JPS57109335A - Positional matching method between mask substrate and wafer - Google Patents

Positional matching method between mask substrate and wafer

Info

Publication number
JPS57109335A
JPS57109335A JP55185906A JP18590680A JPS57109335A JP S57109335 A JPS57109335 A JP S57109335A JP 55185906 A JP55185906 A JP 55185906A JP 18590680 A JP18590680 A JP 18590680A JP S57109335 A JPS57109335 A JP S57109335A
Authority
JP
Japan
Prior art keywords
mask substrate
wafer
matching reference
masks
matching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55185906A
Other languages
Japanese (ja)
Other versions
JPS6142410B2 (en
Inventor
Toshiaki Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55185906A priority Critical patent/JPS57109335A/en
Publication of JPS57109335A publication Critical patent/JPS57109335A/en
Publication of JPS6142410B2 publication Critical patent/JPS6142410B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To perform a highly accurate positional matching between the wafer and the mask substrate by a method wherein the image of matching reference to be used for wafers is image formed on the matching reference for masks on the surface of the mask substrate through the intermediary of a Fresnel zone pattern, and the mutual positional information of the mask substrate and the wafer is obtained. CONSTITUTION:The matching reference 2 for wafers is provided on the wafer 1, and at the same time, the matching reference 4 for masks is provided on the surface of the mask substrate 3. Then, the Fresnel zone pattern 5 is formed at the section corresponding to the matching reference 4 for masks located on the reverse side of the mask substrate 3. The image of the matching reference 2 for wafers is image formed on the matching reference 4 for masks located on the surface of the mask substrate 3 through the intermediary of the Fresnel zone pattern 5, matching references 2 and 4 for wafers and masks are superpositioned in the same plane surface, and the mutual positional information on the mask reference 3 and the wafer 1 can be obtained.
JP55185906A 1980-12-26 1980-12-26 Positional matching method between mask substrate and wafer Granted JPS57109335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55185906A JPS57109335A (en) 1980-12-26 1980-12-26 Positional matching method between mask substrate and wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55185906A JPS57109335A (en) 1980-12-26 1980-12-26 Positional matching method between mask substrate and wafer

Publications (2)

Publication Number Publication Date
JPS57109335A true JPS57109335A (en) 1982-07-07
JPS6142410B2 JPS6142410B2 (en) 1986-09-20

Family

ID=16178945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55185906A Granted JPS57109335A (en) 1980-12-26 1980-12-26 Positional matching method between mask substrate and wafer

Country Status (1)

Country Link
JP (1) JPS57109335A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134830A (en) * 1982-12-30 1984-08-02 トムソン−セ−エスエフ Method and apparatus for optically arraying pattern on two close-up plane
JPS60173835A (en) * 1984-01-30 1985-09-07 Nippon Telegr & Teleph Corp <Ntt> Controlling method of gap by diffraction grating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134830A (en) * 1982-12-30 1984-08-02 トムソン−セ−エスエフ Method and apparatus for optically arraying pattern on two close-up plane
JPS6352453B2 (en) * 1982-12-30 1988-10-19 Tomuson Sa
JPS60173835A (en) * 1984-01-30 1985-09-07 Nippon Telegr & Teleph Corp <Ntt> Controlling method of gap by diffraction grating
JPH0263288B2 (en) * 1984-01-30 1990-12-27 Nippon Telegraph & Telephone

Also Published As

Publication number Publication date
JPS6142410B2 (en) 1986-09-20

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