ES2166082T3 - Elemento de soporte para un chip de semiconductores. - Google Patents
Elemento de soporte para un chip de semiconductores.Info
- Publication number
- ES2166082T3 ES2166082T3 ES97923818T ES97923818T ES2166082T3 ES 2166082 T3 ES2166082 T3 ES 2166082T3 ES 97923818 T ES97923818 T ES 97923818T ES 97923818 T ES97923818 T ES 97923818T ES 2166082 T3 ES2166082 T3 ES 2166082T3
- Authority
- ES
- Spain
- Prior art keywords
- semiconductor chip
- support element
- carrier element
- structured
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
LA INVENCION SE REFIERE A UN SUSTRATO PARA UN CHIP SEMICONDUCTOR, QUE SIRVA TANTO PARA INSTALAR EN TARJETAS CHIP COMO PARA SOLDARLO SOBRE TARJETAS UTILIZANDO LA TECNICA SMD. PARA ELLO EL REVESTIMIENTO DE COBRE DE UNA LAMINA DE PLASTICO (1) ESTA ESTRUCTURADO MEDIANTE ATAQUE QUIMICO DE TAL MANERA QUE SE FORMEN UNAS SUPERFICIES DE CONTACTO (3) DE UNA SOLA PIEZA CON UNAS PISTAS DE CONTACTO (4) QUE TERMINEN EN EL BORDE DEL SUSTRATO, Y QUE PERMITAN SOLDARLO CON SEGURIDAD.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19620025A DE19620025A1 (de) | 1996-05-17 | 1996-05-17 | Trägerelement für einen Halbleiterchip |
DE19635732A DE19635732A1 (de) | 1996-09-03 | 1996-09-03 | Trägerelement für einen Halbleiterchip |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2166082T3 true ES2166082T3 (es) | 2002-04-01 |
Family
ID=26025806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97923818T Expired - Lifetime ES2166082T3 (es) | 1996-05-17 | 1997-05-14 | Elemento de soporte para un chip de semiconductores. |
Country Status (13)
Country | Link |
---|---|
US (1) | US6326683B1 (es) |
EP (1) | EP0902973B1 (es) |
JP (1) | JP3080175B2 (es) |
KR (1) | KR20000010876A (es) |
CN (1) | CN1134064C (es) |
AT (1) | ATE207243T1 (es) |
BR (1) | BR9709319A (es) |
DE (1) | DE59704976D1 (es) |
ES (1) | ES2166082T3 (es) |
IN (1) | IN190208B (es) |
RU (1) | RU2156521C2 (es) |
UA (1) | UA46842C2 (es) |
WO (1) | WO1997044823A1 (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2177447A1 (es) * | 2000-12-29 | 2002-12-01 | Lear Automotive Eeds Spain | Circuito electronico con terminales de conexion integrados y metodo para su fabricacion. |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6803656B2 (en) * | 1997-12-31 | 2004-10-12 | Micron Technology, Inc. | Semiconductor device including combed bond pad opening |
JP3532123B2 (ja) * | 1999-07-06 | 2004-05-31 | 日本圧着端子製造株式会社 | 集積回路内蔵カード |
JP3494100B2 (ja) * | 2000-01-11 | 2004-02-03 | 富士通株式会社 | 半導体装置及びその実装方法 |
EP1119047A1 (de) * | 2000-01-18 | 2001-07-25 | Infineon Technologies AG | Flächiger Träger für ein Chipmodul und Herstellungsverfahren für ein Chipmodul |
CA2524328C (en) * | 2003-05-09 | 2011-01-04 | Widex A/S | A method for manufacturing a carrier element for a hearing aid and a carrier element for a hearing aid |
JP4037332B2 (ja) * | 2003-07-10 | 2008-01-23 | シャープ株式会社 | Icモジュールおよびicカード |
DE10352079A1 (de) * | 2003-11-08 | 2005-06-02 | Robert Bosch Gmbh | Elektromotor, sowie Verfahren zur Herstellung eines solchen |
DE102004011702B4 (de) * | 2004-03-10 | 2006-02-16 | Circle Smart Card Ag | Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte |
JP4472582B2 (ja) * | 2005-05-27 | 2010-06-02 | 日本メクトロン株式会社 | 可撓性回路基板の実装処理方法 |
EP2189928A1 (fr) * | 2008-11-21 | 2010-05-26 | Gemalto SA | Dispositif à circuit integré muni de différents moyens de connexion |
WO2011087168A1 (ko) * | 2010-01-15 | 2011-07-21 | 삼성엘이디 주식회사 | 인쇄회로기판 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
CN103928431B (zh) * | 2012-10-31 | 2017-03-01 | 矽力杰半导体技术(杭州)有限公司 | 一种倒装封装装置 |
