method for producing a flexible printed circuit board partially reinforced by a resin laminate reinforced with a glass woven fabric composed of glass fibers arranged in each direction ,
In the reinforcing plate, in the portion excluding the vicinity of the component mounting terminal, a processing hole for cutting the glass fiber at an interval such that the length of the glass fiber is 15 mm or less is evenly provided on the plate surface of the reinforcing plate ,
The reinforcing plate is laminated on a part of the flexible printed circuit board.
A method for producing a flexible printed circuit board,
Is to provide.
本発明は上述のように、フレキシブルプリント基板に設けられる補強板のガラス繊維を長さ１５ｍｍ以下にしたため、ガラス繊維の熱膨張係数の影響による対歪応力を緩和して反りおよび捩れを抑制し、かつ適切に補強されたフレキシブルプリント基板を提供することができる。 As described above, since the glass fiber of the reinforcing plate provided on the flexible printed circuit board has a length of 15 mm or less, the present invention relieves the strain stress due to the influence of the thermal expansion coefficient of the glass fiber and suppresses warping and twisting. And the flexible printed circuit board appropriately reinforced can be provided.
また、フレキシブルプリント基板の製造に当たって穴開けした補強板をフレキシブルプリント基板に積層することにより、反り、捩れの少ないプレキシブルプリント基板を能率よく提供することができる。 In addition, by stacking a reinforcing plate that has been perforated in manufacturing a flexible printed circuit board on the flexible printed circuit board, it is possible to efficiently provide a flexible printed circuit board that is less warped and twisted.
以下、添付図面を参照して本発明の実施形態を説明する。 Embodiments of the present invention will be described below with reference to the accompanying drawings.
図１は、本発明の実施形態１を示したものである。この場合、フレキシブルプリント基板ａのコネクタ接続部分を裏打ち補強する例を示している。フレキシブルプリント基板ａの端部に形成されたコネクタ接続用配線パターンを、補強板ｂにより裏打ちする。補強板ｂには、所定間隔で均等に加工穴ｃが開けてある。この結果、補強板ｂに内包されたガラス繊維は、加工穴ｃによって適宜間隔毎に切断されている。 FIG. 1 shows Embodiment 1 of the present invention. In this case, an example is shown in which the connector connecting portion of the flexible printed circuit board a is backed and reinforced. The connector connection wiring pattern formed at the end of the flexible printed circuit board a is backed by a reinforcing plate b. In the reinforcing plate b, processing holes c are evenly formed at predetermined intervals. As a result, the glass fibers contained in the reinforcing plate b are cut at appropriate intervals by the processing holes c.
ガラス繊維は、樹脂と固着されているから、補強板の強度は十分に高く保たれているが、ガラス繊維1束ずつが１５ｍｍ以下の長さであるから、樹脂と固着された範囲が１５ｍｍ以内に限定され、それ以上に及ぶことはない。このため、ガラス繊維と樹脂との熱膨張係数の違いによる伸縮度合いの違いは、１５ｍｍ以下の範囲に留まる。したがって、ガラス繊維と樹脂との熱膨張係数の違いによって生じる補強板の反りは、限定されたものとなる。 Since the glass fiber is fixed to the resin, the strength of the reinforcing plate is kept sufficiently high. However, since each glass fiber bundle has a length of 15 mm or less, the range fixed to the resin is within 15 mm. But not more than that. For this reason, the difference of the expansion-contraction degree by the difference in the thermal expansion coefficient of glass fiber and resin remains in the range of 15 mm or less. Therefore, the warp of the reinforcing plate caused by the difference in thermal expansion coefficient between the glass fiber and the resin is limited.
