JP4492621B2 - 半導体装置およびその製造方法 - Google Patents
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Description
請求項2に記載の発明に係る半導体装置は、請求項1に記載の発明において、前記磁性体粉末はNiCuZn、FeCoBN、CoHfTaPdのいずれかの軟磁性体粉末からなることを特徴とするものである。
請求項3に記載の発明に係る半導体装置は、請求項1に記載の発明において、前記突起電極上に半田ボールが設けられていることを特徴とするものである。
請求項4に記載の発明に係る半導体装置の製造方法は、主面に複数の集積回路が形成された半導体ウエハ上に、樹脂中に磁性体粉末が混入された材料を有する絶縁膜を形成する工程と、接続パッドを介して前記集積回路と電気的に接続され、且つ前記絶縁膜上に複数の配線を形成する工程と、前記配線の接続パッド部上に突起電極を形成する工程と、前記配線を含む前記絶縁膜の上面、且つ前記突起電極の周囲に、樹脂中に磁性体粉末が混入された材料からなる封止膜を形成する工程と、前記半導体ウエハおよび前記封止膜をダイシングして、複数個の半導体装置を得る工程と、を有することを特徴とするものである。
請求項5に記載の発明に係る半導体装置の製造方法は、請求項4に記載の発明において、前記磁性体粉末はNiCuZn、FeCoBN、CoHfTaPdのいずれかの軟磁性体粉末からなることを特徴とするものである。
請求項6に記載の発明に係る半導体装置の製造方法は、請求項4に記載の発明において、前記封止膜を形成した後に、前記突起電極上に半田ボールを形成する工程を有することを特徴とするものである。
図1はこの発明の第1実施形態としての半導体装置の断面図を示す。この半導体装置は、一般的にはCSPと呼ばれるものであり、シリコン基板(半導体基板)1を備えている。シリコン基板1の上面には所定の機能の集積回路(図示せず)が設けられ、上面周辺部にはアルミニウム系金属等からなる複数の接続パッド2が集積回路に接続されて設けられている。
図10はこの発明の第2実施形態としての半導体装置の断面図を示す。この半導体装置において、図1に示す半導体装置と異なる点は、保護膜(絶縁膜)5をポリイミド系樹脂、エポキシ系樹脂等からなる熱硬化性樹脂5a中に軟磁性体粉末5bが混入された材料によって形成した点である。
2 接続パッド
3 絶縁膜
5 保護膜
5a 熱硬化性樹脂
5b 軟磁性体粉末
7 下地金属層
8 配線
9 柱状電極
10 封止膜
10a 熱硬化性樹脂
10b 軟磁性体粉末
11 半田ボール
21 半導体ウエハ
Claims (6)
- 半導体基板と、前記半導体基板上に設けられた集積回路と、前記集積回路の上面を覆い、樹脂中に磁性体粉末が混入された材料を有する絶縁膜と、接続パッドを介して前記集積回路と電気的に接続され、且つ前記絶縁膜上に設けられた複数の配線と、前記配線の接続パッド部上に設けられた突起電極と、前記配線を含む前記絶縁膜の上面、且つ前記突起電極の周囲に設けられた、樹脂中に磁性体粉末が混入された材料からなる封止膜とを備えていることを特徴とする半導体装置。
- 請求項1に記載の発明において、前記磁性体粉末はNiCuZn、FeCoBN、CoHfTaPdのいずれかの軟磁性体粉末からなることを特徴とする半導体装置。
- 請求項1に記載の発明において、前記突起電極上に半田ボールが設けられていることを特徴とする半導体装置。
- 主面に複数の集積回路が形成された半導体ウエハ上に、樹脂中に磁性体粉末が混入された材料を有する絶縁膜を形成する工程と、
接続パッドを介して前記集積回路と電気的に接続され、且つ前記絶縁膜上に複数の配線を形成する工程と、
前記配線の接続パッド部上に突起電極を形成する工程と、
前記配線を含む前記絶縁膜の上面、且つ前記突起電極の周囲に、樹脂中に磁性体粉末が混入された材料からなる封止膜を形成する工程と、
前記半導体ウエハおよび前記封止膜をダイシングして、複数個の半導体装置を得る工程と、
を有することを特徴とする半導体装置の製造方法。 - 請求項4に記載の発明において、前記磁性体粉末はNiCuZn、FeCoBN、CoHfTaPdのいずれかの軟磁性体粉末からなることを特徴とする半導体装置の製造方法。
- 請求項4に記載の発明において、前記封止膜を形成した後に、前記突起電極上に半田ボールを形成する工程を有することを特徴とする半導体装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007031757A JP4492621B2 (ja) | 2007-02-13 | 2007-02-13 | 半導体装置およびその製造方法 |
US12/069,689 US8110882B2 (en) | 2007-02-13 | 2008-02-12 | Semiconductor device with magnetic powder mixed therein and manufacturing method thereof |
TW097104816A TWI397158B (zh) | 2007-02-13 | 2008-02-12 | 混有磁性體粉末之半導體裝置及其製造方法 |
KR1020080012598A KR101028258B1 (ko) | 2007-02-13 | 2008-02-12 | 자성체 분말을 혼입하는 반도체장치 및 그 제조방법 |
CN2008100881988A CN101320726B (zh) | 2007-02-13 | 2008-02-13 | 混入磁性体粉末的半导体装置及其制造方法 |
KR1020100007714A KR101030153B1 (ko) | 2007-02-13 | 2010-01-28 | 반도체장치 및 그 제조방법 |
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JP2007031757A JP4492621B2 (ja) | 2007-02-13 | 2007-02-13 | 半導体装置およびその製造方法 |
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JP2008198766A JP2008198766A (ja) | 2008-08-28 |
JP4492621B2 true JP4492621B2 (ja) | 2010-06-30 |
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JP2007031757A Expired - Fee Related JP4492621B2 (ja) | 2007-02-13 | 2007-02-13 | 半導体装置およびその製造方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010040817A (ja) * | 2008-08-06 | 2010-02-18 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
JP2013232620A (ja) | 2012-01-27 | 2013-11-14 | Rohm Co Ltd | チップ部品 |
US9245940B2 (en) * | 2014-02-12 | 2016-01-26 | Qualcomm Incorporated | Inductor design on floating UBM balls for wafer level package (WLP) |
KR20160004090A (ko) * | 2014-07-02 | 2016-01-12 | 삼성전기주식회사 | 박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법 |
WO2022178874A1 (zh) * | 2021-02-27 | 2022-09-01 | 华为技术有限公司 | 一种磁基板结构及电子装置 |
Citations (2)
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JP2005235944A (ja) * | 2004-02-18 | 2005-09-02 | Tdk Corp | 電子デバイスおよびその製造方法 |
JP2006059839A (ja) * | 2004-08-17 | 2006-03-02 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法 |
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US6914183B2 (en) * | 2002-09-25 | 2005-07-05 | Sumitomo Electric Industries, Ltd. | Board for printed wiring |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005235944A (ja) * | 2004-02-18 | 2005-09-02 | Tdk Corp | 電子デバイスおよびその製造方法 |
JP2006059839A (ja) * | 2004-08-17 | 2006-03-02 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
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CN101320726A (zh) | 2008-12-10 |
JP2008198766A (ja) | 2008-08-28 |
CN101320726B (zh) | 2012-02-22 |
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