JP4439518B2 - 高圧処理中にウエハを保持する真空チャック、高圧洗浄処理装置及び高圧洗浄処理方法 - Google Patents
高圧処理中にウエハを保持する真空チャック、高圧洗浄処理装置及び高圧洗浄処理方法 Download PDFInfo
- Publication number
- JP4439518B2 JP4439518B2 JP2006523197A JP2006523197A JP4439518B2 JP 4439518 B2 JP4439518 B2 JP 4439518B2 JP 2006523197 A JP2006523197 A JP 2006523197A JP 2006523197 A JP2006523197 A JP 2006523197A JP 4439518 B2 JP4439518 B2 JP 4439518B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- vacuum chuck
- platen
- vacuum
- pressure cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims description 20
- 238000003672 processing method Methods 0.000 title description 7
- 238000009931 pascalization Methods 0.000 title description 6
- 238000000034 method Methods 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 292
- 230000006641 stabilisation Effects 0.000 description 10
- 238000011105 stabilization Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000006184 cosolvent Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49998—Work holding
Description
本特許出願は、2003年8月11日付けで出願された「高圧処理中にウエハを保持する真空チャック装置及び方法」という名称の米国特許出願番号10/639,224の米国特許法第119条(e)の優先権を主張し、ここではこの出願が参照される。
Claims (9)
- 超臨界状態の下で高圧洗浄処理する時にウエハを保持する真空チャックであって、
湾曲した凹状の窪んだ表面を有するウエハプラテンと、
前記ウエハプラテンに形成された真空溝と、を備え、
前記窪んだ表面は、前記ウエハと同じかそれよりも大きな外径を有しており、
前記真空溝は、前記窪んだ表面の内側に配置され、
前記真空溝が吸引することおよび前記超臨界状態の高圧により、前記ウエハと前記窪んだ表面との間のシール可能な係合を形成することを特徴とする真空チャック。 - 前記ウエハの下側は粗くされている請求項1に記載の真空チャック。
- 前記ウエハプラテンに形成され、第1の位置と第2の位置との間を移動可能なピンの組みを更に備える請求項1または2に記載の真空チャック。
- ウエハを超臨界状態の下で高圧洗浄処理する高圧洗浄処理装置であって、
処理チャンバと、
前記処理チャンバ内に配置されて、前記ウエハを保持する真空チャックと、を備え、
前記真空チャックは、
湾曲した凹状の窪んだ表面を有するウエハプラテンと、
前記ウエハプラテンに形成された真空溝と、を備え、
前記窪んだ表面は、前記ウエハと同じかそれよりも大きな外径を有しており、
前記真空溝は、前記窪んだ表面の内側に配置され、
前記ウエハは、前記真空溝が吸引することおよび前記超臨界状態の高圧により、前記ウエハと前記窪んだ表面との間のシール可能な係合を形成することを特徴とする高圧洗浄処理装置。 - 前記ウエハの下側は粗くされている請求項4に記載の高圧洗浄処理装置。
- 前記真空チャックは、
前記ウエハプラテンに形成され、第1の位置と第2の位置との間を移動可能なピンの組みを更に備える請求項4または5に記載の高圧洗浄処理装置。 - ウエハを超臨界状態の下で高圧洗浄処理する高圧洗浄処理方法であって、
a.前記ウエハを受けるために、湾曲した凹状の窪んだ表面を有するウエハプラテンを有する真空チャックを提供するステップと、
b.前記ウエハを前記真空チャック上に配置するステップと、
c.前記ウエハプラテンに形成された真空溝が吸引すること、および前記高圧洗浄処理により前記ウエハに高圧を印加することにより、前記ウエハを前記凹状の窪んだ表面に密着させてシール可能な係合を形成するステップと、
d.前記ウエハを高圧下で前記高圧洗浄処理するステップと、を備える方法。 - 前記高圧洗浄処理終了後に、前記凹状の窪んだ表面とのシール可能な係合位置からの前記ウエハの係合を自動的に解く前記ウエハを取り外すステップを更に備える請求項7に記載の方法。
- 前記真空チャックから外した前記ウエハを、前記凹状の窪んだ表面に形成された移動可能なピンの組みにより上昇させるステップを更に備える請求項7または8に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/639,224 US20050035514A1 (en) | 2003-08-11 | 2003-08-11 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
PCT/US2004/022459 WO2005018870A1 (en) | 2003-08-11 | 2004-07-12 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007502538A JP2007502538A (ja) | 2007-02-08 |
JP4439518B2 true JP4439518B2 (ja) | 2010-03-24 |
Family
ID=34135834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006523197A Expired - Fee Related JP4439518B2 (ja) | 2003-08-11 | 2004-07-12 | 高圧処理中にウエハを保持する真空チャック、高圧洗浄処理装置及び高圧洗浄処理方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050035514A1 (ja) |
JP (1) | JP4439518B2 (ja) |
TW (1) | TW200507043A (ja) |
WO (1) | WO2005018870A1 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7396022B1 (en) * | 2004-09-28 | 2008-07-08 | Kla-Tencor Technologies Corp. | System and method for optimizing wafer flatness at high rotational speeds |