US9368427B2 (en) * | 2013-02-01 | 2016-06-14 | Mxtran Inc. | Integrated circuit film and method of manufacturing the same |
US9418254B2 (en) * | 2013-02-01 | 2016-08-16 | Mxtran Inc. | Integrated circuit film and method for manipulating the same |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
US20160314721A1 (en) * | 2015-04-24 | 2016-10-27 | Kabushiki Kaisha Toshiba | Anti-tamper label and storage device with the same |
CN107025481B (zh) * | 2016-02-02 | 2021-08-20 | 上海伯乐电子有限公司 | 柔性印制电路板及应用其的智能卡模块和智能卡 |
DE102016110780A1 (de) | 2016-06-13 | 2017-12-14 | Infineon Technologies Austria Ag | Chipkartenmodul und Verfahren zum Herstellen eines Chipkartenmoduls |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
DE3046192A1 (de) * | 1980-12-08 | 1982-07-15 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer ic-bausteine |
DE3123198C2 (de) | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
DE3234745C2 (de) | 1982-09-20 | 1986-03-06 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Handhabung von filmmontierten integrierten Schaltkreisen und Vorrichtung zu seiner Durchführung |
FR2548857B1 (fr) | 1983-07-04 | 1987-11-27 | Cortaillod Cables Sa | Procede de fabrication en continu d'une carte imprimee |
FR2588695B1 (fr) * | 1985-10-11 | 1988-07-29 | Eurotechnique Sa | Procede de fabrication d'un microboitier, microboitier a contacts effleurants et application aux cartes contenant des composants |
FR2617668B1 (fr) * | 1987-07-03 | 1995-07-07 | Radiotechnique Compelec | Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant |
GB8723734D0 (en) | 1987-10-09 | 1987-11-11 | De La Rue Co Plc | Ic modules |
FR2624651B1 (fr) * | 1987-12-14 | 1991-09-06 | Sgs Thomson Microelectronics | Procede de mise en place d'un composant electronique et de ses connexions electriques sur un support et produit ainsi obtenu |
DE3809005A1 (de) * | 1988-03-17 | 1989-09-28 | Hitachi Semiconductor Europ Gm | Chipmodul und seine herstellung und verwendung |
US5162894A (en) * | 1988-05-24 | 1992-11-10 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit having a dummy lead and shaped inner leads |
DE3901402A1 (de) | 1989-01-19 | 1990-07-26 | Telefonbau & Normalzeit Gmbh | Verfahren zur herstellung einer chipkarte |
US5294829A (en) * | 1990-01-26 | 1994-03-15 | Sgs-Thomson Microelectronics, Inc. | IC package having direct attach backup battery |
US5289034A (en) * | 1990-01-26 | 1994-02-22 | Sgs-Thomson Microelectronics, Inc. | IC package having replaceable backup battery |
US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
JPH05294093A (ja) * | 1991-03-22 | 1993-11-09 | Toshiba Corp | 携帯可能記憶媒体 |
JP2509422B2 (ja) * | 1991-10-30 | 1996-06-19 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
FR2684236B1 (fr) * | 1991-11-27 | 1998-08-21 | Gemplus Card Int | Dispositif de connexion de circuit integre. |
JPH0653277A (ja) * | 1992-06-04 | 1994-02-25 | Lsi Logic Corp | 半導体装置アセンブリおよびその組立方法 |
DE4232625A1 (de) | 1992-09-29 | 1994-03-31 | Siemens Ag | Verfahren zur Montage von integrierten Halbleiterschaltkreisen |
CH686325A5 (de) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. |
JPH1032221A (ja) * | 1996-07-12 | 1998-02-03 | Nec Corp | プリント配線基板 |
JP3176307B2 (ja) * | 1997-03-03 | 2001-06-18 | 日本電気株式会社 | 集積回路装置の実装構造およびその製造方法 |
-
1997
- 1997-05-14 BR BR9709319-0A patent/BR9709319A/pt not_active IP Right Cessation
- 1997-05-14 EP EP97923818A patent/EP0902973B1/de not_active Expired - Lifetime
- 1997-05-14 UA UA98116047A patent/UA46842C2/uk unknown
- 1997-05-14 RU RU98122611/28A patent/RU2156521C2/ru not_active IP Right Cessation
