JP4481667B2 - 切削方法 - Google Patents

切削方法 Download PDF

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Publication number
JP4481667B2
JP4481667B2 JP2004025036A JP2004025036A JP4481667B2 JP 4481667 B2 JP4481667 B2 JP 4481667B2 JP 2004025036 A JP2004025036 A JP 2004025036A JP 2004025036 A JP2004025036 A JP 2004025036A JP 4481667 B2 JP4481667 B2 JP 4481667B2
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JP
Japan
Prior art keywords
cutting
blade
blades
cutting blade
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004025036A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005217334A (ja
JP2005217334A5 (enExample
Inventor
直哉 徳満
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2004025036A priority Critical patent/JP4481667B2/ja
Priority to US11/046,801 priority patent/US7484444B2/en
Priority to CNB2005100062865A priority patent/CN100456431C/zh
Publication of JP2005217334A publication Critical patent/JP2005217334A/ja
Publication of JP2005217334A5 publication Critical patent/JP2005217334A5/ja
Application granted granted Critical
Publication of JP4481667B2 publication Critical patent/JP4481667B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0363—Plural independent scoring blades
    • Y10T83/037—Rotary scoring blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/081—With randomly actuated stopping means
    • Y10T83/088—Responsive to tool detector or work-feed-means detector
    • Y10T83/089—Responsive to tool characteristic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/162—With control means responsive to replaceable or selectable information program
    • Y10T83/173—Arithmetically determined program
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/647—With means to convey work relative to tool station
    • Y10T83/6584—Cut made parallel to direction of and during work movement
    • Y10T83/6587—Including plural, laterally spaced tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2004025036A 2004-02-02 2004-02-02 切削方法 Expired - Lifetime JP4481667B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004025036A JP4481667B2 (ja) 2004-02-02 2004-02-02 切削方法
US11/046,801 US7484444B2 (en) 2004-02-02 2005-02-01 Cutting device with a pair of cutting blades and elements for detecting and controlling wear of the cutting blades
CNB2005100062865A CN100456431C (zh) 2004-02-02 2005-02-02 具有一对切削装置的切削设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004025036A JP4481667B2 (ja) 2004-02-02 2004-02-02 切削方法

Publications (3)

Publication Number Publication Date
JP2005217334A JP2005217334A (ja) 2005-08-11
JP2005217334A5 JP2005217334A5 (enExample) 2005-12-15
JP4481667B2 true JP4481667B2 (ja) 2010-06-16

Family

ID=34805787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004025036A Expired - Lifetime JP4481667B2 (ja) 2004-02-02 2004-02-02 切削方法

Country Status (3)