US7410888B2 (en) * | 2004-12-30 | 2008-08-12 | Texas Instruments Incorporated | Method for manufacturing strained silicon |
US8215946B2 (en) * | 2006-05-18 | 2012-07-10 | Molecular Imprints, Inc. | Imprint lithography system and method |
DE102006042026B4 (de) | 2006-09-07 | 2016-08-04 | Infineon Technologies Ag | Vorrichtung zum Halten eines Substrats und Verfahren zur Behandlung eines Substrats |
KR100903306B1 (ko) * | 2008-10-08 | 2009-06-16 | 주식회사 아이피에스 | 진공처리장치 |
US8691663B2 (en) * | 2009-11-06 | 2014-04-08 | Alliance For Sustainable Energy, Llc | Methods of manipulating stressed epistructures |
ES2354793B1 (es) * | 2010-11-26 | 2012-01-26 | Loxin 2002, S.L | Soporte para el mecanizado de chapas y otros elementos de reducido espesor. |
TWI437672B (zh) | 2011-12-16 | 2014-05-11 | 利用氣體充壓以抑制載板翹曲的載板固定方法 | |
DE102012104011A1 (de) * | 2012-05-08 | 2013-11-14 | Schott Solar Ag | Flächensauggreifer mit konkaver Saugplatte |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD765084S1 (en) * | 2013-09-10 | 2016-08-30 | Apple Inc. | Input for an electronic device |
US10373995B2 (en) | 2014-09-19 | 2019-08-06 | Microsoft Technology Licensing, Llc | Image sensor bending using tension |
US9570488B2 (en) | 2014-09-19 | 2017-02-14 | Microsoft Technology Licensing, Llc | Image sensor bending by induced substrate swelling |
DE102014118830A1 (de) * | 2014-12-17 | 2016-06-23 | Mechatronic Systemtechnik Gmbh | Vakuumspannvorrichtung zum Aufspannen von Werkstücken |
US9870927B2 (en) * | 2015-04-02 | 2018-01-16 | Microsoft Technology Licensing, Llc | Free-edge semiconductor chip bending |
US10304900B2 (en) | 2015-04-02 | 2019-05-28 | Microsoft Technology Licensing, Llc | Bending semiconductor chip in molds having radially varying curvature |
WO2017086339A1 (ja) * | 2015-11-16 | 2017-05-26 | 株式会社タカトリ | ワイヤソー装置並びに被加工物の加工方法及び加工装置 |
US10062727B2 (en) | 2016-09-09 | 2018-08-28 | Microsoft Technology Licensing, Llc | Strain relieving die for curved image sensors |
US10468290B2 (en) | 2016-11-02 | 2019-11-05 | Ultratech, Inc. | Wafer chuck apparatus with micro-channel regions |
JP6820189B2 (ja) * | 2016-12-01 | 2021-01-27 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
TW201834135A (zh) * | 2016-12-08 | 2018-09-16 | 美商精微超科技公司 | 用於固定變形晶圓之具可收縮密封裝置之晶圓卡盤設備 |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
FR3073322B1 (fr) * | 2017-11-07 | 2021-12-03 | Commissariat Energie Atomique | Procede de realisation d'au moins un circuit electronique courbe |
WO2019094421A1 (en) | 2017-11-10 | 2019-05-16 | Applied Materials, Inc. | Patterned chuck for double-sided processing |
CN108098628B (zh) * | 2017-12-15 | 2020-10-27 | 芜湖致通汽车电子有限公司 | 一种用于传感器芯片固晶的夹紧装置 |
CN111742402A (zh) | 2018-02-20 | 2020-10-02 | 应用材料公司 | 用于双面处理的图案化真空吸盘 |
CN112729158B (zh) * | 2019-12-26 | 2022-12-27 | 南京力安半导体有限公司 | 晶圆几何参数的测量方法 |
US11508608B2 (en) * | 2020-08-20 | 2022-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Vacuum wafer chuck for manufacturing semiconductor devices |
