JPS5985123A - Air-tight base for piezoelectric oscillator - Google Patents

Abstract

PURPOSE:To form a chip type oscillator by providing an insulator base having a through-hole and a metallic terminal having a projection inserted to the said through-hole to a flat part of the terminal and soldering the said projection to a metallic layer provided around the through-hole of the insulator base. CONSTITUTION:The metallic terminal formed by spot-welding a projection 22 made of a short wire having 0.4mm. of diameter to a metallic thin plate 21 is inserted to a through-hole 12 of the insulator base 11 to form an air-tight base 51. The projection 22 is soldered to the metallic layer 13 provided around the through-hole 12. The metallic thin plate 21 forming the flat part is soldered to the metallic layer 15 of the lowr side of the base. A piezoelectric element 52 of tablet form is mounted on the air-tight base 51, and a metallic can 61 is sealed to it to obtain a chip type piezoelectric oscillator.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to an airtight base for a piezoelectric vibrator, which hermetically encapsulates a piezoelectric element within a case.

In recent years, as electronic sailing equipment has generally become more compact, there has been a demand for smaller individual parts, and so-called chip parts, Jlτ・'I construction, have been widely used in various fields. There is. In fact, in such a situation, no single chip piezoelectric vibrator/ζ product has yet appeared. This is due to the fact that the pressure 1E vibration Q1 element is originally a component that requires extremely high stability, so it is basically kept in an inert gas atmosphere or vacuum and sealed in a case. This is due to the fact that the chip component is an inner cone.

The present invention was made in consideration of these circumstances.
The purpose is to provide an airtight base for a piezoelectric vibrator that enables the piezoelectric vibrator to be made into a chip component.

In order to achieve such a purpose, I Jr., j
,,l:' An insulating substrate that allows water to pass through, and a metal terminal that has a protrusion that fits into the Kamitomi 111 through hole on the flat part.
1) The protrusion is bonded to a metal layer provided around a through hole of an insulating substrate by high temperature solder to improve air permeability through the through hole.

Hereinafter, the present invention will be explained in detail using Examples.

FIG. 1 is a perspective view showing an insulating substrate constituting an embodiment of the present invention, and FIG. Figure (b) shows the bottom surface. This insulating substrate 11 is made of a heat-resistant resin such as epoxy resin or phenol, or ceramic, and has a through hole 12 therein. The external dimensions are set to 1 to accommodate the strip-shaped camera elements that are currently being widely used.
．． The diameter of the through hole 12 is 0.05 mm. As shown in FIG. 5A, a solderable metal layer 13 is provided on the upper surface around the through hole 12, and a metal layer 14 with a width of about 1 mm is also provided on the peripheral edge. On the other hand, a metal layer 15 is provided on the lower surface divided into two regions each including one through hole 12. When these metal layers are composed of a resin substrate such as epoxy resin as the insulating substrate 11, a so-called printed wiring board with copper foil or the like fixed to the surface is used, and this is patterned by photolithography. If a ceramic plate is used, a desired shape can be formed by a so-called metallization method in which, for example, silver-palladium active is screen-printed and then baked on the substrate.

Fig. 2 shows an example of drawing a metal terminal used in combination with such an insulating substrate, and Fig. 2 (a) shows a case in which a short line protrusion 22 with a diameter of 040 mm is spot welded to a pressed metal thin plate 21; The same figure (b) also consists of a fully bent thin plate 24 integrally molded including the protrusion 23 by press working.

FIG. 3 shows an airtight base made by joining such metal ends, for example, the terminals shown in FIG. 3(n) shows the top surface, and FIG. 3(b) shows the bottom surface. That is, the protrusion 22 is inserted from the lower surface side, and the tip protrudes toward the upper surface side. Therefore, the protrusion 22 is soldered to the metal layer 13 provided around the through hole 12 at this protruding portion. - The gold H3 thin plate 21 constituting the flat part is exposed to the metal layer 15 on the bottom surface of the substrate by half an EJ. In this case, high-temperature solder with a melting point of 300° C. or higher is used to prevent melting when the assembled piezoelectric vibrator is later mounted on a device substrate. In addition, even if semi-RTI bonding is performed only on either the upper or lower side or the lower surface of the board 11, if it is a swatch, ventilation through the through hole 12f is eliminated, but the pin hole in the solder layer Considering the possibility of occurrence, it is desirable to perform this on both the upper and lower surfaces in order to improve reliability. As a method for further increasing the reliability of soldering, there is a so-called through-hole method in which the side wall of the through hole 12 is metallized to form a metal layer 41, as shown in FIG. In this case, as shown in the figure, the metal layers on the upper and lower surfaces can be electrically connected without protruding the protrusions 22 of the metal terminals from the two sides of the substrate 11, so that the subsequent piezoelectric element Easy to mount.

