JPS57168250A - Exposing method - Google Patents
Exposing methodInfo
- Publication number
- JPS57168250A JPS57168250A JP5383181A JP5383181A JPS57168250A JP S57168250 A JPS57168250 A JP S57168250A JP 5383181 A JP5383181 A JP 5383181A JP 5383181 A JP5383181 A JP 5383181A JP S57168250 A JPS57168250 A JP S57168250A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- patterns
- mask
- regions
- different kinds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To expose continuously and easily different kinds of patterns by using a mask having variable pattern regions in the main pattern region and secondary patterns in the variable pattern regions in an exposing method for obtaining different kinds of patterns with one mask pattern. CONSTITUTION:Different kinds of projected patterns are obtd. on a photoresist film with one mask pattern for transfer. At this time, a mask for exposure having variable pattern regions 12, 13 in the main pattern region 14 and secondary pattern regions 15, 16 each consisting of a group of unit patterns for giving a prescribed pattern in the regions 12, 13 is used, and the unit patterns can be selected according to the moving distances of the mask and the wafer. Thus, pattern circuits with slightly different shapes can be formed easily and continuously by exposure.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5383181A JPS57168250A (en) | 1981-04-10 | 1981-04-10 | Exposing method |
EP81306134A EP0055620B1 (en) | 1980-12-29 | 1981-12-24 | Method of projecting circuit patterns |
DE8181306134T DE3173277D1 (en) | 1980-12-29 | 1981-12-24 | Method of projecting circuit patterns |
US06/333,814 US4408875A (en) | 1980-12-29 | 1981-12-31 | Method of projecting circuit patterns |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5383181A JPS57168250A (en) | 1981-04-10 | 1981-04-10 | Exposing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57168250A true JPS57168250A (en) | 1982-10-16 |
JPS6235102B2 JPS6235102B2 (en) | 1987-07-30 |
Family
ID=12953726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5383181A Granted JPS57168250A (en) | 1980-12-29 | 1981-04-10 | Exposing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57168250A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57112753A (en) * | 1980-12-29 | 1982-07-13 | Fujitsu Ltd | Exposure method |
-
1981
- 1981-04-10 JP JP5383181A patent/JPS57168250A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57112753A (en) * | 1980-12-29 | 1982-07-13 | Fujitsu Ltd | Exposure method |
Also Published As
Publication number | Publication date |
---|---|
JPS6235102B2 (en) | 1987-07-30 |
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