TWI794731B (zh) * | 2021-01-15 | 2023-03-01 | 由田新技股份有限公司 | 氣浮載台及其光學檢測系統 |
CN114454092B (zh) * | 2021-03-02 | 2023-03-21 | 华中科技大学 | 晶圆磨削用旋转顶升吸附平台 |
US11851761B2 (en) * | 2021-04-16 | 2023-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing tool |
Family Cites Families (115)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2625886A (en) * | 1947-08-21 | 1953-01-20 | American Brake Shoe Co | Pump |
US2617719A (en) * | 1950-12-29 | 1952-11-11 | Stanolind Oil & Gas Co | Cleaning porous media |
US2873597A (en) * | 1955-08-08 | 1959-02-17 | Victor T Fahringer | Apparatus for sealing a pressure vessel |
US3521765A (en) * | 1967-10-31 | 1970-07-28 | Western Electric Co | Closed-end machine for processing articles in a controlled atmosphere |
US3681171A (en) * | 1968-08-23 | 1972-08-01 | Hitachi Ltd | Apparatus for producing a multilayer printed circuit plate assembly |
US3623627A (en) * | 1969-08-22 | 1971-11-30 | Hunt Co Rodney | Door construction for a pressure vessel |
US3652075A (en) * | 1969-11-10 | 1972-03-28 | Sheldon Thompson | Vacuum chuck and related apparatus and methods |
US3689025A (en) * | 1970-07-30 | 1972-09-05 | Elmer P Kiser | Air loaded valve |
US3744660A (en) * | 1970-12-30 | 1973-07-10 | Combustion Eng | Shield for nuclear reactor vessel |
US3968885A (en) * | 1973-06-29 | 1976-07-13 | International Business Machines Corporation | Method and apparatus for handling workpieces |
US4341592A (en) * | 1975-08-04 | 1982-07-27 | Texas Instruments Incorporated | Method for removing photoresist layer from substrate by ozone treatment |
US4029517A (en) * | 1976-03-01 | 1977-06-14 | Autosonics Inc. | Vapor degreasing system having a divider wall between upper and lower vapor zone portions |
US4091643A (en) * | 1976-05-14 | 1978-05-30 | Ama Universal S.P.A. | Circuit for the recovery of solvent vapor evolved in the course of a cleaning cycle in dry-cleaning machines or plants, and for the de-pressurizing of such machines |
GB1594935A (en) * | 1976-11-01 | 1981-08-05 | Gen Descaling Co Ltd | Closure for pipe or pressure vessel and seal therefor |
JPS5448172A (en) * | 1977-09-24 | 1979-04-16 | Tokyo Ouka Kougiyou Kk | Plasma reaction processor |
US4367140A (en) * | 1979-11-05 | 1983-01-04 | Sykes Ocean Water Ltd. | Reverse osmosis liquid purification apparatus |
DE3110341C2 (de) * | 1980-03-19 | 1983-11-17 | Hitachi, Ltd., Tokyo | Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes |
JPS56130738A (en) * | 1980-03-19 | 1981-10-13 | Hitachi Ltd | Method and device for exposure |
US4355937A (en) * | 1980-12-24 | 1982-10-26 | International Business Machines Corporation | Low shock transmissive antechamber seal mechanisms for vacuum chamber type semi-conductor wafer electron beam writing apparatus |
DE3112434A1 (de) * | 1981-03-28 | 1982-10-07 | Depa GmbH, 4000 Düsseldorf | Druckluftgetriebene doppelmembran-pumpe |
US4682937A (en) * | 1981-11-12 | 1987-07-28 | The Coca-Cola Company | Double-acting diaphragm pump and reversing mechanism therefor |
DE3145815C2 (de) * | 1981-11-19 | 1984-08-09 | AGA Gas GmbH, 2102 Hamburg | Verfahren zum Entfernen von ablösungsfähigen Materialschichten von beschichteten Gegenständen, |
