JPS5291666A - Photodiode - Google Patents

Photodiode

Info

Publication number
JPS5291666A
JPS5291666A JP797776A JP797776A JPS5291666A JP S5291666 A JPS5291666 A JP S5291666A JP 797776 A JP797776 A JP 797776A JP 797776 A JP797776 A JP 797776A JP S5291666 A JPS5291666 A JP S5291666A
Authority
JP
Japan
Prior art keywords
photodiode
noncolored
depositing
filter
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP797776A
Other languages
Japanese (ja)
Other versions
JPS6028149B2 (en
Inventor
Shinichi Yanase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP51007977A priority Critical patent/JPS6028149B2/en
Publication of JPS5291666A publication Critical patent/JPS5291666A/en
Publication of JPS6028149B2 publication Critical patent/JPS6028149B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: To prevent moisture absorption in a photodiode by depositing a noncolored transparent synthetic resin layer in less than 0.2 mm thick onto the filter of a light receptive element and the exposed surface of an adjacent outer enclosure.
COPYRIGHT: (C)1977,JPO&Japio
JP51007977A 1976-01-29 1976-01-29 photodiode Expired JPS6028149B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51007977A JPS6028149B2 (en) 1976-01-29 1976-01-29 photodiode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51007977A JPS6028149B2 (en) 1976-01-29 1976-01-29 photodiode

Publications (2)

Publication Number Publication Date
JPS5291666A true JPS5291666A (en) 1977-08-02
JPS6028149B2 JPS6028149B2 (en) 1985-07-03

Family

ID=11680501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51007977A Expired JPS6028149B2 (en) 1976-01-29 1976-01-29 photodiode

Country Status (1)

Country Link
JP (1) JPS6028149B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304307A (en) * 1991-07-18 1993-11-16 Mitsumi Electric Co Ltd Manufacture of infrared ray receiver
JP2013506985A (en) * 2009-10-01 2013-02-28 エクセリタス カナダ，インコーポレイテッド Optoelectronic device with laminate-less carrier packaging in landscape or upside-down device arrangement
US8791492B2 (en) 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
US9018074B2 (en) 2009-10-01 2015-04-28 Excelitas Canada, Inc. Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304307A (en) * 1991-07-18 1993-11-16 Mitsumi Electric Co Ltd Manufacture of infrared ray receiver
JP2013506985A (en) * 2009-10-01 2013-02-28 エクセリタス カナダ，インコーポレイテッド Optoelectronic device with laminate-less carrier packaging in landscape or upside-down device arrangement
US8791492B2 (en) 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
US9018074B2 (en) 2009-10-01 2015-04-28 Excelitas Canada, Inc. Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same

Also Published As

Publication number Publication date
JPS6028149B2 (en) 1985-07-03

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