JP4488586B2 - フラックス、フラックス付き低融点合金およびそれを用いた保護素子 - Google Patents

フラックス、フラックス付き低融点合金およびそれを用いた保護素子 Download PDF

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JP4488586B2
JP4488586B2 JP2000151078A JP2000151078A JP4488586B2 JP 4488586 B2 JP4488586 B2 JP 4488586B2 JP 2000151078 A JP2000151078 A JP 2000151078A JP 2000151078 A JP2000151078 A JP 2000151078A JP 4488586 B2 JP4488586 B2 JP 4488586B2
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ethylene
flux
point alloy
protective element
acrylate copolymer
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Japanese (ja)
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JP2001334394A (ja
JP2001334394A5 (enExample
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精朋 寺澤
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エヌイーシー ショット コンポーネンツ株式会社
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JP2000151078A 2000-05-23 2000-05-23 フラックス、フラックス付き低融点合金およびそれを用いた保護素子 Expired - Lifetime JP4488586B2 (ja)

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JP2000151078A JP4488586B2 (ja) 2000-05-23 2000-05-23 フラックス、フラックス付き低融点合金およびそれを用いた保護素子

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JP2000151078A JP4488586B2 (ja) 2000-05-23 2000-05-23 フラックス、フラックス付き低融点合金およびそれを用いた保護素子

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JP2001334394A JP2001334394A (ja) 2001-12-04
JP2001334394A5 JP2001334394A5 (enExample) 2007-06-14
JP4488586B2 true JP4488586B2 (ja) 2010-06-23

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JP2000151078A Expired - Lifetime JP4488586B2 (ja) 2000-05-23 2000-05-23 フラックス、フラックス付き低融点合金およびそれを用いた保護素子

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197005A (ja) 2003-12-26 2005-07-21 Fuji Xerox Co Ltd 可動体表面の温度過昇防止素子、並びに、これを用いた温度過昇防止装置および温度制御素子
JP5234902B2 (ja) * 2007-10-10 2013-07-10 エヌイーシー ショット コンポーネンツ株式会社 可溶合金型温度ヒューズ
TWI498184B (zh) * 2008-01-31 2015-09-01 Arakawa Chem Ind 助焊劑及膏狀焊劑
JP7579717B2 (ja) * 2021-02-24 2024-11-08 デクセリアルズ株式会社 保護素子及びバッテリパック
JP7141009B1 (ja) * 2022-03-07 2022-09-22 千住金属工業株式会社 フラックス及びソルダペースト
CN115873386A (zh) * 2023-02-20 2023-03-31 广东金驭科技有限公司 一种复合有机感温材料及其制备方法、保险丝

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07164183A (ja) * 1993-12-17 1995-06-27 Nippon Genma:Kk フラックス組成物
JP3185962B2 (ja) * 1995-02-28 2001-07-11 ソニーケミカル株式会社 保護回路及び保護素子
JP3456623B2 (ja) * 1997-08-29 2003-10-14 千住金属工業株式会社 温度ヒューズ
JPH11213852A (ja) * 1998-01-28 1999-08-06 Nec Kansai Ltd 電流ヒューズ

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