US4426358A (en) * | 1982-04-28 | 1984-01-17 | Johansson Arne I | Fail-safe device for a lid of a pressure vessel |
DE3238768A1 (de) * | 1982-10-20 | 1984-04-26 | Kurt Wolf & Co Kg, 7547 Wildbad | Kochgefaess aus kochtopf und deckel, insbesondere dampfdruckkochtopf |
FR2536433A1 (fr) * | 1982-11-19 | 1984-05-25 | Privat Michel | Procede et installation de nettoyage et decontamination particulaire de vetements, notamment de vetements contamines par des particules radioactives |
US4626509A (en) * | 1983-07-11 | 1986-12-02 | Data Packaging Corp. | Culture media transfer assembly |
US4865061A (en) * | 1983-07-22 | 1989-09-12 | Quadrex Hps, Inc. | Decontamination apparatus for chemically and/or radioactively contaminated tools and equipment |
US4549467A (en) * | 1983-08-03 | 1985-10-29 | Wilden Pump & Engineering Co. | Actuator valve |
GB8332394D0 (en) * | 1983-12-05 | 1984-01-11 | Pilkington Brothers Plc | Coating apparatus |
US4960140A (en) * | 1984-11-30 | 1990-10-02 | Ishijima Industrial Co., Ltd. | Washing arrangement for and method of washing lead frames |
US4693777A (en) * | 1984-11-30 | 1987-09-15 | Kabushiki Kaisha Toshiba | Apparatus for producing semiconductor devices |
US4788043A (en) * | 1985-04-17 | 1988-11-29 | Tokuyama Soda Kabushiki Kaisha | Process for washing semiconductor substrate with organic solvent |
US4778356A (en) * | 1985-06-11 | 1988-10-18 | Hicks Cecil T | Diaphragm pump |
US4749440A (en) * | 1985-08-28 | 1988-06-07 | Fsi Corporation | Gaseous process and apparatus for removing films from substrates |
US5044871A (en) * | 1985-10-24 | 1991-09-03 | Texas Instruments Incorporated | Integrated circuit processing system |
US4827867A (en) * | 1985-11-28 | 1989-05-09 | Daikin Industries, Ltd. | Resist developing apparatus |
US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
US4670126A (en) * | 1986-04-28 | 1987-06-02 | Varian Associates, Inc. | Sputter module for modular wafer processing system |
JPS6359322U (ja) * | 1986-10-06 | 1988-04-20 | ||
JPS63157870A (ja) * | 1986-12-19 | 1988-06-30 | Anelva Corp | 基板処理装置 |
US4951601A (en) * | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
JPH073833B2 (ja) * | 1987-03-30 | 1995-01-18 | 東京エレクトロン株式会社 | プローブ装置 |
US4924892A (en) * | 1987-07-28 | 1990-05-15 | Mazda Motor Corporation | Painting truck washing system |
DE3725565A1 (de) * | 1987-08-01 | 1989-02-16 | Peter Weil | Verfahren und anlage zum entlacken von gegenstaenden mit einem tauchbehaelter mit loesungsmittel |
US5105556A (en) * | 1987-08-12 | 1992-04-21 | Hitachi, Ltd. | Vapor washing process and apparatus |
US4838476A (en) * | 1987-11-12 | 1989-06-13 | Fluocon Technologies Inc. | Vapour phase treatment process and apparatus |
US4789077A (en) * | 1988-02-24 | 1988-12-06 | Public Service Electric & Gas Company | Closure apparatus for a high pressure vessel |
US4823976A (en) * | 1988-05-04 | 1989-04-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Quick actuating closure |
US5224504A (en) * | 1988-05-25 | 1993-07-06 | Semitool, Inc. | Single wafer processor |
