JP2003238709A - Reinforcing material for flexible printed wiring board - Google Patents
Reinforcing material for flexible printed wiring boardInfo
- Publication number
- JP2003238709A JP2003238709A JP2002046554A JP2002046554A JP2003238709A JP 2003238709 A JP2003238709 A JP 2003238709A JP 2002046554 A JP2002046554 A JP 2002046554A JP 2002046554 A JP2002046554 A JP 2002046554A JP 2003238709 A JP2003238709 A JP 2003238709A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- reinforcing material
- prepreg
- printed wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子機器に用い
られるフレキシブルプリント配線板の補強材、即ち、電
子機器への実装性の向上及び電子機器搭載後における機
器動作の信頼性を得るための、フレキシブルプリント配
線板に張り合わせる補強材に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reinforcing material for a flexible printed wiring board used in electronic equipment, that is, for improving mountability in electronic equipment and obtaining reliability of equipment operation after mounting the electronic equipment. The present invention relates to a reinforcing material attached to a flexible printed wiring board.
【０００２】[0002]
【従来の技術】この種の補強材は、厚さ０．１ｍｍ〜２
ｍｍ厚程度の補強効果のあるシート材を打抜き金型によ
り、所定の形状に打抜き加工し、フレキシブルプリント
配線板の少なくとも片面に接着剤等で張り合わせて使用
される。2. Description of the Related Art This type of reinforcing material has a thickness of 0.1 mm to 2 mm.
A sheet material having a reinforcing effect of about mm mm is punched into a predetermined shape by a punching die, and is bonded to at least one surface of a flexible printed wiring board with an adhesive or the like for use.
【０００３】従来、この補強材には電気絶縁用積層板を
打抜き加工したものが用いられている。この積層板は、
熱硬化性樹脂を含浸乾燥したシート状プリプレグを加熱
加圧成形したものである。例えば、ＪＩＳ Ｋ ６９１
２に記載されている、紙基材フェノール樹脂積層板、綿
布基材フェノール樹脂積層板、ガラス織布基材エポキシ
樹脂積層板、ガラスマット基材不飽和ポリエステル樹脂
積層板などが使用されている。Conventionally, a punched product of an electrically insulating laminated plate has been used as the reinforcing material. This laminate is
A sheet-shaped prepreg impregnated with a thermosetting resin and dried is heat-press molded. For example, JIS K 691
The paper-based phenolic resin laminate, cotton cloth-based phenolic resin laminate, glass woven fabric-based epoxy resin laminate, glass mat-based unsaturated polyester resin laminate described in 2 are used.
【０００４】これらの中でも耐熱性に優れ、そり特性の
優れたガラス織布を基材とするエポキシ樹脂積層板が、
補強材としては多用されている。Among these, an epoxy resin laminate having a glass woven fabric as a base material, which has excellent heat resistance and excellent warpage characteristics, is
It is often used as a reinforcing material.
【０００５】[0005]
【発明が解決しようとする課題】ところで、補強材に要
求される特性は、半田リフロー工程に耐え得る高度な耐
熱性、適度な機械的強度（剛性）、そり特性である。そ
の他、厚さ精度、難燃性などである。By the way, the properties required for the reinforcing material are high heat resistance capable of withstanding the solder reflow process, appropriate mechanical strength (rigidity), and warpage properties. Others include thickness accuracy and flame retardancy.
【０００６】近年、フレキシブルプリント配線板が用い
られる電子機器の高機能化や小型化により、補強材の打
抜き加工断面からの粉落ちによる電子部品の実装不良や
電子機器の動作不良の改善が課題となっている。このた
め、打抜き加工後に補強材をエアーブローや水洗等によ
り、打抜き粉の除去作業を行なっているが、付着した打
抜き粉を除去することは可能であるが、打抜断面の表面
部分に露出するガラス繊維のヒゲ状の繊維は除去できな
い。このため、打抜き加工後の加工断面からの粉落ち要
素の少ない補強材が求められている。[0006] In recent years, due to the higher functionality and smaller size of electronic equipment using a flexible printed wiring board, improvement of electronic component mounting failure and electronic equipment operation failure due to powder falling from the stamped cross section of the reinforcing material has been a problem. Has become. For this reason, after the punching process, the reinforcing material is subjected to the work of removing the punching powder by air blowing, washing with water, or the like. Although it is possible to remove the stuck punching powder, it is exposed on the surface portion of the punching cross section. The whiskers of glass fibers cannot be removed. For this reason, there is a demand for a reinforcing material with few powder falling elements from the cross section after punching.
