JPH11340350A - Container for electronic device and sealing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a container for electronic device in which a plurality of covers are bonded efficiently to a plurality of insulating substrate. SOLUTION: The container for electronic device comprises a plurality of insulating substrates 1 each having a part for mounting an electronic device on the upper surface, a plurality of covers 2 being bonded onto the insulating substrates 1 in order to seal electronic device 4, and a plurality of sealing members for bonding insulating substrates 1 and the covers 2 wherein the plurality of covers 2 are integrated through coupling parts 2a. The plurality of covers 2 can be bonded easily to the plurality of insulating substrates 1 while being aligned efficiently.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for hermetically sealing an electronic component such as a piezoelectric vibrator or a semiconductor element in a container formed by joining an insulating base and a lid via a sealing member. The present invention relates to a container for an electronic device and a sealing method thereof.

[0002]

2. Description of the Related Art An electronic device such as a piezoelectric vibrator or a semiconductor element is hermetically sealed in an electronic device container for accommodating the electronic component, thereby forming an electronic device as a product.

An electronic device container used in such an electronic device is made of an electrically insulating material such as ceramics, for example, as shown in a sectional view of FIG. 9, and has a mounting portion 22a for mounting an electronic component 21 on an upper surface thereof. An insulating base 22 having a wiring conductor 23 extending from the periphery of the mounting portion 22a to the lower surface, and a metal, glass, ceramic, or the like joined to the upper surface of the insulating base 22 via a sealing member 24 made of brazing material, glass, resin, or the like And a lid 25 made of the same. Then, the electronic component 21 is mounted on the mounting portion 22 a of the insulating base 22, and the electrodes of the electronic component 21 and the wiring conductors 23 are electrically connected via the bonding wires 26. By joining the body 25 through the sealing member 24, the electronic component 21 is hermetically sealed inside the container.

In such an electronic device container, in order to join the lid 25 to the insulating base 22 via the sealing member 24,
As shown in a cross-sectional view in FIG. 10, for example, a sealing member 24 is previously attached to the lower surface of the lid 25, and the lid 25 is placed on the upper surface of the insulating base 22, with the sealing member 24 interposed therebetween. A method of positioning and mounting, heating and melting the sealing member 24, and then solidifying is adopted.

In recent years, electronic devices have been increasingly miniaturized, and as a result, the size of electronic device containers has also been reduced to several mm square.

In such a miniaturized electronic device container, the insulating substrate 22 is shown in FIG. 11 in order to facilitate its handling and to make the insulating substrate 22 and the electronic device more efficient. As shown in the perspective view, it is manufactured in the form of a so-called multi-piece substrate in which a large number of insulating bases 22 are arranged and formed in a mother board 20 having a large area.

According to the container for an electronic device using the insulating substrate 22 manufactured in the form of a multi-piece substrate, the electronic components 21 are mounted on the insulating substrates 22 arranged and formed in the mother substrate 20, respectively. The sealing member 24 is provided on the upper surface of each insulating base 22.
The sealing member 24 is heated and melted, and then solidified by solidifying the insulating base 22 and the lid 25 to form a sealing member.
24, and then the mother substrate 20 is
By dividing along the 22 boundaries, a large number of electronic devices can be manufactured simultaneously and intensively.

[0008]

However, according to this conventional electronic device container, when the lid is joined to each of the insulating substrates arranged and formed in the motherboard, a sealing member is attached to each of the insulating substrates. It is necessary to position the attached lids one by one and place them, and it is necessary to check the front and back of each one of the lids and place them. Therefore, the operation of mounting the lids on each of the insulating bases becomes extremely complicated, and has a disadvantage that the plurality of lids cannot be efficiently joined to the plurality of insulating bases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to provide an electronic device capable of easily and efficiently joining a plurality of lids to a plurality of insulating substrates. It is to provide a container and a sealing method thereof.

[0010]

According to a first aspect of the present invention, there is provided an electronic device container comprising: a plurality of insulating substrates each having a mounting portion on which an electronic component is mounted on an upper surface; A plurality of lids for sealing the electronic component therebetween, and a plurality of sealing members for joining the insulating base and the lid, wherein the plurality of lids are integrally connected by a connecting portion. It is characterized in that it is

Further, according to the method for sealing an electronic device container of the present invention, the electronic component is mounted on the mounting portion of a plurality of insulating bases having a mounting portion on which an electronic component is mounted on an upper surface, and the connecting portion is connected to the mounting portion. A plurality of lids that are connected and integrated are brought into contact with the respective insulating bases via a sealing member, and the respective insulating bases and the respective lids are joined by the sealing member, and the electronic member is provided therebetween. A component is sealed, and thereafter, the plurality of lids are separated from the connecting portion.

