JPS56130738A - Method and device for exposure - Google Patents

Method and device for exposure

Info

Publication number
JPS56130738A
JPS56130738A JP3388280A JP3388280A JPS56130738A JP S56130738 A JPS56130738 A JP S56130738A JP 3388280 A JP3388280 A JP 3388280A JP 3388280 A JP3388280 A JP 3388280A JP S56130738 A JPS56130738 A JP S56130738A
Authority
JP
Japan
Prior art keywords
substrate
flatness
flattening
chuck
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3388280A
Other languages
Japanese (ja)
Other versions
JPH0147007B2 (en
Inventor
Nobuyuki Akiyama
Yukio Kenbo
Yasuo Nakagawa
Susumu Aiuchi
Mineo Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3388280A priority Critical patent/JPS56130738A/en
Priority to DE3110341A priority patent/DE3110341C2/en
Priority to US06/245,193 priority patent/US4391511A/en
Publication of JPS56130738A publication Critical patent/JPS56130738A/en
Publication of JPH0147007B2 publication Critical patent/JPH0147007B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To improve the yield of thick-film and thin-film circuits and a printed substrate, by flattening the surface of a substrate on the basis of the measured flatness of a substrate by providing a substrate flattening station separated from a pattern exposure station. CONSTITUTION:Substrate 4 such as a wafer is set on substrate flattening chuck 16 from cartridge 19 by carriage mechanism 20 and flatness measuring device 17 detects its flatness. Controller 18 performs arithmetic corresponding to this detected flatness to move respective division parts of flattening chuck 16 through a displacement generator by required extents, and respective parts of the chuck are moved up and down finely and independently to flatten the surface of substrate 4. After the flatness enters in a prescribed range, carriage 6 is moved under exposure optical system 21 to print the pattern of mask 1.
JP3388280A 1980-03-19 1980-03-19 Method and device for exposure Granted JPS56130738A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3388280A JPS56130738A (en) 1980-03-19 1980-03-19 Method and device for exposure
DE3110341A DE3110341C2 (en) 1980-03-19 1981-03-17 Method and apparatus for aligning a thin substrate in the image plane of a copier
US06/245,193 US4391511A (en) 1980-03-19 1981-03-18 Light exposure device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3388280A JPS56130738A (en) 1980-03-19 1980-03-19 Method and device for exposure

Publications (2)

Publication Number Publication Date
JPS56130738A true JPS56130738A (en) 1981-10-13
JPH0147007B2 JPH0147007B2 (en) 1989-10-12

Family

ID=12398887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3388280A Granted JPS56130738A (en) 1980-03-19 1980-03-19 Method and device for exposure

Country Status (1)

Country Link
JP (1) JPS56130738A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571229A (en) * 1980-05-02 1982-01-06 Perkin Elmer Corp Device for automatically positioning wafer
JPS5815237A (en) * 1981-07-21 1983-01-28 Seiko Epson Corp Apparatus for manufacturing semiconductor
JPS5867026A (en) * 1981-10-19 1983-04-21 Hitachi Ltd Thin plate metamorphosis device
JPS59106118A (en) * 1982-12-10 1984-06-19 Hitachi Ltd Thin plate deforming apparatus
JPS61112121A (en) * 1984-10-24 1986-05-30 Ushio Inc Exposing device
JPS6336526A (en) * 1986-07-30 1988-02-17 Oki Electric Ind Co Ltd Wafer exposure equipment
JP2007502538A (en) * 2003-08-11 2007-02-08 東京エレクトロン株式会社 Vacuum chuck apparatus and method for holding a wafer during high pressure processing
JP2012015508A (en) * 2010-06-30 2012-01-19 Asml Holding Nv Reticle clamping system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21
JPS50152670A (en) * 1974-05-28 1975-12-08
JPS5314425A (en) * 1976-07-27 1978-02-09 Sharp Corp Liquid fuel combustion device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21
JPS50152670A (en) * 1974-05-28 1975-12-08
JPS5314425A (en) * 1976-07-27 1978-02-09 Sharp Corp Liquid fuel combustion device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571229A (en) * 1980-05-02 1982-01-06 Perkin Elmer Corp Device for automatically positioning wafer
JPH0370365B2 (en) * 1980-05-02 1991-11-07 Perkin Elmer Corp
JPS5815237A (en) * 1981-07-21 1983-01-28 Seiko Epson Corp Apparatus for manufacturing semiconductor
JPS5867026A (en) * 1981-10-19 1983-04-21 Hitachi Ltd Thin plate metamorphosis device
JPH0261132B2 (en) * 1981-10-19 1990-12-19 Hitachi Ltd
JPS59106118A (en) * 1982-12-10 1984-06-19 Hitachi Ltd Thin plate deforming apparatus
JPS61112121A (en) * 1984-10-24 1986-05-30 Ushio Inc Exposing device
JPS6336526A (en) * 1986-07-30 1988-02-17 Oki Electric Ind Co Ltd Wafer exposure equipment
JP2007502538A (en) * 2003-08-11 2007-02-08 東京エレクトロン株式会社 Vacuum chuck apparatus and method for holding a wafer during high pressure processing
JP2012015508A (en) * 2010-06-30 2012-01-19 Asml Holding Nv Reticle clamping system
US9274439B2 (en) 2010-06-30 2016-03-01 Asml Holding N.V. Reticle clamping system

Also Published As

Publication number Publication date
JPH0147007B2 (en) 1989-10-12

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