JP4445457B2 - フィルム剥離装置 - Google Patents
フィルム剥離装置 Download PDFInfo
- Publication number
- JP4445457B2 JP4445457B2 JP2005327082A JP2005327082A JP4445457B2 JP 4445457 B2 JP4445457 B2 JP 4445457B2 JP 2005327082 A JP2005327082 A JP 2005327082A JP 2005327082 A JP2005327082 A JP 2005327082A JP 4445457 B2 JP4445457 B2 JP 4445457B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- peeling
- roller
- knurling
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010408 film Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 18
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000013039 cover film Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005327082A JP4445457B2 (ja) | 2005-11-11 | 2005-11-11 | フィルム剥離装置 |
TW095122427A TWI387857B (zh) | 2005-11-11 | 2006-06-22 | 膜剝離裝置 |
KR1020060057101A KR101195344B1 (ko) | 2005-11-11 | 2006-06-23 | 필름박리장치 |
CN2006101063200A CN1963665B (zh) | 2005-11-11 | 2006-07-19 | 薄膜剥离装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005327082A JP4445457B2 (ja) | 2005-11-11 | 2005-11-11 | フィルム剥離装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007131424A JP2007131424A (ja) | 2007-05-31 |
JP2007131424A5 JP2007131424A5 (zh) | 2008-05-22 |
JP4445457B2 true JP4445457B2 (ja) | 2010-04-07 |
Family
ID=38082769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005327082A Active JP4445457B2 (ja) | 2005-11-11 | 2005-11-11 | フィルム剥離装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4445457B2 (zh) |
KR (1) | KR101195344B1 (zh) |
CN (1) | CN1963665B (zh) |
TW (1) | TWI387857B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101204124B1 (ko) * | 2010-07-28 | 2012-11-22 | 삼성전기주식회사 | 보호필름 필링장치 및 필링방법 |
KR102128396B1 (ko) | 2013-10-22 | 2020-07-01 | 삼성디스플레이 주식회사 | 필름 박리 장치 |
JP2016147737A (ja) * | 2015-02-12 | 2016-08-18 | 富士フイルム株式会社 | 積層フィルムの剥離方法、及び機能性フィルムの製造方法 |
JP2024061708A (ja) | 2022-10-23 | 2024-05-08 | 株式会社アドテックエンジニアリング | フィルム剥離装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2644184B2 (ja) * | 1994-06-06 | 1997-08-25 | ソマール株式会社 | フィルム剥離方法及び装置 |
JP2002211836A (ja) | 2001-01-11 | 2002-07-31 | Adtec Engineeng Co Ltd | フィルム剥離装置 |
JP3970813B2 (ja) * | 2002-09-05 | 2007-09-05 | 三星コーニング精密琉璃株式会社 | フィルム除去装置及びフィルム除去方法 |
JPWO2005070573A1 (ja) * | 2004-01-21 | 2007-12-27 | 松下電器産業株式会社 | ディスプレイパネルのフィルム剥離方法及びフィルム剥離装置 |
-
2005
- 2005-11-11 JP JP2005327082A patent/JP4445457B2/ja active Active
-
2006
- 2006-06-22 TW TW095122427A patent/TWI387857B/zh active
- 2006-06-23 KR KR1020060057101A patent/KR101195344B1/ko active IP Right Grant
- 2006-07-19 CN CN2006101063200A patent/CN1963665B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR101195344B1 (ko) | 2012-10-29 |
CN1963665A (zh) | 2007-05-16 |
CN1963665B (zh) | 2011-08-17 |
TW200719096A (en) | 2007-05-16 |
JP2007131424A (ja) | 2007-05-31 |
TWI387857B (zh) | 2013-03-01 |
KR20070050756A (ko) | 2007-05-16 |
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