US5185296A (en) * | 1988-07-26 | 1993-02-09 | Matsushita Electric Industrial Co., Ltd. | Method for forming a dielectric thin film or its pattern of high accuracy on a substrate |
JPH02123751A (ja) * | 1988-11-01 | 1990-05-11 | Mitsubishi Electric Corp | 半導体製造装置のウエハチヤツク |
US5051135A (en) * | 1989-01-30 | 1991-09-24 | Kabushiki Kaisha Tiyoda Seisakusho | Cleaning method using a solvent while preventing discharge of solvent vapors to the environment |
EP0409972B1 (en) * | 1989-02-16 | 1992-10-21 | PAWLISZYN, Janusz B. | Apparatus and method for delivering supercritical fluid |
US4879431A (en) * | 1989-03-09 | 1989-11-07 | Biomedical Research And Development Laboratories, Inc. | Tubeless cell harvester |
US5169296A (en) * | 1989-03-10 | 1992-12-08 | Wilden James K | Air driven double diaphragm pump |
US5213485A (en) * | 1989-03-10 | 1993-05-25 | Wilden James K | Air driven double diaphragm pump |
JPH02129731U (ja) * | 1989-03-31 | 1990-10-25 | ||
DE3914065A1 (de) * | 1989-04-28 | 1990-10-31 | Leybold Ag | Vorrichtung zur durchfuehrung von plasma-aetzverfahren |
US5288333A (en) * | 1989-05-06 | 1994-02-22 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method and apparatus therefore |
US5186718A (en) * | 1989-05-19 | 1993-02-16 | Applied Materials, Inc. | Staged-vacuum wafer processing system and method |
US5062770A (en) * | 1989-08-11 | 1991-11-05 | Systems Chemistry, Inc. | Fluid pumping apparatus and system with leak detection and containment |
US4983223A (en) * | 1989-10-24 | 1991-01-08 | Chenpatents | Apparatus and method for reducing solvent vapor losses |
US5169408A (en) * | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
US5217043A (en) * | 1990-04-19 | 1993-06-08 | Milic Novakovic | Control valve |
US5186594A (en) * | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
DE69133413D1 (de) * | 1990-05-07 | 2004-10-21 | Canon Kk | Substratträger des Vakuumtyps |
DE4018464A1 (de) * | 1990-06-08 | 1991-12-12 | Ott Kg Lewa | Membran fuer eine hydraulisch angetriebene membranpumpe |
US5620525A (en) * | 1990-07-16 | 1997-04-15 | Novellus Systems, Inc. | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
US5071485A (en) * | 1990-09-11 | 1991-12-10 | Fusion Systems Corporation | Method for photoresist stripping using reverse flow |
US5236669A (en) * | 1990-09-12 | 1993-08-17 | E. I. Du Pont De Nemours And Company | Pressure vessel |
US5167716A (en) * | 1990-09-28 | 1992-12-01 | Gasonics, Inc. | Method and apparatus for batch processing a semiconductor wafer |
DE4106180A1 (de) * | 1990-10-08 | 1992-04-09 | Dirk Dipl Ing Budde | Doppel-membranpumpe |
JPH04148549A (ja) * | 1990-10-12 | 1992-05-21 | Fujitsu Ltd | 半導体装置の評価方法 |
US5306350A (en) * | 1990-12-21 | 1994-04-26 | Union Carbide Chemicals & Plastics Technology Corporation | Methods for cleaning apparatus using compressed fluids |
US5143103A (en) * | 1991-01-04 | 1992-09-01 | International Business Machines Corporation | Apparatus for cleaning and drying workpieces |
CH684402A5 (de) * | 1991-03-04 | 1994-09-15 | Xorella Ag Wettingen | Vorrichtung zum Verschieben und Schwenken eines Behälter-Verschlusses. |
