JPS5478096A - Solid pickup element - Google Patents

Solid pickup element

Info

Publication number
JPS5478096A
JPS5478096A JP14515277A JP14515277A JPS5478096A JP S5478096 A JPS5478096 A JP S5478096A JP 14515277 A JP14515277 A JP 14515277A JP 14515277 A JP14515277 A JP 14515277A JP S5478096 A JPS5478096 A JP S5478096A
Authority
JP
Japan
Prior art keywords
light
reduction material
light reduction
refractive index
pickup element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14515277A
Other languages
Japanese (ja)
Inventor
Juko Sugaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14515277A priority Critical patent/JPS5478096A/en
Publication of JPS5478096A publication Critical patent/JPS5478096A/en
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE: To eliminate interference stripes when coherent light is used by using an adhesive-layer material whose refractive index is nearly equal to that of a light reduction material, at the time of obtaining a pickup element by providing the light reduction material to the front surface of a sensor part via an adhesive layer and by adhering a reflection preventive film to the incident light side of this light reduction material.
CONSTITUTION: In order to prevent the generation of an air layer in sensor part 11, substrate 10 of the sensor is applied with adhesive layer 13, through which light reduction material 12 is fixed and its surface is covered with reflection preventive film 14. In this way, the solid pickup element is constituted, but adhesive layer 13 employs a material whose refractive index is nearly equal to that of light reduction material 12. In addition, light reduction material 12 employs a material of 35% in light transmissive index, and the refractive index of this incident surface is fixed below 0.5%. As a result, the visibility of interference becomes below 3% even when coherent light is used, and interference stripes generated becomes small enough to be ignored actually.
COPYRIGHT: (C)1979,JPO&Japio
JP14515277A 1977-12-05 1977-12-05 Solid pickup element Pending JPS5478096A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14515277A JPS5478096A (en) 1977-12-05 1977-12-05 Solid pickup element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14515277A JPS5478096A (en) 1977-12-05 1977-12-05 Solid pickup element

Publications (1)

Publication Number Publication Date
JPS5478096A true JPS5478096A (en) 1979-06-21

Family

ID=15378614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14515277A Pending JPS5478096A (en) 1977-12-05 1977-12-05 Solid pickup element

Country Status (1)

Country Link
JP (1) JPS5478096A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009166211A (en) * 2008-01-18 2009-07-30 Mitsubishi Electric Corp Wire electrical discharge processing apparatus
US9089916B2 (en) 2010-10-01 2015-07-28 Mitsubishi Electric Corporation Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009166211A (en) * 2008-01-18 2009-07-30 Mitsubishi Electric Corp Wire electrical discharge processing apparatus
US9089916B2 (en) 2010-10-01 2015-07-28 Mitsubishi Electric Corporation Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method

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