JPH05304307A - Manufacture of infrared ray receiver - Google Patents

Abstract

PURPOSE:To facilitate bonding of a filter member on the surface of a light transmissive member. CONSTITUTION:In the infrared ray receiver wherein an opening 47 made through a cap-shaped casing 31 is sealed with a glassy light transmissive member 48, filter member 37a of liquid epoxy resin is dripped on the surface of the light transmissive member 48 so that the opening 47 is covered thereby and the filter member 37 is subsequently dried to form an infrared ray transmissive filter. Since the filter member 37a is formed by dripping the liquid epoxy resin, it can be shaped arbitrarily and applicable to various case structure while furthermore the filter member 37a can be bonded easily to the surface of the light transmissive member 48. In addition. the glassy light transmissive member 48 is reinforced, airtightness in the case 31 is enhanced, and reliability of receiving ICs incorporated in the case 31 and circuit components mounted on the board is enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an infrared receiving device, and more particularly to a method for manufacturing an infrared receiving device for remotely controlling electric equipment such as a television using infrared rays.

[0002]

2. Description of the Related Art In a conventional method for manufacturing an infrared receiving device, a plate-like infrared ray is passed through an ink for infrared ray transmission by screen printing using a screen as disclosed in, for example, Japanese Utility Model Application Laid-Open No. 59-101582. There is a method to print on the part to be printed.

[0003]

According to the above method, since the screen is required, the printing apparatus becomes complicated, and when the shape or size of the opening of the case is changed, the screen must be remade. When the case has a cap shape, it is difficult to screen print on the outer surface or the inner surface of the light transmitting member that seals the opening of the case, and the surface of the light transmitting member is completely flat. Otherwise, it was difficult to print the liquid infrared transmissive member by screen printing.

[0004]

In order to solve the above problems, the present invention provides an infrared receiver in which an opening of a cap-like case is sealed with a glass-made light transmitting member, and the surface of the light transmitting member is A method for manufacturing an infrared receiving device, wherein a liquid epoxy resin filter member is dropped onto the filter member and adhered so as to cover the opening, and then the filter member is dried to form an infrared transmitting filter.

[0005]

According to the present invention, the filter member can be easily attached to the surface of the light transmitting member that seals the opening surface of the cap-shaped case.

[0006]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a sectional view taken along the line AA ′ when the exploded perspective view of the infrared receiver shown in FIG. 2 is assembled. Reference numeral 31 is a metal case, 32 is a metal stem, 33 is a ceramic substrate, and 41 to 43 are terminals, respectively.

A low melting point glass 48 is fused to the infrared transmitting hole 47 of the case 31 and the inside thereof, whereby the airtightness of the inside and outside of the case 31 of the transmitting hole 47 is maintained. A filter 37a that transmits a long wavelength of infrared rays or more is attached and formed on the outer surface of the glass 48.

Reference numeral 34 is a photodiode, which is a chip-shaped light receiving element, and 35 is a chip-shaped IC for a receiving circuit, which is mounted on the substrate 33. Then, each of these elements is wired to an electrode pattern (not shown) formed by thick film printing on the substrate. Reference numeral 36 denotes a shield plate for electrically shielding the receiving IC 35 and the photodiode 34. The shield plate 36 is positioned by inserting a protruding piece 36a extending downward in the center thereof into a narrow groove 39 formed in the center portion of the substrate 33. Then, the ground pattern on the substrate and the shield plate 36 are fixed by soldering at three places (not shown). By surrounding the photodiode 34 by the bent portions 36b and 36c at both ends of the shield plate 36, the shield with the receiving circuit is completely performed. In addition, this shield effect is achieved by the protruding piece 36 inserted in the narrow groove 39 of the substrate 34.
It is also made by a. That is, the electric signal from the capacitor 38 on the lower surface of the substrate 33 is blocked by the protruding piece 36a and has a shield effect. The reason for shielding the photodiode from the electric circuit in this way is shown in FIG.
This is because there is a problem in that the signal flies to the photodiode 34 from a portion (a signal level is high) particularly close to the output stage of the receiving circuit 1 shown in FIG. 2 and this becomes negative feedback, and the output level from the output terminal 8 decreases. Reference numeral 40 denotes a mylar film which is an insulating plate for preventing the head of the chip capacitor 38 from touching the metallic stem 32.

Next, a process of assembling the infrared receiver according to the present invention will be described. First, the glass is placed on the inside of the case 31 and heated to be melted, and the glass 48 is welded to the case 31. Next, a pigment for forming an infrared ray transmitting filter is mixed on the outer surface of the glass 48 in a liquid epoxy resin so as to be dropped so as to cover the passage hole 47, and after printing, it is dried to transmit infrared ray. Create the filter 37a. Through the steps so far, the case assembly in which the glass 48 and the filter 37a are attached to the passage hole 47 of the case 31 is obtained. Next, each circuit element is assembled to the substrate 33 to make a substrate assembly, the terminals 41 to 43 and the mylar film 40 are assembled to the stem 32, and the insulating spacer 50 is attached to the terminal 4.
1 and 42, the upper ends of the terminals 41 to 43 are inserted and connected (by soldering or a conductive adhesive) into the holes 44 to 46 of the board assembly, and these are put in the case assembly and in a nitrogen atmosphere. Then, the peripheral portions 31a and 32a of the case 31 and the stem 32 are hermetically sealed by electric welding.