【０００７】また、補強材は接着剤付きフイルムを貼り
合わせた後に、打抜きされる場合もある。この場合に
は、補強材と接着剤付きフイルムは材質が異なり、両者
の適正な打抜き条件も異なるので、打抜き条件からの粉
落ちの抑制には制約が生じる。従って、補強材側からの
粉落ち要素の改善が求められている。Further, the reinforcing material may be punched out after the film with adhesive is attached. In this case, the reinforcing material and the adhesive-attached film are made of different materials, and the appropriate punching conditions for the two are also different, so that there is a restriction in suppressing powder falling from the punching conditions. Therefore, improvement of the powder falling element from the reinforcing material side is required.
【０００８】しかしながら、従来の補強材に使用されて
いる積層板は、電気絶縁や機械用であるため、補強材と
して要求される特性の中で、特に打抜き加工断面からの
粉落ちの抑制の面では不十分であった。However, since the laminated plate used in the conventional reinforcing material is for electrical insulation and for machines, it is one of the characteristics required as the reinforcing material, especially in terms of suppressing powder falling from the punched cross section. Was not enough.
【０００９】また、打抜き加工断面からの粉落ち抑制の
ためにポリイミド（ＰＩ）、ポリエーテルケトン（ＰＥ
ＥＫ）、ポリフェニレンサルファイド（ＰＰＳ）等の耐
熱性のある熱可塑性樹脂のシートを用いることも可能で
あるが、経済性や機械的強度（剛性）が不十分であっ
た。Further, in order to suppress the powder falling from the punched cross section, polyimide (PI), polyether ketone (PE
Although it is possible to use a sheet of a heat-resistant thermoplastic resin such as EK) or polyphenylene sulfide (PPS), the economical efficiency and the mechanical strength (rigidity) were insufficient.
【００１０】そこで、この発明は、経済性に優れ打抜き
加工後の加工断面からの粉落ちの少ないフレキシブルプ
リント配線板に適した補強材を提供しようとするもので
ある。Therefore, the present invention is intended to provide a reinforcing material suitable for a flexible printed wiring board, which is excellent in economical efficiency and has little powder falling from a cross section after punching.
【００１１】[0011]
【課題を解決するための手段】上記課題を解決するため
に、この発明は、熱硬化性樹脂を含浸したプリプレグを
加熱加圧成形してなるフレキシブルプリント配線板用補
強材において、上記プリプレグの基材として、ガラス不
織布を採用したものである。In order to solve the above-mentioned problems, the present invention provides a reinforcing material for a flexible printed wiring board, which is formed by heating and pressurizing a prepreg impregnated with a thermosetting resin. As the material, glass non-woven fabric is adopted.
【００１２】また、熱硬化性樹脂を含浸したプリプレグ
を加熱加圧成形してなるフレキシブルプリント配線板用
補強材において、上記プリプレグが表面材と芯材との組
み合わせからなり、表面材のプリプレグがガラス不織布
を基材とし、芯材のプリプレグがガラス織布を基材とし
たものである。Further, in a reinforcing material for a flexible printed wiring board, which is formed by heating and pressurizing a prepreg impregnated with a thermosetting resin, the prepreg comprises a combination of a surface material and a core material, and the prepreg of the surface material is a glass. A non-woven fabric is used as a base material, and a prepreg of a core material is a glass woven fabric as a base material.
【００１３】ガラス不織布は、ガラス織布やガラスマッ
トと異なり、フィラメントが一本一本に分散しており、
即ち、集束していないため、フィラメント一本一本が熱
硬化性樹脂に拘束されている。このため、打抜き加工時
のせん断工程において打抜き断面の表面よりガラス繊維
のヒゲ状の繊維の発生が少なくなり、このヒゲの脱落に
よる粉落ちの発生が少なくなると考えられる。The glass non-woven fabric is different from the glass woven fabric and the glass mat in that the filaments are dispersed one by one,
That is, since the filaments are not focused, each filament is bound by the thermosetting resin. Therefore, it is considered that in the shearing process at the time of punching, the occurrence of whisker-like fibers of glass fiber is less than that of the surface of the punched cross section, and the occurrence of powder drop due to the dropping of the beard is less likely to occur.