According to the electronic device container of the present invention, since the plurality of lids are connected and integrated by the connecting portion,
When aligning and placing each lid on a plurality of insulating bases, if the plurality of insulating bases are arranged and arranged corresponding to the lids, all the lids can be aligned at the same time, and the lids can be aligned simultaneously. Can be checked once.

According to the method of sealing an electronic device container of the present invention, a plurality of lids integrated by a connecting portion are brought into contact with each insulating base via a sealing member, and each insulating base is sealed. After joining the base and each lid with a sealing member and sealing the electronic components between the two, the plurality of lids are separated from the connecting portion, so that the plurality of lids are divided into the plurality of insulating bases. At the same time.

[0014]

Next, the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing an example of an embodiment of an electronic device container of the present invention, wherein 1 is an insulating base, 2 is a lid,
3 is a sealing member.

As shown in the partially enlarged view of FIG. 2, the insulating base 1 is made of a sintered body of aluminum oxide, a sintered body of aluminum nitride, a sintered body of silicon nitride, a sintered body of silicon carbide, glass ceramic, or the like. Of a thermosetting resin such as ceramics or epoxy resin, polyimide resin, bismaleimide triazine resin, thermosetting polyphenylene ether or the like. Have. The electronic component 4 is bonded and fixed to the mounting portion 1a via an adhesive such as brazing material, glass, or resin.

On the insulating substrate 1, tungsten, molybdenum / copper / silver / silver is used from the periphery of the mounting portion 1a to the lower surface.
A wiring conductor 5 made of metal such as palladium is adhered and formed, and an electrode of the electronic component 4 is electrically connected to the wiring conductor 5 via a bonding wire 6.

A plurality of insulating bases 1 are integrally formed in a large-area mother substrate 7. For example, when the insulating base 1 is made of an aluminum oxide sintered body, aluminum oxide / silicon oxide is used. -A suitable organic binder and solvent are added to and mixed with raw material powders such as calcium oxide and magnesium oxide to form a slurry, and this is formed into a sheet by employing a conventionally known doctor blade method to form a plurality of ceramic greens. After obtaining a sheet, the ceramic green sheet is subjected to an appropriate punching process, and a metal paste to be a wiring conductor 5 is printed and applied in a predetermined pattern, and the ceramic green sheets are laminated to form a ceramic green sheet laminate. After that,
This is fired in a reducing atmosphere at a temperature of about 1600 ° C., so that a plurality of insulating bases 1 are integrally arranged and formed in a large-area mother substrate 7.

The lid 2 is a substantially flat plate made of a metal such as an iron-nickel-cobalt alloy or an iron-nickel alloy, or ceramics / glass, for example. The corresponding arrangements are connected and integrated with each other.

Since the plurality of lids 2 are connected and integrated at the connecting portion 2a, each lid 2 is connected to the corresponding insulating base 1
, All the lids 2 can be aligned at the same time. In addition, it is only necessary to check the front and back of the lid 2 once. Therefore, the plurality of lids 2 are connected to the plurality of insulating bases 1.
And can be easily and efficiently aligned and joined.

When the lid 2 is made of, for example, an iron-nickel-cobalt alloy, a plurality of lids 2 are connected to each other by a connecting portion 2a by punching a plate of iron-nickel-cobalt alloy having a predetermined thickness. It is manufactured so as to be connected and integrated.

Each lid 2 has a brazing material such as silver-copper alloy, gold-tin alloy, gold-germanium alloy, silver-germanium alloy, lead-tin alloy, nickel-phosphorus alloy, glass, A sealing member 3 made of resin or the like is attached.

When the sealing member 3 is made of, for example, a silver-copper alloy, a thin plate made of a silver-copper alloy is pressed against a plate material serving as the lid 2, and is punched together with the plate material serving as the lid 2. It is attached to the lower surface of each lid 2.

Next, a method for sealing an electronic device container of the present invention will be described.

First, as shown in a perspective view in FIG. 1, a mounting portion 1a of each of the insulating bases 1 in which a plurality are arranged on a mother substrate 7.
In addition, the electronic components 4 are mounted on the electronic components 4, and the electrodes of the electronic components 4 are electrically connected to the corresponding wiring conductors 5 via the bonding wires 6.

Next, as shown in a perspective view in FIG.
And is brought into contact with and in contact with the corresponding insulating substrate 1 via the.

