JPS54146580A - Thin plate flattening correction mechanism - Google Patents

Thin plate flattening correction mechanism

Info

Publication number
JPS54146580A
JPS54146580A JP5469878A JP5469878A JPS54146580A JP S54146580 A JPS54146580 A JP S54146580A JP 5469878 A JP5469878 A JP 5469878A JP 5469878 A JP5469878 A JP 5469878A JP S54146580 A JPS54146580 A JP S54146580A
Authority
JP
Japan
Prior art keywords
warp
cylindrical component
thin plate
mask
correction mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5469878A
Other languages
Japanese (ja)
Other versions
JPS576689B2 (en
Inventor
Naoji Otsuka
Tadao Saito
Hideo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP5469878A priority Critical patent/JPS54146580A/en
Publication of JPS54146580A publication Critical patent/JPS54146580A/en
Publication of JPS576689B2 publication Critical patent/JPS576689B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To secure a flat adsorption of the thin plate onto the surfaces of the cylindrical component and the electrostrictive element by providing the electrostrictive element to the hollow part of the cylindrical component.
CONSTITUTION: Mask 17 featuring the concave warp is put onto the holder composed of cylindrical component 11 and electrostrictive element 13. Then the mask and the holder are adsorbed by absorption 16 and via hole 14 and groove 15. Accordingly, element 13 warps downward according to the warp of the mask. A fixed amount voltage is applied to element 13 to warp the element and thus to secure the same level for the upper surface of the element as end face 11a of the cylindrical component. In this way, even the slight warp can be corrected.
COPYRIGHT: (C)1979,JPO&Japio
JP5469878A 1978-05-09 1978-05-09 Thin plate flattening correction mechanism Granted JPS54146580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5469878A JPS54146580A (en) 1978-05-09 1978-05-09 Thin plate flattening correction mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5469878A JPS54146580A (en) 1978-05-09 1978-05-09 Thin plate flattening correction mechanism

Publications (2)

Publication Number Publication Date
JPS54146580A true JPS54146580A (en) 1979-11-15
JPS576689B2 JPS576689B2 (en) 1982-02-06

Family

ID=12978016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5469878A Granted JPS54146580A (en) 1978-05-09 1978-05-09 Thin plate flattening correction mechanism

Country Status (1)

Country Link
JP (1) JPS54146580A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734336A (en) * 1980-08-11 1982-02-24 Hitachi Ltd Exposure device
JPS5772323A (en) * 1980-10-23 1982-05-06 Hitachi Ltd Thin plate flattening equipment
JPS5815237A (en) * 1981-07-21 1983-01-28 Seiko Epson Corp Apparatus for manufacturing semiconductor
JPH0982606A (en) * 1995-09-13 1997-03-28 Nikon Corp Reticle holder
JP2003100619A (en) * 2001-09-27 2003-04-04 Nikon Corp Mask holding apparatus and method, and exposing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734336A (en) * 1980-08-11 1982-02-24 Hitachi Ltd Exposure device
JPH0145217B2 (en) * 1980-08-11 1989-10-03 Hitachi Ltd
JPS5772323A (en) * 1980-10-23 1982-05-06 Hitachi Ltd Thin plate flattening equipment
JPS5815237A (en) * 1981-07-21 1983-01-28 Seiko Epson Corp Apparatus for manufacturing semiconductor
JPH0982606A (en) * 1995-09-13 1997-03-28 Nikon Corp Reticle holder
JP2003100619A (en) * 2001-09-27 2003-04-04 Nikon Corp Mask holding apparatus and method, and exposing apparatus

Also Published As

Publication number Publication date
JPS576689B2 (en) 1982-02-06

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