【００１４】また、前記打抜き粉の発生は補強材の表面
層部分からの発生が多くなるため、表面層部分にガラス
不織布を配置し、芯材にガラス織布を配置した構成にす
ることにより、打抜き時の粉落ちを抑制しつつ、適度な
機械的強度（剛性）、そり特性を有する補強材を得るこ
とができる。Further, since the above-mentioned punching powder is often generated from the surface layer portion of the reinforcing material, by arranging the glass nonwoven fabric in the surface layer portion and the glass woven fabric in the core material, It is possible to obtain a reinforcing material that has appropriate mechanical strength (rigidity) and warpage characteristics while suppressing powder falling during punching.
【００１５】この発明において、ガラス不織布及びガラ
ス織布に含浸する熱硬化性樹脂としては、エポキシ樹脂
であることが好ましい。また、少なくとも表面層のエポ
キシ樹脂は、可とう性エポキシ樹脂であることが好まし
い。In the present invention, the thermosetting resin with which the glass nonwoven fabric and the glass woven fabric are impregnated is preferably an epoxy resin. Moreover, it is preferable that at least the epoxy resin of the surface layer is a flexible epoxy resin.
【００１６】更に、加熱加圧成形後におけるガラス不織
布のガラス繊維の含有量としては、０．１〜０．５ｇ／
ｃｍ3の範囲であることが好ましい。Further, the glass fiber content of the glass non-woven fabric after the heating and pressing is 0.1 to 0.5 g /
It is preferably in the range of cm 3 .
【００１７】[0017]
【発明の実施の形態】この発明において使用する熱硬化
性樹脂としては、エポキシ樹脂、フェノール樹脂、メラ
ミン樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂等
の通常の熱硬化性樹脂積層板に用いられる樹脂が使用可
能である。これらの中では、エポキシ樹脂がシランカッ
プリング剤の併用によりガラス繊維との化学的な結合が
得られるため、打抜き加工時後の加工断面からの粉落ち
抑制効果があり最も適している。また、エポキシ樹脂の
脆さを低減するために、ゴム成分などの可とう性成分を
加えるか、変性した可とう性エポキシ樹脂も好ましく、
少なくとも打抜き加工において粉落ちの最も発生しやす
い、補強材の表面層に用いることが好ましい。BEST MODE FOR CARRYING OUT THE INVENTION Examples of the thermosetting resin used in the present invention include resins used for ordinary thermosetting resin laminates such as epoxy resin, phenol resin, melamine resin, unsaturated polyester resin, and polyimide resin. It can be used. Of these, the epoxy resin is most suitable because it has a chemical bond with the glass fiber when used in combination with a silane coupling agent, and has the effect of suppressing powder falling from the cross section after punching. Further, in order to reduce the brittleness of the epoxy resin, a flexible epoxy resin added with a flexible component such as a rubber component or modified is also preferable,
It is preferable to use it for the surface layer of the reinforcing material, which is most likely to cause powder drop during punching.
【００１８】また、ガラス不織布としては、所定長さに
切断したガラス繊維を抄紙したものを使用することがで
きる。このガラス不織布は、通常、１００〜８００本の
フィラメントを集束したストランドを所定の長さに切断
したものを、水に分散させ抄紙して得られる。通常、抄
紙する水の中に、ポリビニルアルコール、アクリル系、
エポキシ系のバインダを用いて、ガラス繊維同士を物理
的に接着させてシート状の不織布に仕上げられる。Further, as the glass non-woven fabric, a paper made of glass fiber cut into a predetermined length can be used. This glass nonwoven fabric is usually obtained by dispersing strands in which 100 to 800 filaments are bundled and cutting the strands into a predetermined length and dispersing them in water to make a paper. Usually, polyvinyl alcohol, acrylic,
The glass fiber is physically adhered to each other using an epoxy-based binder to obtain a sheet-shaped nonwoven fabric.
【００１９】ガラス不織布のガラス繊維の組成は、Ｅガ
ラス（無アルカリガラス）、Ｃガラス（含アルカリガラ
ス）等の通常のガラス繊維が使用でき、特に限定されな
い。The glass fiber composition of the glass non-woven fabric is not particularly limited, and ordinary glass fibers such as E glass (non-alkali glass) and C glass (alkali-containing glass) can be used.