As a result, the case 31 is filled with nitrogen gas, and it is possible to realize a highly reliable infrared receiving device without deterioration of each circuit element due to aging. Further, since the filter member is attached to the outer surface of the glassy light-transmitting member, it is easy to dry the liquid filter member during the assembly process of the device, and after drying, the adhesiveness to glass is good and high temperature, The epoxy resin filter member that is resistant to high pressure and has good corrosion resistance serves as a protective film for the glass-based light transmitting member that is easily cracked or damaged.

Further, in the infrared receiver, the case opening may be enlarged to widen the directivity in order to obtain a wide directivity. However, if the case opening is too large, the receiving circuit may be adversely affected, or the case may be damaged. The airtightness inside may become worse. In order to solve this, it is necessary to bring the light receiving element close to the case opening, but since the filter member is attached to the outer surface of the light transmitting member, the inside of the case can be used effectively, so that the light receiving element can be placed in the opening. You can get closer.

The photodiode 34 and the receiving IC
Although 35 has been described using a separate chip, the present invention is not limited to these, and the photodiode 34 and the receiving IC 3 are not limited thereto.
5 and 5 may be formed on the same chip.

FIG. 3 is a sectional view for explaining the second embodiment of the method for manufacturing an infrared receiver of the present invention. In the figure, those parts that are the same as those corresponding parts in FIG. 1 are designated by the same reference numerals, and a description thereof will be omitted. In the present embodiment, the infrared transmitting filter 37c
Is formed on the lower surface of the glass so as to cover the passage hole 47 and the glass 48. That is, a liquid epoxy resin mixed with a pigment is formed by inverting the case 31 and dropping it from the open side, and after the dropping, it is dried to form the infrared transmission filter 37c.

FIG. 4 is a sectional view for explaining the third embodiment of the method for manufacturing an infrared receiver according to the present invention. In the figure,
The same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, the infrared transmission filter 37d is formed on the outer surface of the glass 48 so as to cover the passage hole 47 with a thickness approximately the same as the thickness dimension of the case 31. That is, a liquid epoxy resin mixed with a pigment forming an infrared transmission filter is dropped onto the outer surface of the glass and the recess formed by the edge of the passage hole 47 of the case 31, and dried to pass infrared rays. Create the filter 37d.

In this structure, the range of wavelengths that the infrared pass filter passes through varies depending on its thickness,
Considering this, if the thickness dimension of the case 31 is set to an appropriate dimension value, it is possible to obtain the infrared transmission filter 37d having a desired thickness and less variation in thickness dimension. The thickness of the case 31 is larger than the thickness of the filter 37d formed because the glass 48 flows into the passage hole 47. In the experiment, the case thickness is 0.25.
mm, the thickness of the filter 37d is 0.2
A thickness of about mm was obtained.

[0016]

As described above, according to the present invention, since the liquid filter member is dropped, the shape of the filter member is free, and it can be applied to various case structures, and the filter member can be easily attached to the surface of the light transmitting member. Can be attached. Further, since the filter member made of epoxy resin is dropped on the glass-based light transmitting member and adhered so as to cover the case opening, the glass-based light transmitting member can be reinforced, and the glass-based light transmitting member and the epoxy resin Since the case opening surface can be doubly sealed by the system filter member, the airtightness in the case is improved, and the reliability of the receiving IC incorporated in the case and the circuit components arranged on the substrate is improved. be able to.

[Brief description of drawings]

FIG. 1 is a sectional view illustrating a first embodiment of a method for manufacturing an infrared receiver according to the present invention.

FIG. 2 is an exploded perspective view illustrating a first embodiment of a method for manufacturing an infrared receiving device of the present invention.

FIG. 3 is a sectional view showing an explanation of a second embodiment of the method for manufacturing an infrared receiver of the present invention.

FIG. 4 is a cross-sectional view showing an explanation of a third embodiment of the method for manufacturing an infrared receiver of the present invention.

FIG. 5 is a circuit diagram of an infrared receiver of the present invention.

[Explanation of symbols]

 31 Case 32 Stem 33 Substrate 34 Chip-shaped Photodiode 35 Chip-shaped Receiving IC 36 Shield Plates 37a, 37d Infrared Transmitting Filter 38 Chip Capacitor 41-43 Terminals 48 Glass 50 Spacer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI Technical display location H04Q 9/00 311 V 7170-5K 8426-5K H04B 9/00 W

Claims (1)

[Claims] 1. In an infrared receiver in which an opening of a cap-shaped case is sealed with a glass-based light transmitting member, a liquid epoxy resin filter member is dropped on the surface of the light transmitting member to form the opening. A method of manufacturing an infrared receiving device, comprising forming the infrared transmitting filter by drying the filter member after the cover member is attached.