図２は、ガラス織布ｄに加工穴ｈを開けた状態を示している。加工は、ドリル、ルータ、プレス等の一般的な穴開け加工法による。ガラス織布ｄの寸法は、この場合２ｍｍ×２ｍｍ程度とし、加工穴ｅを１ｍｍとした。そして、ガラス織布は、経緯各方向のガラス繊維束が加工穴１つで3束ずつ切断されている。 FIG. 2 shows a state in which a processing hole h is opened in the glass woven fabric d. Processing is performed by a general drilling method such as a drill, a router, or a press. In this case, the size of the glass woven fabric d was about 2 mm × 2 mm, and the processing hole e was 1 mm. In the glass woven fabric, three bundles of glass fiber bundles in each direction are cut at one processing hole.
このような加工穴ｅをガラス織布全体に適宜間隔で均等に分散配置すれば、ガラス繊維ｄは所定長以下の長さとなる。加工穴ｅの間隔を１５ｍｍとすれば、ガラス繊維ｄの最大長を１５ｍｍ以下にすることができる。 If such processed holes e are evenly distributed at appropriate intervals over the entire glass woven fabric, the glass fiber d has a length equal to or less than a predetermined length. If the interval between the processing holes e is 15 mm, the maximum length of the glass fiber d can be 15 mm or less.
そして、ガラス繊維ｄとその周囲の樹脂との熱膨張係数の違いによるストレスは、ガラス繊維ｄの長さの範囲内で生じるものであるから、限定的なものとなる。 The stress due to the difference in coefficient of thermal expansion between the glass fiber d and the surrounding resin is generated within the range of the length of the glass fiber d, and thus is limited.
図３は、補強板ｂにおける加工穴ｃの穴数を最少にした場合の分布状況を示したものである。この場合、補強板は１５ｍｍ×１５ｍｍであり、１マスが１ｍｍ×１ｍｍで表されている。 FIG. 3 shows a distribution state when the number of processed holes c in the reinforcing plate b is minimized. In this case, the reinforcing plate is 15 mm × 15 mm, and one square is represented by 1 mm × 1 mm.
そして、縦方向、横方向ともに1つずつの加工穴ｃを開け、しかも補強板全体の穴開け加工数が最も少なくなるように、加工穴ｃの位置を分散配置している。図示の場合、加工穴ｃの数は、２２５マスにつき１６個であるが、補強板の強度に支障がなければ、図3に示した例よりも多数の加工穴ｃを開口してもよい。 Then, the processing holes c are arranged in a distributed manner so that one processing hole c is formed in each of the vertical direction and the horizontal direction, and the number of drilling processes in the entire reinforcing plate is minimized. In the illustrated case, the number of processed holes c is 16 per 225 squares, but more processed holes c may be opened than in the example shown in FIG. 3 as long as the strength of the reinforcing plate is not affected.
なお、この加工穴ｃは、フレキシブルプリント基板の部品搭載位置、とくに部品接続端子から１ｍｍ以内の位置は避けるようにして、端子への半田付け不良が生じないようにする。 In addition, this processed hole c avoids the solder mounting to a terminal by avoiding the component mounting position of the flexible printed circuit board, especially the position within 1 mm from the component connection terminal.
（実施例）
厚み０．２ｍｍで３５ｍｍ×３５ｍｍのガラス織布を基材とするエポキシ樹脂積層板に、径１．０ｍｍの加工穴ｃを、図３に示した最も穴数の少ないパターンにしたがい分散させて穴開け加工し、補強板とした。
(Example)
An epoxy resin laminate having a thickness of 0.2 mm and a glass woven fabric of 35 mm × 35 mm as a base material is dispersed with holes 1.0 c in diameter according to the pattern having the smallest number of holes shown in FIG. Opened to make a reinforcing plate.
この補強板を、積層接着剤を用いてフレキシブルプリント基板に、圧力２．０ＭＰａ、温度１７０℃で５分間圧着して、補強板付きフレキシブルプリント基板を形成した。 This reinforcing plate was pressure-bonded to the flexible printed board using a laminating adhesive at a pressure of 2.0 MPa and a temperature of 170 ° C. for 5 minutes to form a flexible printed board with a reinforcing plate.
