JP4472582B2 - 可撓性回路基板の実装処理方法 - Google Patents

可撓性回路基板の実装処理方法 Download PDF

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Publication number
JP4472582B2
JP4472582B2 JP2005155785A JP2005155785A JP4472582B2 JP 4472582 B2 JP4472582 B2 JP 4472582B2 JP 2005155785 A JP2005155785 A JP 2005155785A JP 2005155785 A JP2005155785 A JP 2005155785A JP 4472582 B2 JP4472582 B2 JP 4472582B2
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JP
Japan
Prior art keywords
sheet
circuit board
flexible circuit
fpc
jig
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Expired - Fee Related
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JP2005155785A
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English (en)
Japanese (ja)
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JP2006332441A (ja
Inventor
上 和 夫 井
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Nippon Mektron KK
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Nippon Mektron KK
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Priority to JP2005155785A priority Critical patent/JP4472582B2/ja
Priority to TW095117514A priority patent/TW200704319A/zh
Priority to CN2006100918038A priority patent/CN1870884B/zh
Publication of JP2006332441A publication Critical patent/JP2006332441A/ja
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Publication of JP4472582B2 publication Critical patent/JP4472582B2/ja
Anticipated expiration legal-status Critical
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  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2005155785A 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法 Expired - Fee Related JP4472582B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005155785A JP4472582B2 (ja) 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法
TW095117514A TW200704319A (en) 2005-05-27 2006-05-17 Method of mounting processing for flexible circuit board
CN2006100918038A CN1870884B (zh) 2005-05-27 2006-05-29 挠性电路板的安装处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005155785A JP4472582B2 (ja) 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法

Publications (2)

Publication Number Publication Date
JP2006332441A JP2006332441A (ja) 2006-12-07
JP4472582B2 true JP4472582B2 (ja) 2010-06-02

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Family Applications (1)

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JP2005155785A Expired - Fee Related JP4472582B2 (ja) 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法

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JP (1) JP4472582B2 (cg-RX-API-DMAC7.html)
CN (1) CN1870884B (cg-RX-API-DMAC7.html)
TW (1) TW200704319A (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102905458A (zh) * 2011-07-26 2013-01-30 富葵精密组件(深圳)有限公司 具感压胶片的软性电路板装置及其制作方法
CN104118644A (zh) * 2013-04-23 2014-10-29 凯吉凯精密电子技术开发（苏州）有限公司 电路板输送治具
CN103309505A (zh) * 2013-05-23 2013-09-18 无锡力合光电石墨烯应用研发中心有限公司 用于单片式ogs触摸屏与fpc的对位装置及对准方法
JP6873732B2 (ja) * 2017-02-15 2021-05-19 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造システム
CN109436416A (zh) * 2018-11-09 2019-03-08 深圳市新宇腾跃电子有限公司 一种fpc包装方法、fpc包装装置及fpc产品
CN110248481B (zh) * 2019-07-02 2025-02-25 珠海奇川精密设备有限公司 Fpc铝片贴装机
CN110817406B (zh) * 2019-11-06 2021-02-02 昆山中新捷信自动化设备科技有限公司 一种自动转料机构的作业方法
KR102795587B1 (ko) * 2020-10-05 2025-04-15 가부시키가이샤 크리에이티브 코팅즈 위치 결정 지그 어셈블리 및 위치 결정 지그 그리고 전자부품 본체의 위치 결정 방법 및 반송 지그로의 장착 방법
CN113582125B (zh) * 2021-07-21 2023-06-06 深圳清华大学研究院 一种超滑封装器件及其封装方法
CN114845477B (zh) * 2022-04-08 2024-10-25 瑞华高科技电子工业园(厦门)有限公司 一种超长挠性电路板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2166082T3 (es) * 1996-05-17 2002-04-01 Infineon Technologies Ag Elemento de soporte para un chip de semiconductores.
US6012713A (en) * 1998-12-23 2000-01-11 Gleason Service Company, L.C. Reflow pallet with lever arm
CN100377634C (zh) * 2003-02-07 2008-03-26 松下电器产业株式会社 基板保持器具及其制造方法

Also Published As

Publication number Publication date
TW200704319A (en) 2007-01-16
CN1870884A (zh) 2006-11-29
JP2006332441A (ja) 2006-12-07
TWI353203B (cg-RX-API-DMAC7.html) 2011-11-21
CN1870884B (zh) 2010-12-08

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