- 1997-05-14 DE DE59704976T patent/DE59704976D1/de not_active Expired - Lifetime
- 1997-05-14 JP JP09541367A patent/JP3080175B2/ja not_active Expired - Fee Related
- 1997-05-14 KR KR1019980709020A patent/KR20000010876A/ko active IP Right Grant
- 1997-05-14 AT AT97923818T patent/ATE207243T1/de active
- 1997-05-14 ES ES97923818T patent/ES2166082T3/es not_active Expired - Lifetime
- 1997-05-14 WO PCT/DE1997/000977 patent/WO1997044823A1/de active IP Right Grant
- 1997-05-14 CN CNB971946736A patent/CN1134064C/zh not_active Expired - Fee Related
- 1997-05-16 IN IN885CA1997 patent/IN190208B/en unknown
-
1998
- 1998-11-17 US US09/193,577 patent/US6326683B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2177447A1 (es) * | 2000-12-29 | 2002-12-01 | Lear Automotive Eeds Spain | Circuito electronico con terminales de conexion integrados y metodo para su fabricacion. |
Also Published As
Publication number | Publication date |
---|---|
EP0902973A1 (de) | 1999-03-24 |
JP3080175B2 (ja) | 2000-08-21 |
WO1997044823A1 (de) | 1997-11-27 |
CN1218575A (zh) | 1999-06-02 |
EP0902973B1 (de) | 2001-10-17 |
KR20000010876A (ko) | 2000-02-25 |
ATE207243T1 (de) | 2001-11-15 |
BR9709319A (pt) | 2000-05-09 |
JPH11510652A (ja) | 1999-09-14 |
IN190208B (es) | 2003-06-28 |
DE59704976D1 (de) | 2001-11-22 |
UA46842C2 (uk) | 2002-06-17 |
US6326683B1 (en) | 2001-12-04 |
RU2156521C2 (ru) | 2000-09-20 |
CN1134064C (zh) | 2004-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2166082T3 (es) | Elemento de soporte para un chip de semiconductores. | |
GB2296602B (en) | A surface-mountable electronic component | |
HK1061926A1 (en) | Contacting device for a chip card | |
RU98122611A (ru) | Несущий элемент для полупроводниковой микросхемы | |
RU99115169A (ru) | Несущий элемент для полупроводникового кристалла, предназначенный для встраивания в карточку с интегральными схемами | |
WO2003028044A3 (de) | Nicht-leitendes, ein band oder einen nutzen bildendes substrat, auf dem eine vielzahl von trägerelementen ausgebildet ist | |
ATE228291T1 (de) | Steckkarte für elektronische geräte | |
SE9800709D0 (sv) | Ledare | |
TW340256B (en) | Vertical package mounted on both sides of a printed circuit board | |
SE8300921D0 (sv) | Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort | |
SE9900962L (sv) | Förfarande och anordning för komponentkontaktering | |
DE60130913D1 (de) | Träger für integrierte schaltungen | |
SE9800707D0 (sv) | Motstånd | |
DE59814036D1 (de) | Sub-D-Stecker in SMD-Technik | |
ATE381249T1 (de) | Träger für integrierte schaltungen mit aussparungen | |
DE59913999D1 (de) | Folie als träger von integrierten schaltungen | |
DE502004010730D1 (de) | Elektronische Baugruppe | |
DE50107097D1 (de) | Folienleiterplatte sowie deren Herstellungs- und Montageverfahren | |
DE59902678D1 (de) | An kontaktflächen eines schaltungssubstrats verlötbares, aus blech geformtes elektrisches bauelement mit lötstop | |
DE60102406D1 (de) | ChipKarte mit einer aus einem bereichsweise vorgeschnittenem Träger abtrennnbaren Platte | |
ATE331320T1 (de) | Kontaktierung von leiterplatten bzw. schaltungsträgern | |
KR920005681A (ko) | SMT(Surface mounting technology)가능한 반도체 칩 및 그에 의해 장착되는 SMD(Surface mounted device)보오드의 스트립 장착을 위한 방법 및 장치 | |
WO2004068533A3 (de) | Verfahren zur herstellung einer elektronischen baugruppe | |
ATE215301T1 (de) | Vorrichtung zur kontaktsicherung beim löten von hochpoligen ic-steckverbindern | |
KR970004989A (ko) | 인쇄회로기판상에 칩을 자동납땜시 미납땜 방지장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 902973 Country of ref document: ES |