（比較例）
実施例と同じ寸法のガラス織布を基材とするエポキシ樹脂積層板に、穴加工なしのままフレキシブルプリント基板に積層接着剤を介し、圧力２．０ＭＰａ、温度１７０℃で５分間圧着して補強板付きフレキシブルプリント基板を作成した。
(Comparative example)
Reinforced with epoxy resin laminated board based on glass woven fabric of the same dimensions as in the Examples, with a pressure-sensitive adhesive pressure of 2.0 MPa and a temperature of 170 ° C. for 5 minutes via a laminated adhesive without drilling. A flexible printed circuit board with a plate was prepared.
（実施例と比較例との対比）
図４は、実施例と比較例とを加熱して熱膨張係数の影響を調べる加熱方式を示したものである。実施例としてのサンプルおよび比較例としてもサンプル３０個ずつを、図４に示すように、補強板付きフレキシブルプリント基板ｆをホットプレートｇ上に載置して、その反り量ｈがどのようなものかを測定した。その結果、比較例では、最大２．０ｍｍ、平均値０．５ｍｍであったが、実施例では最大０．８ｍｍ、平均値０．２ｍｍであった。
(Contrast between Example and Comparative Example)
FIG. 4 shows a heating method for examining the influence of the thermal expansion coefficient by heating the example and the comparative example. As shown in FIG. 4, 30 samples as examples and comparative examples as examples are placed on a hot plate g with a flexible printed board f with a reinforcing plate, and the amount of warpage h is whatever. Was measured. As a result, in the comparative example, the maximum was 2.0 mm and the average value was 0.5 mm, but in the example, the maximum was 0.8 mm and the average value was 0.2 mm.
これにより、本発明に係る補強板付きフレキシブルプリント基板は、ガラス繊維と樹脂との熱膨張係数の違いによる影響が大幅に緩和されていることが確認された。 Thereby, it was confirmed that the influence by the difference in the thermal expansion coefficient of glass fiber and resin is relieve | moderated significantly by the flexible printed circuit board with a reinforcement board which concerns on this invention.
ａ フレキシブルプリント基板
ｂ 補強板
ｃ 加工穴
ｄ ガラス繊維
ｅ 加工穴
ｆ 補強板付きフレキシブルプリント基板
ｇ ホットプレート
ｈ 反り量
a Flexible printed circuit board b Reinforcement plate c Processing hole
d glass fiber
e Processing hole f Flexible printed circuit board with reinforcing plate g Hot plate h Warpage
Claims (3)
前記補強板は、経緯方向にガラス繊維が配されてなるガラス織布で強化された樹脂積層板として形成され、前記ガラス繊維の長さが１５ｍｍ以下になるように前記ガラス繊維を切断するための加工穴が配されている
ことを特徴とするフレキシブルプリント基板。 In a flexible printed circuit board partially backed with a reinforcing plate,
The reinforcing plate may be formed as a resin laminate glass fiber reinforced with woven glass cloth is formed by arranged in background direction, the glass fiber length for cutting the glass fiber so as to 15mm or less A flexible printed circuit board, which is provided with machined holes .
前記補強板は、前記ガラス織布を基材とするエポキシ樹脂積層板である
ことを特徴とするフレキシブルプリント基板。 The flexible printed circuit board according to claim 1,
The said reinforcement board is an epoxy resin laminated board which uses the said glass woven fabric as a base material. The flexible printed circuit board characterized by the above-mentioned .
