JP4472582B2 - 可撓性回路基板の実装処理方法 - Google Patents

可撓性回路基板の実装処理方法 Download PDF

Info

Publication number
JP4472582B2
JP4472582B2 JP2005155785A JP2005155785A JP4472582B2 JP 4472582 B2 JP4472582 B2 JP 4472582B2 JP 2005155785 A JP2005155785 A JP 2005155785A JP 2005155785 A JP2005155785 A JP 2005155785A JP 4472582 B2 JP4472582 B2 JP 4472582B2
Authority
JP
Japan
Prior art keywords
sheet
circuit board
flexible circuit
fpc
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005155785A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006332441A (ja
Inventor
上 和 夫 井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2005155785A priority Critical patent/JP4472582B2/ja
Priority to TW095117514A priority patent/TW200704319A/zh
Priority to CN2006100918038A priority patent/CN1870884B/zh
Publication of JP2006332441A publication Critical patent/JP2006332441A/ja
Application granted granted Critical
Publication of JP4472582B2 publication Critical patent/JP4472582B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2005155785A 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法 Expired - Fee Related JP4472582B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005155785A JP4472582B2 (ja) 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法
TW095117514A TW200704319A (en) 2005-05-27 2006-05-17 Method of mounting processing for flexible circuit board
CN2006100918038A CN1870884B (zh) 2005-05-27 2006-05-29 挠性电路板的安装处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005155785A JP4472582B2 (ja) 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法

Publications (2)

Publication Number Publication Date
JP2006332441A JP2006332441A (ja) 2006-12-07
JP4472582B2 true JP4472582B2 (ja) 2010-06-02

Family

ID=37444402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005155785A Expired - Fee Related JP4472582B2 (ja) 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法

Country Status (3)

Country Link
JP (1) JP4472582B2 (zh)
CN (1) CN1870884B (zh)
TW (1) TW200704319A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102905458A (zh) * 2011-07-26 2013-01-30 富葵精密组件(深圳)有限公司 具感压胶片的软性电路板装置及其制作方法
CN104118644A (zh) * 2013-04-23 2014-10-29 凯吉凯精密电子技术开发（苏州）有限公司 电路板输送治具
CN103309505A (zh) * 2013-05-23 2013-09-18 无锡力合光电石墨烯应用研发中心有限公司 用于单片式ogs触摸屏与fpc的对位装置及对准方法
JP6873732B2 (ja) * 2017-02-15 2021-05-19 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造システム
CN109436416A (zh) * 2018-11-09 2019-03-08 深圳市新宇腾跃电子有限公司 一种fpc包装方法、fpc包装装置及fpc产品
CN110248481A (zh) * 2019-07-02 2019-09-17 珠海奇川精密设备有限公司 Fpc铝片贴装机
CN110817406B (zh) * 2019-11-06 2021-02-02 昆山中新捷信自动化设备科技有限公司 一种自动转料机构的作业方法
EP4227010A1 (en) * 2020-10-05 2023-08-16 Creative Coatings Co., Ltd. Positioning jig assembly, positioning jig, positioning method for electronic component body, and method for mounting same to transport jig
CN113582125B (zh) * 2021-07-21 2023-06-06 深圳清华大学研究院 一种超滑封装器件及其封装方法
CN114845477A (zh) * 2022-04-08 2022-08-02 瑞华高科技电子工业园(厦门)有限公司 一种超长挠性电路板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0902973B1 (de) * 1996-05-17 2001-10-17 Infineon Technologies AG Trägerelement für einen halbleiterchip
US6012713A (en) * 1998-12-23 2000-01-11 Gleason Service Company, L.C. Reflow pallet with lever arm
US20040154529A1 (en) * 2003-02-07 2004-08-12 Tatsuki Nogiwa Substrate holder, method for producing substrate holder, and method for producing mold

Also Published As

Publication number Publication date
CN1870884B (zh) 2010-12-08
CN1870884A (zh) 2006-11-29
TW200704319A (en) 2007-01-16
TWI353203B (zh) 2011-11-21
JP2006332441A (ja) 2006-12-07

Similar Documents

Publication Publication Date Title
JP4472582B2 (ja) 可撓性回路基板の実装処理方法
JPH1022645A (ja) キャビティ付きプリント配線板の製造方法
JP4659604B2 (ja) フレキシブルプリント配線板の部品実装用搬送冶具への位置決め装置
TWI445472B (zh) A replacement circuit board replacement method for a collective substrate and a collective substrate
JP4862584B2 (ja) フレキシブル配線基板用搬送治具及びそれを用いた電子部品実装方法
JP4692317B2 (ja) 粘着基板、回路基板の製造方法および回路板
JP3014173B2 (ja) フレキシブルプリント配線板の製造方法
JP4330465B2 (ja) 薄型基板用固定治具の製造方法
JP2607633B2 (ja) 離型シート仮止めフレキシブル回路の製法およびその離型シート仮止めフレキシブル回路
JP3916510B2 (ja) 可撓性回路基板およびその製造方法
JPH04154188A (ja) 片面プリント配線板の製造法
JP4703296B2 (ja) 電子部品用固定キャリアの製造方法
JP3233161B2 (ja) フレキシブルプリント回路基板およびその製造方法
JPH1174631A (ja) 電子回路基板
JP4332994B2 (ja) 実装用電子部品及びその製造方法
JPH09312312A (ja) Ｓｍｄパレット一体型ｆｐｃ及びその製造方法
JP2013041963A (ja) プリント配線基板の製造方法
JP2005286147A (ja) 治具付プリント配線板およびその製造方法
JP2006019449A (ja) 基板固定用治具及び基板固定方法
JPH0779194B2 (ja) フレキシブル基板への電気部品の実装方法
JP5533084B2 (ja) フレキシブルプリント基板への部品実装方法及び被搬送シート
JPH04348582A (ja) フレキシブルプリント回路基板及びその製造方法
JPH0785509B2 (ja) キャリアテープ付可撓性回路基板及びその製造法
JP2010129940A (ja) はんだ付け用基板保持具
JP2020155726A (ja) 搬送治具への配線板の固定方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071204

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091218

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100112

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100202

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100303

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130312

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140312

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees