JP4476979B2 - 半導体基板の液浸リソグラフィ形成方法および半導体ウェハの処理方法 - Google Patents
半導体基板の液浸リソグラフィ形成方法および半導体ウェハの処理方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 58
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 238000000671 immersion lithography Methods 0.000 title claims description 25
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- 238000004140 cleaning Methods 0.000 claims description 9
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- 230000007935 neutral effect Effects 0.000 claims description 2
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- VANHQTOUHVZHHF-IBGZPJMESA-N 5-[[5-[[(2s)-3-carboxy-1-[5-(2,6-dichlorophenyl)-1,3-oxazol-2-yl]-1-oxopropan-2-yl]carbamoyl]pyridin-2-yl]methylsulfamoyl]-2-hydroxybenzoic acid Chemical compound N([C@@H](CC(=O)O)C(=O)C=1OC(=CN=1)C=1C(=CC=CC=1Cl)Cl)C(=O)C(C=N1)=CC=C1CNS(=O)(=O)C1=CC=C(O)C(C(O)=O)=C1 VANHQTOUHVZHHF-IBGZPJMESA-N 0.000 description 15
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
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- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
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- ISQINHMJILFLAQ-UHFFFAOYSA-N argon hydrofluoride Chemical compound F.[Ar] ISQINHMJILFLAQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Description
14 レジスト層
20 液浸リソグラフィ露光システム
26 流体
60 抑制剤
Claims (15)
- 半導体基板の表面上にレジスト層を供給するステップと、
露光中に流体を利用する液浸リソグラフィ露光システムを使用して、前記レジスト層を露光するステップと、
前記流体を介して前記レジスト中に拡散した抑制剤を中和する処理で、露光の後で且つ露光後ベークの前に前記レジスト層を処理するステップと、
溶剤によって前記レジスト層の上部表面の薄膜を除去するステップと、
前記レジスト層の露光後ベークを行なうステップと、
前記露光されたレジスト層を現像するステップと、からなる半導体基板の液浸リソグラフィ形成方法。 - 前記処理ステップは洗浄溶液を利用し、この洗浄溶液は、前記レジスト中に拡散した前記抑制剤を中和するのに選択された極性を有する物質を含む請求項1記載の方法。
- 前記物質が、前記レジスト中に拡散した前記抑制剤の拡散度に対応した拡散度に基づいて選択される請求項2記載の方法。
- 前記洗浄溶液が7より小さいpHを有し、前記抑制剤が7より大きいpHを有する請求項2記載の方法。
- 前記洗浄溶液が、約1〜3の間のpHを有する酸,光酸発生剤(PAG),バッファー,またはこれらの組み合わせたものを含む請求項4記載の方法。
- 前記処理ステップが、さらにスピン・ドライのステップを利用する請求項2記載の方法。
- 前記洗浄溶液が7より大きなpHを有し、前記抑制剤が7より小さなpHを有することを特徴とする請求項2記載の方法。
- 前記洗浄溶液が、塩基,光塩基発生剤(PBG),またはこれらの組み合わせたものを含む請求項7記載の方法。
- 前記処理の後で且つ前記露光後ベークの前に、中性溶液による洗浄とスピン・ドライをさらに行なう請求項1記載の方法。
- 前記処理ステップが蒸発した溶液を利用し、前記蒸発した溶液は、レジスト中に拡散した前記抑制剤を中和するのに選択された極性を有する請求項1記載の方法。
- 前記蒸発した溶液が、前記レジスト中に拡散した前記抑制剤の拡散度に対応した拡散度に基づいて選択される請求項10記載の方法。
- 前記蒸発した溶液が、一乃至複数の酸,PAG,またはバッファーを含み、前記レジストが7より大きなpHを有すると共にPAGを含む請求項10記載の方法。
- 前記蒸発した溶液が、一乃至複数の塩基,PBG,またはバッファーを含み、前記レジストが7より小さなpHを有すると共にPBGを含むことを特徴とする請求項10記載の方法。
- 前記処理が、前記レジスト層の薄い上部分を除去するために、前記レジスト層へ溶剤の供給を行なうこと含む請求項1記載の方法。
- 液浸リソグラフィプロセスが、ウェハのレジスト層上にパターンを露光した後の半導体ウェハの処理方法であって、前記レジスト層が、その後のプロセスで使用する光酸発生剤を含んでおり、
前記半導体ウェハの前記レジスト層にリンスを塗布し、このリンスは、前記レジスト層の露光されていない部分から浸出し、前記レジスト層の露光された部分へ拡散するあらゆる塩基性の抑制剤を中和する酸性成分を含み、
前記レジスト層の上部表面の薄膜を溶剤で除去する半導体ウェハの処理方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70579505P | 2005-08-05 | 2005-08-05 | |
US11/427,017 US8383322B2 (en) | 2005-08-05 | 2006-06-28 | Immersion lithography watermark reduction |
Publications (2)
Publication Number | Publication Date |
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JP2007047782A JP2007047782A (ja) | 2007-02-22 |
JP4476979B2 true JP4476979B2 (ja) | 2010-06-09 |
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JP2006212576A Active JP4476979B2 (ja) | 2005-08-05 | 2006-08-03 | 半導体基板の液浸リソグラフィ形成方法および半導体ウェハの処理方法 |
Country Status (4)
Country | Link |
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US (2) | US8383322B2 (ja) |
JP (1) | JP4476979B2 (ja) |
NL (1) | NL1032276C2 (ja) |
TW (1) | TWI338820B (ja) |
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US8383322B2 (en) | 2013-02-26 |
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TW200707125A (en) | 2007-02-16 |
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US20070031760A1 (en) | 2007-02-08 |
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