前記補強板における、部品搭載端子近傍を除く部分に前記ガラス繊維の長さが１５ｍｍ以下となるような間隔で前記ガラス繊維を切断するための加工穴を前記補強板の板面に均等に設け、
前記フレキシブルプリント基板の一部に前記補強板を積層した、
ことを特徴とするフレキシブルプリント基板の製造方法。 In a method for producing a flexible printed circuit board partially reinforced by a resin laminate reinforced with a glass woven fabric composed of glass fibers arranged in each direction ,
In the reinforcing plate, in the portion excluding the vicinity of the component mounting terminal, a processing hole for cutting the glass fiber at an interval such that the length of the glass fiber is 15 mm or less is evenly provided on the plate surface of the reinforcing plate ,
The reinforcing plate is laminated on a part of the flexible printed circuit board.
A method for producing a flexible printed circuit board.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005095944A JP4511401B2 (en) | 2005-03-29 | 2005-03-29 | Flexible printed circuit board and manufacturing method thereof |
| TW094139925A TW200635450A (en) | 2005-03-29 | 2005-11-14 | Flexible printed circuit board and manufacture method thereof |
| CN200510137590A CN100581316C (en) | 2005-03-29 | 2005-12-30 | Flexible printed circuit board and method for fabricating same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005095944A JP4511401B2 (en) | 2005-03-29 | 2005-03-29 | Flexible printed circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006278747A JP2006278747A (en) | 2006-10-12 |
| JP4511401B2 true JP4511401B2 (en) | 2010-07-28 |
Family
ID=37031043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005095944A Active JP4511401B2 (en) | 2005-03-29 | 2005-03-29 | Flexible printed circuit board and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4511401B2 (en) |
| CN (1) | CN100581316C (en) |
| TW (1) | TW200635450A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4766331B2 (en) * | 2006-11-27 | 2011-09-07 | 株式会社ジェイテクト | One-way clutch |
| JP4874818B2 (en) * | 2007-01-19 | 2012-02-15 | 日本メクトロン株式会社 | Flexible printed wiring board |
| JP5115116B2 (en) * | 2007-09-28 | 2013-01-09 | カシオ計算機株式会社 | Flexible wiring board |
| JP4538069B2 (en) | 2008-11-28 | 2010-09-08 | 株式会社東芝 | Printed wiring board |
| JP5649439B2 (en) * | 2010-12-27 | 2015-01-07 | 京セラ株式会社 | Thermal head |
| CN102528551B (en) * | 2011-12-28 | 2013-09-18 | 黄山皖南机床有限公司 | Cooling liquid refluxing system for milling machine |
| CN105578713B (en) * | 2015-12-11 | 2018-05-15 | 苏州中拓专利运营管理有限公司 | A kind of production method of reinforcing chip support plate with holes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0577361A (en) * | 1991-09-20 | 1993-03-30 | Shin Kobe Electric Mach Co Ltd | Laminated sheet and glass fiber nonwoven fabric therefor |
| JPH10126015A (en) * | 1996-10-18 | 1998-05-15 | Nec Home Electron Ltd | Printed board |
| JP2003238709A (en) * | 2002-02-22 | 2003-08-27 | Risho Kogyo Co Ltd | Reinforcing material for flexible printed wiring board |
-
2005
- 2005-03-29 JP JP2005095944A patent/JP4511401B2/en active Active
- 2005-11-14 TW TW094139925A patent/TW200635450A/en unknown
- 2005-12-30 CN CN200510137590A patent/CN100581316C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0577361A (en) * | 1991-09-20 | 1993-03-30 | Shin Kobe Electric Mach Co Ltd | Laminated sheet and glass fiber nonwoven fabric therefor |
| JPH10126015A (en) * | 1996-10-18 | 1998-05-15 | Nec Home Electron Ltd | Printed board |
| JP2003238709A (en) * | 2002-02-22 | 2003-08-27 | Risho Kogyo Co Ltd | Reinforcing material for flexible printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100581316C (en) | 2010-01-13 |
| TWI345934B (en) | 2011-07-21 |
| JP2006278747A (en) | 2006-10-12 |
| CN1842247A (en) | 2006-10-04 |
| TW200635450A (en) | 2006-10-01 |
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