【００２０】ガラス不織布のガラス繊維のフィラメント
径は、通常３〜１３μｍのものが使用できるが、特に限
定されない。The glass fiber of the glass non-woven fabric may have a filament diameter of usually 3 to 13 μm, but is not particularly limited.
【００２１】ガラス不織布のガラス繊維の長さは、通常
３〜１８ｍｍ長のものが使用できるが、特に限定されな
い。The length of the glass fiber of the glass non-woven fabric can be usually 3 to 18 mm, but is not particularly limited.
【００２２】加熱加圧成形後におけるガラス不織布のガ
ラス繊維の含有量としては、０．１〜０．５ｇ／ｃｍ3
の範囲であることが好ましい。０．１ｇ／ｃｍ3以下で
は打抜き加工時の粉落ちは少なくなるものの、ガラス繊
維の補強効果が小さく、機械的強度やそり特性、寸法安
定性が劣り、補強材としては満足できるものが得られな
い。一方、０．５ｇ／ｃｍ3以上となると機械的強度
（剛性）やそり特性は優れるものの、打抜き加工時の粉
落ちが多くなり、補強材としては０．１〜０．５ｇ／ｃ
ｍ3の範囲が好ましい。The glass fiber content of the glass non-woven fabric after heat and pressure molding is 0.1 to 0.5 g / cm 3.
It is preferably in the range of. If it is 0.1 g / cm 3 or less, powder falling off during punching will be small, but the reinforcing effect of glass fiber will be small, mechanical strength, warpage characteristics and dimensional stability will be poor, and a satisfactory reinforcing material can be obtained. Absent. On the other hand, if it is 0.5 g / cm 3 or more, mechanical strength (rigidity) and warpage characteristics are excellent, but powder drop during punching is increased, and 0.1 to 0.5 g / c as a reinforcing material.
A range of m 3 is preferred.
【００２３】また、この発明では、加熱加圧成形する熱
硬化性樹脂のプリプレグを表面材と芯材との組み合わせ
にし、表面材のプリプレグがガラス不織布を基材とし、
芯材のプリプレグがガラス織布を基材としたものも使用
することができる。このように、ガラス不織布プリプレ
グを表面材にしてガラス織布プリプレグを芯材にするこ
とにより、機械的強度、そり特性、寸法安定性を著しく
損なうことなく打抜き時の粉落ちが抑制できる。この発
明において使用するガラス織布としては、通常の積層板
に用いられる７６２８、２１１６、１０８０（ＩＰＣ−
ＥＧ−１４０規格）等のものが使用でき、特に限定され
るものではなく、機械的強度（剛性）、そり特性等を勘
案して適時選択使用すれば良い。Further, in the present invention, a prepreg of thermosetting resin to be heat-pressed is a combination of a surface material and a core material, and the prepreg of the surface material uses a glass nonwoven fabric as a base material,
It is also possible to use a prepreg of the core material having a glass woven fabric as a base material. Thus, by using the glass non-woven fabric prepreg as the surface material and the glass woven fabric prepreg as the core material, it is possible to suppress powder drop during punching without significantly impairing mechanical strength, warpage characteristics, and dimensional stability. As the glass woven fabric used in the present invention, 7628, 2116, 1080 (IPC-
EG-140 standard) or the like can be used, and there is no particular limitation, and mechanical strength (rigidity), warp characteristics, and the like may be taken into consideration and selected and used at appropriate times.
【００２４】（実施例１）臭素化ビスフェノールＡ型エ
ポキシ樹脂１００重量部に対し、硬化剤としてジシアン
ジアミドを２重量部と、硬化促進剤としてイミダゾール
を１重量部とを配合した固形分５０％のワニスをガラス
不織布（ガラス繊維の含有量は５０ｇ／ｍ 3）に、成形
後の厚さが０．２ｍｍ厚さになるように含浸乾燥し、プ
リプレグ（Ａ）を準備した。このプリプレグを５枚重ね
合わせ、温度１６０℃、圧力２．９ＭＰａで１２０分間
加熱加圧成形して厚さ１．０ｍｍの補強材を得た。(Example 1) Brominated bisphenol A type
Dicyan as a curing agent for 100 parts by weight of the epoxy resin
2 parts by weight of diamide and imidazole as a curing accelerator
1 part by weight of varnish with a solid content of 50% in glass
Non-woven fabric (glass fiber content is 50g / m 3), Molding
Impregnate and dry to a thickness of 0.2 mm afterwards,
A prepreg (A) was prepared. 5 layers of this prepreg
Combined, temperature 160 ℃, pressure 2.9MPa for 120 minutes
It was heated and pressed to obtain a reinforcing material having a thickness of 1.0 mm.
