JPS5772323A - Thin plate flattening equipment - Google Patents

Thin plate flattening equipment

Info

Publication number
JPS5772323A
JPS5772323A JP55147539A JP14753980A JPS5772323A JP S5772323 A JPS5772323 A JP S5772323A JP 55147539 A JP55147539 A JP 55147539A JP 14753980 A JP14753980 A JP 14753980A JP S5772323 A JPS5772323 A JP S5772323A
Authority
JP
Japan
Prior art keywords
wafer
thin plate
flattened
calculated
uneveness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55147539A
Other languages
Japanese (ja)
Inventor
Mineo Nomoto
Susumu Aiuchi
Nobuyuki Akiyama
Yasuo Nakagawa
Yukio Kenbo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55147539A priority Critical patent/JPS5772323A/en
Priority to DE3110341A priority patent/DE3110341C2/en
Priority to US06/245,193 priority patent/US4391511A/en
Publication of JPS5772323A publication Critical patent/JPS5772323A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To improve an accuracy of flattening without lowering a through put by a method wherein uneveness and its magnitude of the surface of a thin plate are calculated and the thin plate is changed in the thickness direction according to the calculated value and is flattened. CONSTITUTION:A wafer 4 is drawn out from a cartridge 17 by a transfer means 18 and is transferred onto an absorbing means 20. Then the flatness of the wafer 4 is measured by a flatness measuring means and the uneveness and its magnitude of the surface of the wafer 4 are calculated according to those measured data. This calculated value is transmitted to a control means 23 and the control means 23 controls a wafer deforming means 21, so that the wafer 4 is slightly displaced in the thickness direction and its surface is flattened. When the wafer 4 is flattened a carriage 19 is moved and a pattern of a mask 1 is imaged and printed on the wafer 4 by an optical exposure system 24.
JP55147539A 1980-03-19 1980-10-23 Thin plate flattening equipment Pending JPS5772323A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP55147539A JPS5772323A (en) 1980-10-23 1980-10-23 Thin plate flattening equipment
DE3110341A DE3110341C2 (en) 1980-03-19 1981-03-17 Method and apparatus for aligning a thin substrate in the image plane of a copier
US06/245,193 US4391511A (en) 1980-03-19 1981-03-18 Light exposure device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55147539A JPS5772323A (en) 1980-10-23 1980-10-23 Thin plate flattening equipment

Publications (1)

Publication Number Publication Date
JPS5772323A true JPS5772323A (en) 1982-05-06

Family

ID=15432597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55147539A Pending JPS5772323A (en) 1980-03-19 1980-10-23 Thin plate flattening equipment

Country Status (1)

Country Link
JP (1) JPS5772323A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015508A (en) * 2010-06-30 2012-01-19 Asml Holding Nv Reticle clamping system
US9956869B2 (en) 2010-07-26 2018-05-01 Kautex Textron Gmbh & Co. Kg Fuel tank made of thermoplastic material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21
JPS4922868A (en) * 1972-06-20 1974-02-28
JPS5314425A (en) * 1976-07-27 1978-02-09 Sharp Corp Liquid fuel combustion device
JPS54146580A (en) * 1978-05-09 1979-11-15 Nippon Telegr & Teleph Corp <Ntt> Thin plate flattening correction mechanism

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21
JPS4922868A (en) * 1972-06-20 1974-02-28
JPS5314425A (en) * 1976-07-27 1978-02-09 Sharp Corp Liquid fuel combustion device
JPS54146580A (en) * 1978-05-09 1979-11-15 Nippon Telegr & Teleph Corp <Ntt> Thin plate flattening correction mechanism

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015508A (en) * 2010-06-30 2012-01-19 Asml Holding Nv Reticle clamping system
US9274439B2 (en) 2010-06-30 2016-03-01 Asml Holding N.V. Reticle clamping system
US9956869B2 (en) 2010-07-26 2018-05-01 Kautex Textron Gmbh & Co. Kg Fuel tank made of thermoplastic material
US11130400B2 (en) 2010-07-26 2021-09-28 Kautex Textron Gmbh & Co. Kg Fuel tank made of thermoplastic material

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