US5195878A (en) * | 1991-05-20 | 1993-03-23 | Hytec Flow Systems | Air-operated high-temperature corrosive liquid pump |
US5243821A (en) * | 1991-06-24 | 1993-09-14 | Air Products And Chemicals, Inc. | Method and apparatus for delivering a continuous quantity of gas over a wide range of flow rates |
US5251776A (en) * | 1991-08-12 | 1993-10-12 | H. William Morgan, Jr. | Pressure vessel |
JP3040212B2 (ja) * | 1991-09-05 | 2000-05-15 | 株式会社東芝 | 気相成長装置 |
DE9112761U1 (ja) * | 1991-10-14 | 1992-04-09 | Krones Ag Hermann Kronseder Maschinenfabrik, 8402 Neutraubling, De | |
US5221019A (en) * | 1991-11-07 | 1993-06-22 | Hahn & Clay | Remotely operable vessel cover positioner |
US5190373A (en) * | 1991-12-24 | 1993-03-02 | Union Carbide Chemicals & Plastics Technology Corporation | Method, apparatus, and article for forming a heated, pressurized mixture of fluids |
US5240390A (en) * | 1992-03-27 | 1993-08-31 | Graco Inc. | Air valve actuator for reciprocable machine |
US5313965A (en) * | 1992-06-01 | 1994-05-24 | Hughes Aircraft Company | Continuous operation supercritical fluid treatment process and system |
JPH0613361A (ja) * | 1992-06-26 | 1994-01-21 | Tokyo Electron Ltd | 処理装置 |
US5267455A (en) * | 1992-07-13 | 1993-12-07 | The Clorox Company | Liquid/supercritical carbon dioxide dry cleaning system |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
US5328722A (en) * | 1992-11-06 | 1994-07-12 | Applied Materials, Inc. | Metal chemical vapor deposition process using a shadow ring |
US5474410A (en) * | 1993-03-14 | 1995-12-12 | Tel-Varian Limited | Multi-chamber system provided with carrier units |
JP3457758B2 (ja) * | 1995-02-07 | 2003-10-20 | シャープ株式会社 | 超臨界流体を利用した洗浄装置 |
JPH08306632A (ja) * | 1995-04-27 | 1996-11-22 | Shin Etsu Handotai Co Ltd | 気相エピタキシャル成長装置 |
JP3983831B2 (ja) * | 1995-05-30 | 2007-09-26 | シグマメルテック株式会社 | 基板ベーキング装置及び基板ベーキング方法 |
JPH0927541A (ja) * | 1995-07-10 | 1997-01-28 | Nikon Corp | 基板ホルダ |
JPH0963946A (ja) * | 1995-08-24 | 1997-03-07 | Dainippon Screen Mfg Co Ltd | 基板回転式現像装置 |
US6062853A (en) * | 1996-02-29 | 2000-05-16 | Tokyo Electron Limited | Heat-treating boat for semiconductor wafers |
US6264752B1 (en) * | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
JP3176294B2 (ja) * | 1996-08-26 | 2001-06-11 | 日本電気株式会社 | 半導体ウェーハ用キャリア |
US5879459A (en) * | 1997-08-29 | 1999-03-09 | Genus, Inc. | Vertically-stacked process reactor and cluster tool system for atomic layer deposition |
DE19741438C5 (de) * | 1997-09-19 | 2004-09-02 | Siemens Ag | Verfahren und Steuersystem zum Stillsetzen eines Kraftfahrzeugs |
US6284360B1 (en) * | 1997-09-30 | 2001-09-04 | 3M Innovative Properties Company | Sealant composition, article including same, and method of using same |
JPH11108814A (ja) * | 1997-10-07 | 1999-04-23 | Toshiba Ceramics Co Ltd | ウエハ表面分析用治具 |
US6048494A (en) * | 1998-01-30 | 2000-04-11 | Vlsi Technology, Inc. | Autoclave with improved heating and access |
US6423642B1 (en) * | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
JPH11330172A (ja) * | 1998-05-12 | 1999-11-30 | Sharp Corp | 半導体ウエハープローバ装置 |