FIG. 5 is a perspective view showing a structure in which a rectangular piezoelectric element 52 is mounted on such an airtight base 51, and FIG. %
The electrodes 54 are formed on both sides of a piezoelectric substrate 53 made of crystal.
It is electrically connected to metal layer 13 by adhesive 55 .

The 56i1 spacer prevents the vibrating part of the power regulator 52 from coming into contact with the upper surface of the airtight base 51. After the piezoelectric element is mounted in this manner, a metal can 61 is placed over the piezoelectric element, and an insulating group is applied to the metal layer 14 on the upper surface periphery of the insulating group 11 in an inert gas or vacuum atmosphere. For heat-pressing, solder with a melting point of i% is applied to the metal layer 14 on the periphery and the edge of the metal can 61, and these are soldered using an inert gas or an inert gas. This can be easily done by pressurizing and heating in an atmosphere of

In Figure 6, 1 (color j 60 earth da old A anti 11 j) J
Thin metal plate 2 with a diameter of 10 mm and forming the flat part of the metal infant.
1 has a thickness of 03 and a spacer of 56 B P3j.
1Ti1 gold RFA 13 on board consisting of 3m metal piece
It has been soldered. The total thickness including the metal can 61 is about 31 mm.

Such chip formation '1. When the charged vibrator is attached to the printed wiring board for the device, it is done through the lower surface 21a of the thin metal plate 21. That is, paste-like solder is sandwiched between the device board and the terminal lower surface 21a.
-, and then passed through a high-temperature furnace at 250°C to easily bond them. However, if such equipment is not available, the shape shown in FIG. 6 cannot be said to be easy to handle.

Therefore, Fig. 7 shows an example in which bonding to the printed wiring Z board for the device can be easily performed even in such a case.
05 to 10 tip portions 71 of the flat portion of the metal terminal protrude outward from the end portion of the substrate 11. Therefore, the length dimension becomes substantially larger, but the protruding portion of 7X can be soldered to a predetermined position on the device board using a soldering iron cap.

Note that although the above description has been made using the case where there are two terminals as an example, it is needless to say that the application of the present invention is not limited by the number of terminals.

As explained above, according to the present invention, an insulating substrate having a through hole and a metal lower terminal extending south of the protrusion that fits into the water passage are provided on the flat part, and the protrusion By soldering the part to the metal layer drilled around the through hole of the insulating substrate, it becomes possible to form a chip-shaped L (: cloth vibrator. It can be formed at a much lower cost than the airtight base made of glass that is used, and by completely blocking the through hole with a half-H hole, it eliminates air permeability through the hole. In addition, by soldering the flat part of the gold 7) 73 terminal, it can be reliably connected to the board for mounting, and it is extremely easy to connect it to the actual board. It is.

4. Explanation of Figure 1 (,) and (b) itJ: A perspective view showing the upper and lower surfaces of the edge board according to an embodiment of the present invention,
? Figures 1 and 2 (, ) and (+) are respectively perspective views showing examples of metal terminals (Figures 3 (a) and (b)).
is the gold l”+ of Fig. 2(a) on the insulating -2jj plate of Fig. 1.
! A perspective view showing the upper and lower surfaces of an airtight base made by joining '1M elements.
'X! j Cross-sectional view showing an example of L/? +:'r Is the 5th figure pressure? f m L, perspective view showing the child mounted state;
Figure 6 is a sectional view showing the sealed state of the golden spear, Figure 7
Figure t;J, metal y・t1 child l:1. FIG. 3 is a perspective view showing an example of a flexible substrate protruding outward;

11...P3 green board, 12...through hole, 1
3 , 1 4 , 1 5 ・ ・ ・ ・
Gold Su1hi iA1. 21 , 24 ・ ・
...4 thin plates on gold, 22.23...protrusions, 41...
- Gold P6 layer by through-hole processing, 51... airtight base, 71... tip of metal terminal protruding from insulating substrate.

Patent issuer: Kinsegi Co., Ltd. Agent Masaki Yamakawa (tυ) 1 person) Figure 1 Figure 2 Figure 3 Figure 5 Figure 6 Figure 7 1

Claims (1)

[Scope of Claims] (+l JY) An insulating substrate having a metal layer having a communication hole and having two through holes fIfl on at least one surface, and a metal terminal having a protrusion on a flat part, An airtight base for a piezoelectric vibrator, characterized in that the protrusion is inserted into a through hole and is bonded to a metal layer using high-temperature solder. (2) The through hole is processed by attaching a metal layer to its side 11. The piezoelectric vibration according to claim 1, wherein the 'i'!l' sign is that the tip of the protrusion inserted into the through hole does not protrude onto the surface of the insulating substrate. (3) The piezoelectric vibrator according to claim 1, wherein the metal terminal has a flat end portion protruding outward from an end of the insulating substrate. Airtight base.