Country Link
US (1) US7484444B2 (enExample)
JP (1) JP4481667B2 (enExample)
CN (1) CN100456431C (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042855A (ja) * 2005-08-03 2007-02-15 Disco Abrasive Syst Ltd ブレード検出手段を備えた切削装置
JP4847069B2 (ja) * 2005-08-19 2011-12-28 株式会社ディスコ 切削装置
JP4837970B2 (ja) * 2005-10-06 2011-12-14 株式会社ディスコ 切削ブレードの交換装置
JP4837973B2 (ja) 2005-10-13 2011-12-14 株式会社ディスコ 切削ブレードの交換装置
WO2008124837A2 (en) * 2007-04-10 2008-10-16 Acco Brands Usa Llc Sheet trimmer
JP2009012127A (ja) * 2007-07-05 2009-01-22 Disco Abrasive Syst Ltd 切削装置
JP5613072B2 (ja) * 2011-01-31 2014-10-22 新電元工業株式会社 半導体ウエハーのダイシング方法
DE102011119719A1 (de) * 2011-11-30 2013-06-06 GEA CFS Bühl GmbH Verfahren zum Aufschneiden eines Lebensmittelriegels unter Verwendung eines Schwingungssensors
JP5898982B2 (ja) * 2012-02-03 2016-04-06 株式会社ディスコ 研削装置
US20130273717A1 (en) * 2012-04-17 2013-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and Method for the Singulation of a Semiconductor Wafer
CN103066937A (zh) * 2012-12-07 2013-04-24 江苏汇成光电有限公司 切割机刀片侦测装置
KR20140112607A (ko) * 2013-03-11 2014-09-24 삼성디스플레이 주식회사 나이프 검사용 광센서 조립체 및 이를 포함하는 기판 절단 장치
ITFI20130292A1 (it) * 2013-11-30 2015-05-31 Futura Spa Dispositivo per il controllo dell'affilatura di lame a nastro.
CN104835753B (zh) * 2014-02-11 2017-08-01 承澔科技股份有限公司 切割刀具的位置感测装置
CN106079123A (zh) * 2016-06-23 2016-11-09 无锡宏纳科技有限公司 一种可保护刀刃的晶圆切割刀
JP7028607B2 (ja) * 2017-11-06 2022-03-02 株式会社ディスコ 切削装置
JP7229093B2 (ja) * 2019-05-13 2023-02-27 株式会社ディスコ ブレード脱着補助装置
CN110739216B (zh) * 2019-10-28 2022-03-29 东莞记忆存储科技有限公司 一种单轴分步切割晶圆的加工工艺方法
US11608642B2 (en) * 2020-02-13 2023-03-21 LVP Stairs LLC Devices and methods for fitting luxury vinyl plank floorcovering to interior stairs
WO2022129986A1 (en) * 2020-12-15 2022-06-23 Arcelormittal Mastering of trimming knives position

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001232B1 (ko) * 1984-12-27 1990-03-05 가부시끼 가이샤 디스코 반도체 웨이퍼 방형절단기
EP0532933B1 (en) * 1991-08-21 1995-11-02 Tokyo Seimitsu Co.,Ltd. Blade position detection apparatus
DE69709924D1 (de) * 1996-06-15 2002-02-28 Unova Uk Ltd Flexible verbindung einer schleifmaschinenspindel zu einer plattform
JP3223421B2 (ja) * 1996-08-13 2001-10-29 株式会社東京精密 ダイシング装置
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US5904083A (en) * 1997-04-10 1999-05-18 J.R. Simplot Company Knife fixture with broken blade detector
US6102023A (en) * 1997-07-02 2000-08-15 Disco Corporation Precision cutting apparatus and cutting method using the same
US6348943B1 (en) * 1998-10-30 2002-02-19 Industrial Technology Research Institute Digital non-contact blade position detection apparatus
JP3282145B2 (ja) * 1998-12-21 2002-05-13 株式会社東京精密 ダイシング装置
KR20000076987A (ko) * 1999-03-31 2000-12-26 다구마시로오 피가공물 연삭방법 및 장치
JP4447074B2 (ja) * 1999-06-21 2010-04-07 株式会社ディスコ 切削装置
JP4640715B2 (ja) * 2000-07-14 2011-03-02 株式会社ディスコ アライメント方法及びアライメント装置
JP2002217135A (ja) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd 切削装置
JP2002359211A (ja) * 2001-05-30 2002-12-13 Disco Abrasive Syst Ltd 切削機
SG118084A1 (en) * 2001-08-24 2006-01-27 Micron Technology Inc Method and apparatus for cutting semiconductor wafers
US6761615B2 (en) * 2001-11-01 2004-07-13 Advanced Dicing Technologies, Ltd. In-situ wear measurement apparatus for dicing saw blades
JP2003236748A (ja) * 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
US6767615B1 (en) * 2003-04-02 2004-07-27 Ren Judkins Cellular material having cells with swirled strands

Also Published As

Publication number Publication date
US7484444B2 (en) 2009-02-03
CN1652305A (zh) 2005-08-10
CN100456431C (zh) 2009-01-28
JP2005217334A (ja) 2005-08-11
US20050166745A1 (en) 2005-08-04

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