IL124598A (en) * | 1998-05-21 | 2001-10-31 | Ophir Optronics Ltd | Precision double-sided aspheric elements |
JP2000031253A (ja) * | 1998-07-10 | 2000-01-28 | Komatsu Ltd | 基板処理装置及び方法 |
JP2000265945A (ja) * | 1998-11-10 | 2000-09-26 | Uct Kk | 薬液供給ポンプ、薬液供給装置、薬液供給システム、基板洗浄装置、薬液供給方法、及び基板洗浄方法 |
US6806194B2 (en) * | 1999-01-22 | 2004-10-19 | Semitool. Inc. | Apparatus and methods for processing a workpiece |
US6548411B2 (en) * | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
JP2001007188A (ja) * | 1999-06-25 | 2001-01-12 | Topcon Corp | 吸着載置テーブル及びこれを用いた異物検査装置 |
US6508259B1 (en) * | 1999-08-05 | 2003-01-21 | S.C. Fluids, Inc. | Inverted pressure vessel with horizontal through loading |
US6612317B2 (en) * | 2000-04-18 | 2003-09-02 | S.C. Fluids, Inc | Supercritical fluid delivery and recovery system for semiconductor wafer processing |
JP2002324831A (ja) * | 2001-04-26 | 2002-11-08 | Takatori Corp | 真空吸着テーブル |
JP4162409B2 (ja) * | 2002-02-08 | 2008-10-08 | ヒューグルエレクトロニクス株式会社 | 曲面ウェハー用吸着台 |
-
2003
- 2003-08-11 US US10/639,224 patent/US20050035514A1/en not_active Abandoned
-
2004
- 2004-07-12 JP JP2006523197A patent/JP4439518B2/ja not_active Expired - Fee Related
- 2004-07-12 WO PCT/US2004/022459 patent/WO2005018870A1/en active Application Filing
- 2004-08-10 TW TW093123912A patent/TW200507043A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2007502538A (ja) | 2007-02-08 |
WO2005018870A1 (en) | 2005-03-03 |
US20050035514A1 (en) | 2005-02-17 |
TW200507043A (en) | 2005-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4439518B2 (ja) | 高圧処理中にウエハを保持する真空チャック、高圧洗浄処理装置及び高圧洗浄処理方法 | |
TWI567863B (zh) | Plasma processing device, substrate unloading device and method | |
KR100239197B1 (ko) | 정전척 | |
JP2005328054A (ja) | 半導体チップの分離装置及び分離方法 | |
US20070026772A1 (en) | Apparatus for use in processing a semiconductor workpiece | |
JP5886700B2 (ja) | 伝熱シート貼付装置及び伝熱シート貼付方法 | |
JP2015198251A (ja) | チップデタッチング装置およびチップデタッチング方法 | |
CN110544664A (zh) | 用于保持基板的保持装置和方法 | |
JP3608121B2 (ja) | 基板の機械的脱離機構およびその機構を用いた脱離方法 | |
US7021635B2 (en) | Vacuum chuck utilizing sintered material and method of providing thereof | |
JP2008041969A (ja) | 基板の脱離方法 | |
JP6685154B2 (ja) | 接合装置および接合方法 | |
JP4238669B2 (ja) | エキスパンド方法及びエキスパンド装置 | |
JP2013191781A (ja) | 半導体製造装置および半導体製造装置の制御方法 | |
JP2001310257A (ja) | 研磨装置 | |
JP6664529B2 (ja) | 真空チャックステージおよび半導体装置の製造方法 | |
KR101135355B1 (ko) | 기판 리프트장치 | |
TW201947687A (zh) | 基板加壓模組及方法及包含其的基板處理設備及方法 | |
JPH11277422A (ja) | ウェーハの接着装置 | |
TWI714306B (zh) | 晶圓結合的方法及晶圓結合設備 | |
JP7217604B2 (ja) | 異物除去装置、ダイボンダ、及び異物除去方法 | |
KR101221034B1 (ko) | 기판척 및 이를 이용한 기판처리장치 | |
KR100935754B1 (ko) | 프로세스 챔버의 웨이퍼 척 | |
JP2005191338A (ja) | 基板の保持装置および方法 | |
TWI637454B (zh) | 晶片分離裝置與晶片分離方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090908 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091023 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091208 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100105 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130115 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160115 Year of fee payment: 6 |
|
LAPS | Cancellation because of no payment of annual fees |