【００２５】この補強材のガラス不織布におけるガラス
繊維の含有量は０．２５ｇ／ｍ3である。The glass fiber content in the glass non-woven fabric of this reinforcing material is 0.25 g / m 3 .
【００２６】次いで、この補強材を金型で１００枚を打
抜き加工したのち所定条件でエアーブローして打抜き粉
を取り除いた後、この試験片の重量Ａを測定した。次い
で、この試験片をプラスチック容器に入れ、振動発生機
で５分間振動させた。次いで、この試験片を所定条件で
エアーブローして試験片に付着した粉落ちを除去した
後、試験片の重量Ｂを測定した。粉落ち量は下式により
求めた。
粉落ち量（ｇ）＝重量Ａ（ｇ）−重量Ｂ（ｇ）Next, after 100 sheets of the reinforcing material were punched with a mold and air-blown under predetermined conditions to remove punching powder, the weight A of the test piece was measured. Then, this test piece was put in a plastic container and vibrated for 5 minutes with a vibration generator. Next, this test piece was blown with air under a predetermined condition to remove the powder drop adhering to the test piece, and then the weight B of the test piece was measured. The amount of powder falling was calculated by the following formula. Powder falling amount (g) = weight A (g) -weight B (g)
【００２７】また、そりの測定は１５０×１５０ｍｍの
試験片を定盤上に載せ、試験片と定盤との最大隙間を測
定して、そり量とした。The warpage was measured by placing a test piece of 150 × 150 mm on a surface plate and measuring the maximum gap between the test piece and the surface plate to obtain the amount of warpage.
【００２８】また、機械的強度（剛性）はＪＩＳ Ｋ
６９１１の試験方法により、曲げ弾性率を測定した。The mechanical strength (rigidity) is JIS K.
The flexural modulus was measured by the test method of 6911.
【００２９】（実施例２）実施例１に使用したワニスを
ガラス織布（重量２１０ｇ／ｍ3）に成形後の厚さが
０．２ｍｍ厚さになる様に含浸乾燥し、プリプレグ
（Ｂ）を準備した。次いで、このプリプレグ（Ｂ）の表
裏にそれぞれプリプレグ（Ａ）を各２枚配置し、実施例
１と同様に１．０ｍｍ厚の補強材を作成し、実施例１と
同様に試験を行なった。(Example 2) The varnish used in Example 1 was impregnated into a glass woven cloth (weight: 210 g / m 3 ) so that the thickness after molding was 0.2 mm, and dried to obtain a prepreg (B). Prepared. Next, two prepregs (A) were arranged on each of the front and back of the prepreg (B), a 1.0 mm thick reinforcing material was prepared in the same manner as in Example 1, and the same test as in Example 1 was performed.
【００３０】（実施例３）実施例１に使用したビスフェ
ノールＡ型エポキシ樹脂１００重量部をビスフェノール
Ａ型エポキシ樹脂／ダイマー酸変性エポキシ樹脂＝７０
／３０にし、実施例１と同様にプリプレグ（Ｃ）を得
た。プリプレグ（Ａ）３枚の表裏にそれぞれプリプレグ
（Ｃ）を１枚配置して実施例１と同様に１．０ｍｍ厚の
補強材を作成し、実施例１と同様に試験を行なった。Example 3 100 parts by weight of the bisphenol A type epoxy resin used in Example 1 was added to bisphenol A type epoxy resin / dimer acid modified epoxy resin = 70.
/ 30 to obtain a prepreg (C) in the same manner as in Example 1. One prepreg (C) was placed on each of the front and back sides of three prepregs (A) to prepare a 1.0 mm thick reinforcing material in the same manner as in Example 1, and the same test as in Example 1 was performed.
