KR970004989A - 인쇄회로기판상에 칩을 자동납땜시 미납땜 방지장치 - Google Patents
인쇄회로기판상에 칩을 자동납땜시 미납땜 방지장치 Download PDFInfo
- Publication number
- KR970004989A KR970004989A KR1019950015392A KR19950015392A KR970004989A KR 970004989 A KR970004989 A KR 970004989A KR 1019950015392 A KR1019950015392 A KR 1019950015392A KR 19950015392 A KR19950015392 A KR 19950015392A KR 970004989 A KR970004989 A KR 970004989A
- Authority
- KR
- South Korea
- Prior art keywords
- solderless
- circuit board
- printed circuit
- prevention device
- board automatically
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Operations Research (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950015392A KR0148534B1 (ko) | 1995-06-12 | 1995-06-12 | 인쇄회로기판상에 칩을 자동납땜시 미납땜 방지 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950015392A KR0148534B1 (ko) | 1995-06-12 | 1995-06-12 | 인쇄회로기판상에 칩을 자동납땜시 미납땜 방지 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970004989A true KR970004989A (ko) | 1997-01-29 |
KR0148534B1 KR0148534B1 (ko) | 1998-12-15 |
Family
ID=19416870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950015392A KR0148534B1 (ko) | 1995-06-12 | 1995-06-12 | 인쇄회로기판상에 칩을 자동납땜시 미납땜 방지 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0148534B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100325997B1 (ko) * | 1999-08-06 | 2002-03-07 | 윤종용 | 인쇄회로기판 및 그 땜납도포방법 |
-
1995
- 1995-06-12 KR KR1019950015392A patent/KR0148534B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100325997B1 (ko) * | 1999-08-06 | 2002-03-07 | 윤종용 | 인쇄회로기판 및 그 땜납도포방법 |
Also Published As
Publication number | Publication date |
---|---|
KR0148534B1 (ko) | 1998-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20020425 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |