JP4450199B2 - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
- Publication number
- JP4450199B2 JP4450199B2 JP2004288880A JP2004288880A JP4450199B2 JP 4450199 B2 JP4450199 B2 JP 4450199B2 JP 2004288880 A JP2004288880 A JP 2004288880A JP 2004288880 A JP2004288880 A JP 2004288880A JP 4450199 B2 JP4450199 B2 JP 4450199B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- transparent conductive
- light
- insulating protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004288880A JP4450199B2 (ja) | 2004-09-30 | 2004-09-30 | 半導体発光素子 |
| US11/236,882 US7291865B2 (en) | 2004-09-29 | 2005-09-28 | Light-emitting semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004288880A JP4450199B2 (ja) | 2004-09-30 | 2004-09-30 | 半導体発光素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006108161A JP2006108161A (ja) | 2006-04-20 |
| JP2006108161A5 JP2006108161A5 (enExample) | 2007-03-15 |
| JP4450199B2 true JP4450199B2 (ja) | 2010-04-14 |
Family
ID=36377565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004288880A Expired - Lifetime JP4450199B2 (ja) | 2004-09-29 | 2004-09-30 | 半導体発光素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4450199B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107180900A (zh) * | 2016-03-11 | 2017-09-19 | 三星电子株式会社 | 发光器件 |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4956902B2 (ja) * | 2005-03-18 | 2012-06-20 | 三菱化学株式会社 | GaN系発光ダイオードおよびそれを用いた発光装置 |
| JP2007027539A (ja) * | 2005-07-20 | 2007-02-01 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびこれを用いた照明装置 |
| JP4867223B2 (ja) * | 2005-07-25 | 2012-02-01 | パナソニック株式会社 | 半導体発光素子およびこれを用いた照明装置 |
| JP5162909B2 (ja) | 2006-04-03 | 2013-03-13 | 豊田合成株式会社 | 半導体発光素子 |
| US7573074B2 (en) * | 2006-05-19 | 2009-08-11 | Bridgelux, Inc. | LED electrode |
| US8026527B2 (en) * | 2007-12-06 | 2011-09-27 | Bridgelux, Inc. | LED structure |
| JP2010192835A (ja) * | 2009-02-20 | 2010-09-02 | Showa Denko Kk | 発光ダイオード及びその製造方法、並びに発光ダイオードランプ |
| JP5586860B2 (ja) * | 2009-02-25 | 2014-09-10 | 日亜化学工業株式会社 | 半導体発光素子及び半導体発光装置 |
| JP5332882B2 (ja) * | 2009-04-30 | 2013-11-06 | 豊田合成株式会社 | 半導体発光素子 |
| JP5543164B2 (ja) * | 2009-09-25 | 2014-07-09 | 豊田合成株式会社 | 発光素子 |
| JP5849388B2 (ja) * | 2010-11-04 | 2016-01-27 | サンケン電気株式会社 | 半導体発光装置 |
| JP5659728B2 (ja) * | 2010-11-22 | 2015-01-28 | パナソニックIpマネジメント株式会社 | 発光素子 |
| JP2012124306A (ja) | 2010-12-08 | 2012-06-28 | Toyoda Gosei Co Ltd | 半導体発光素子 |
| JP5304855B2 (ja) * | 2011-08-12 | 2013-10-02 | 三菱化学株式会社 | GaN系発光ダイオードおよびそれを用いた発光装置 |
| JP5743806B2 (ja) | 2011-08-23 | 2015-07-01 | シャープ株式会社 | 窒化物半導体発光素子、窒化物半導体発光装置、及び窒化物半導体発光素子の製造方法 |
| KR101740531B1 (ko) * | 2012-07-02 | 2017-06-08 | 서울바이오시스 주식회사 | 표면 실장용 발광 다이오드 모듈 및 이의 제조방법. |
| US9461212B2 (en) | 2012-07-02 | 2016-10-04 | Seoul Viosys Co., Ltd. | Light emitting diode module for surface mount technology and method of manufacturing the same |
| US9536924B2 (en) | 2012-12-06 | 2017-01-03 | Seoul Viosys Co., Ltd. | Light-emitting diode and application therefor |
| DE112013005849T5 (de) | 2012-12-06 | 2015-08-20 | Seoul Viosys Co., Ltd. | Lichtemittierende Diode und Anwendung dafür |
| CN107924967A (zh) | 2015-07-22 | 2018-04-17 | Lg 伊诺特有限公司 | 发光元件封装件 |
| JP6624930B2 (ja) | 2015-12-26 | 2019-12-25 | 日亜化学工業株式会社 | 発光素子及びその製造方法 |
| JP6683003B2 (ja) | 2016-05-11 | 2020-04-15 | 日亜化学工業株式会社 | 半導体素子、半導体装置及び半導体素子の製造方法 |
| JP6720747B2 (ja) | 2016-07-19 | 2020-07-08 | 日亜化学工業株式会社 | 半導体装置、基台及びそれらの製造方法 |
| CN113410361B (zh) * | 2021-04-29 | 2023-06-09 | 华灿光电(浙江)有限公司 | 具有复合保护层的发光二极管芯片及其制备方法 |
-
2004
- 2004-09-30 JP JP2004288880A patent/JP4450199B2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107180900A (zh) * | 2016-03-11 | 2017-09-19 | 三星电子株式会社 | 发光器件 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006108161A (ja) | 2006-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4450199B2 (ja) | 半導体発光素子 | |
| JP4453515B2 (ja) | 半導体発光素子 | |
| JP4882792B2 (ja) | 半導体発光素子 | |
| JP5130730B2 (ja) | 半導体発光素子 | |
| US7947996B2 (en) | Semiconductor light emitting element | |
| US9117973B2 (en) | Semiconductor light emitting element | |
| JP5719110B2 (ja) | 発光素子 | |
| JP5582054B2 (ja) | 半導体発光素子 | |
| JP5494005B2 (ja) | 半導体発光素子 | |
| US9178116B2 (en) | Semiconductor light-emitting element | |
| TWI462326B (zh) | 半導體發光元件 | |
| CN102456799B (zh) | 半导体发光器件及其制造方法 | |
| JP5381853B2 (ja) | 半導体発光素子 | |
| JP2006100500A (ja) | 半導体発光素子及びその製造方法 | |
| KR20190090485A (ko) | 반도체 발광소자 | |
| JP5719496B2 (ja) | 半導体発光素子及び発光装置、及び半導体発光素子の製造方法 | |
| JP2005175462A (ja) | 半導体発光素子及びその製造方法 | |
| JP2006128450A (ja) | Iii族窒化物半導体発光素子 | |
| JP5326383B2 (ja) | 発光装置 | |
| JP5378131B2 (ja) | 窒化物半導体発光ダイオード素子 | |
| JP4868821B2 (ja) | 窒化ガリウム系化合物半導体及び発光素子 | |
| JP2006013034A (ja) | Iii族窒化物系化合物半導体発光素子及び半導体発光素子の製造方法 | |
| JP5900400B2 (ja) | Iii族窒化物半導体発光素子の製造方法 | |
| JP5652358B2 (ja) | 半導体発光素子、ランプおよび半導体発光素子の製造方法 | |
| JP2007258277A (ja) | 半導体発光素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070130 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070222 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090818 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090825 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091026 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100106 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4450199 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100119 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130205 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140205 Year of fee payment: 4 |
|
| EXPY | Cancellation because of completion of term |