【００３１】（実施例４）実施例１において、ガラス不
織布をガラス繊維の含有量は２０ｇ／ｍ3とし、補強材
中のガラス不織布のガラス繊維の含有量は０．１０ｇ／
ｍ3とした以外は実施例１と同様に１．０ｍｍ厚の補強
材を作成し、実施例１と同様に試験を行なった。(Example 4) In Example 1, the glass non-woven fabric had a glass fiber content of 20 g / m 3, and the glass non-woven fabric content of the reinforcing material was 0.10 g / m 3.
A reinforcing material having a thickness of 1.0 mm was prepared in the same manner as in Example 1 except that m 3 was used, and the same test as in Example 1 was performed.
【００３２】（実施例５）実施例１において、ガラス不
織布をガラス繊維の含有量は１００ｇ／ｍ3とし、補強
材中のガラス不織布のガラス繊維の含有量は０．５０ｇ
／ｍ3とした以外は実施例１と同様に１．０ｍｍ厚の補
強材を作成し、実施例１と同様に試験を行なった。Example 5 In Example 1, the glass non-woven fabric had a glass fiber content of 100 g / m 3, and the glass non-woven fabric content of the reinforcing material was 0.50 g.
A reinforcing material having a thickness of 1.0 mm was prepared in the same manner as in Example 1 except that the value was / m 3, and the same test as in Example 1 was performed.
【００３３】（比較例１）実施例２に用いたガラス織布
プリプレグ（Ｂ）５枚を、実施例１と同様に加熱加圧成
形し、１．０ｍｍ厚の補強材を作成し、実施例１と同様
に試験を行なった。
（比較例２）実施例１において、ガラス不織布をガラス
繊維の含有量は１０ｇ／ｍ3とし、補強材中のガラス不
織布のガラス繊維の含有量は０．０５ｇ／ｍ3とした以
外は実施例１と同様に１．０ｍｍ厚の補強材を作成し、
実施例１と同様に試験を行なった。Comparative Example 1 Five glass woven prepregs (B) used in Example 2 were heated and pressed in the same manner as in Example 1 to form a 1.0 mm thick reinforcing material. The test was conducted in the same manner as 1. (Comparative Example 2) Example 1, except the content of the glass fiber non-woven glass fabric is a 10 g / m 3, the content of glass fiber of the glass nonwoven fabric in the reinforcement which was 0.05 g / m 3 Example Create a 1.0 mm thick reinforcement as in 1.
The test was conducted in the same manner as in Example 1.
【００３４】（比較例３）実施例１において、ガラス不
織布をガラス繊維の含有量は１４０ｇ／ｍ3とし、補強
材中のガラス不織布のガラス繊維の含有量は０．７ｇ／
ｍ3とした以外は実施例１と同様に１．０ｍｍ厚の補強
材を作成し、実施例１と同様に試験を行なった。実施例
１〜５、比較例１〜３の試験結果を表１、表２に示す。Comparative Example 3 In Example 1, the glass non-woven fabric had a glass fiber content of 140 g / m 3, and the glass non-woven fabric content in the reinforcing material was 0.7 g / m 3.
A reinforcing material having a thickness of 1.0 mm was prepared in the same manner as in Example 1 except that m 3 was used, and the same test as in Example 1 was performed. The test results of Examples 1 to 5 and Comparative Examples 1 to 3 are shown in Tables 1 and 2.
【００３５】[0035]
【表１】 [Table 1]
【００３６】[0036]
【表２】 [Table 2]
【００３７】[0037]
【発明の効果】この発明によれば、補強材として必要な
機械的強度（剛性）、そり特性を確保し、打抜き加工後
の加工断面からの粉落ちを低減できる。これにより、従
来の補強材として多用されている、電気絶縁や機械用の
ガラス織布基材エポキシ樹脂積層板における打抜き加工
後の加工断面からの粉落ちが多くなるという問題を解決
することができる。According to the present invention, it is possible to secure the mechanical strength (rigidity) and warpage characteristics required as a reinforcing material, and reduce the powder falling from the processed cross section after punching. As a result, it is possible to solve the problem that a large amount of powder falls from the processed cross-section after punching in the glass woven fabric-based epoxy resin laminate for electrical insulation and machinery, which is often used as a conventional reinforcing material. .
Claims (5)
熱加圧成形してなるフレキシブルプリント配線板用補強
材において、上記プリプレグの基材がガラス不織布から
なることを特徴とするフレキシブルプリント配線板用補
強材。1. A reinforcing material for a flexible printed wiring board, which is formed by heating and pressurizing a prepreg impregnated with a thermosetting resin, wherein the base material of the prepreg is made of glass nonwoven fabric. Reinforcement material.
熱加圧成形してなるフレキシブルプリント配線板用補強
材において、上記プリプレグが表面材と芯材との組み合
わせからなり、表面材のプリプレグがガラス不織布を基
材とし、芯材のプリプレグがガラス織布を基材とするこ
とを特徴とするフレキシブルプリント配線板用補強材。2. A reinforcing material for a flexible printed wiring board, which is formed by heat-pressing a prepreg impregnated with a thermosetting resin, wherein the prepreg comprises a combination of a surface material and a core material, and the prepreg of the surface material is glass. A reinforcing material for a flexible printed wiring board, characterized in that a non-woven fabric is used as a base material, and a prepreg of a core material is a woven glass cloth as a base material.
を特徴とする請求項１または２のいずれかに記載のフレ
キシブルプリント配線板用補強材。3. The reinforcing material for a flexible printed wiring board according to claim 1, wherein the thermosetting resin is an epoxy resin.
う性エポキシ樹脂である請求項３記載のフレキシブルプ
リント配線板用補強材。4. The reinforcing material for a flexible printed wiring board according to claim 3, wherein the epoxy resin of at least the surface layer is a flexible epoxy resin.
ガラス繊維の含有量が０．１〜０．５ｇ／ｃｍ3の範囲
であることを特徴とする請求項１〜４記載のフレキシブ
ルプリント配線板用補強材。5. The flexible printed wiring board according to claim 1, wherein the glass fiber content of the glass non-woven fabric after heating and pressing is in the range of 0.1 to 0.5 g / cm 3. Reinforcement material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002046554A JP2003238709A (en) | 2002-02-22 | 2002-02-22 | Reinforcing material for flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002046554A JP2003238709A (en) | 2002-02-22 | 2002-02-22 | Reinforcing material for flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003238709A true JP2003238709A (en) | 2003-08-27 |
Family
ID=27784525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002046554A Pending JP2003238709A (en) | 2002-02-22 | 2002-02-22 | Reinforcing material for flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003238709A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353827A (en) * | 2004-06-10 | 2005-12-22 | Ibiden Co Ltd | Flexible rigid wiring board |
| JP2006278747A (en) * | 2005-03-29 | 2006-10-12 | Nippon Mektron Ltd | Flexible printed circuit board and its manufacturing method |
| JP2008027635A (en) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Electrochemical element |
| US7378596B2 (en) | 2003-04-18 | 2008-05-27 | Ibiden Co., Ltd. | Rigid-flex wiring board |
| US7423219B2 (en) | 2004-06-11 | 2008-09-09 | Ibiden Co., Ltd. | Flex-rigid wiring board |
-
2002
- 2002-02-22 JP JP2002046554A patent/JP2003238709A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7378596B2 (en) | 2003-04-18 | 2008-05-27 | Ibiden Co., Ltd. | Rigid-flex wiring board |
| US7655869B2 (en) | 2003-04-18 | 2010-02-02 | Ibiden Co., Ltd. | Flex-rigid wiring board |
| JP2005353827A (en) * | 2004-06-10 | 2005-12-22 | Ibiden Co Ltd | Flexible rigid wiring board |
| WO2005122656A1 (en) * | 2004-06-10 | 2005-12-22 | Ibiden Co., Ltd. | Flex-rigid wiring board and manufacturing method thereof |
| JP4536430B2 (en) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | Flex rigid wiring board |
| US8093502B2 (en) | 2004-06-10 | 2012-01-10 | Ibiden Co., Ltd. | Flex-rigid wiring board and manufacturing method thereof |
| US7423219B2 (en) | 2004-06-11 | 2008-09-09 | Ibiden Co., Ltd. | Flex-rigid wiring board |
| JP2006278747A (en) * | 2005-03-29 | 2006-10-12 | Nippon Mektron Ltd | Flexible printed circuit board and its manufacturing method |
| JP4511401B2 (en) * | 2005-03-29 | 2010-07-28 | 日本メクトロン株式会社 | Flexible printed circuit board and manufacturing method thereof |
| JP2008027635A (en) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Electrochemical element |
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