In this case, since the plurality of lids 2 are connected and integrated by the connecting portion 2a, all the lids 2 can be simultaneously positioned and brought into contact with the corresponding insulating bases 1. Therefore, the plurality of lids 2 are connected to the plurality of insulating bases 1.
Thus, the electronic devices can be easily and efficiently joined, and a plurality of electronic devices can be efficiently manufactured.

Next, each lid 2 is joined to the corresponding insulating substrate 1 via the sealing material 3.

Each of the lids 2 is attached to the corresponding insulating base 1 by a sealing material 3.
For example, the lid 2 is made of metal,
When the sealing material 3 is made of a brazing material, a sealing method by electron beam welding may be employed.

In the case of the sealing method by electron beam welding, as shown in a partially enlarged perspective view in FIG. 4, for example, the outer peripheral portion of the upper surface of the lid 2 is irradiated with an electron beam along a broken line indicated by an arrow A, and this irradiation is performed. The lid 2 is bonded to the insulating base 1 via the sealing member 3 by heating and melting the sealing member 3 corresponding to the portion irradiated with the electron beam by the energy of the electron beam.

In this case, since only the outer peripheral portion of the lid 2 irradiated with the electron beam and the corresponding portion are heated in the electronic device container, heat is applied to the electronic component 4 accommodated in the container at the time of sealing. Less damage caused by

Next, the boundary between each lid 2 and the connecting portion 2a is irradiated with an electron beam along the dotted line indicated by the arrow B, and the connecting portion 2a is melted and cut by the energy of the irradiated electron beam. Connect each lid 2 to the connecting portion 2a
Disconnect from

Thereafter, as shown in a perspective view in FIG. 5, the insulating substrate 1 is separated from the mother substrate 7 so that the insulating substrate 1 and the lid 2 are joined with the sealing material 3 interposed therebetween. A plurality of electronic devices in which electronic components are hermetically sealed inside the device container are simultaneously and intensively manufactured.

In order to separate each insulating substrate 1 from the mother substrate 7, for example, a dividing groove 7a having a predetermined depth is formed in advance on upper and lower surfaces of the mother substrate 7 at boundaries between the insulating substrates 1, and the dividing groove 7a is formed.
A method of so-called chocolate break of the mother substrate 7 along a may be adopted.

Thus, according to the electronic device container and the sealing method of the present invention, the mounting portions 1a of the plurality of insulating bases 1 are provided.
The electronic component 4 is mounted on the electronic component 4, and the electrodes of the electronic component 4 are electrically connected to the wiring conductors 5. Then, the plurality of lids 2 connected and integrated by the connecting portion 2 a are connected via the sealing member 3. The electronic components 4 are hermetically sealed between the insulating bases 1 and the lids 2 via a sealing member 3 to hermetically seal the electronic component 4 therebetween. By separating the lids 2 from the connecting portion 2a, a plurality of electronic devices are simultaneously and intensively manufactured.

It should be noted that the electronic device container and the method of sealing the same of the present invention are not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention. Needless to say,

For example, in the above-described embodiment, the plurality of lids 2 are connected and integrated by the band-shaped connecting portion 2a. However, as shown in a perspective view in FIG. Alternatively, they may be connected and integrated by a connecting portion 2b having a perforation, and further may be connected and integrated by a sheet-like connecting portion 2c as shown in a perspective view in FIG.

Further, in the example of the above-described embodiment, a plurality of the insulating bases 1 are integrally formed in the mother substrate 7, but as shown in a perspective view in FIG. You may hold | maintain on the holding jig 8 which can hold | maintain in a predetermined arrangement | sequence.

Further, in the above-described embodiment, the sealing member 3 is attached to the lower surface of the lid 2.
May be attached to the upper surface of the insulating base 1.

[0039]

According to the container for an electronic device of the present invention, since a plurality of lids are connected and integrated by the connecting portion, each lid is positioned and placed on a plurality of insulating bases. When doing, if a plurality of insulating bases are arranged in a predetermined sequence,
Correspondingly, all the lids can be aligned at the same time, and the front and back sides of the lid can be checked only once. Therefore, the plurality of lids can be easily and efficiently aligned and joined to the plurality of insulating bases.

Further, according to the method of sealing an electronic device container of the present invention, the plurality of lids integrated by the connecting portion are brought into contact with the respective insulating bases via the sealing member to form the respective insulating substrates. After joining the base and each lid with a sealing member and sealing the electronic components between the two, the plurality of lids are separated from the connecting portion, so that the plurality of lids are divided into the plurality of insulating bases. At the same time. Therefore, the plurality of lids can be easily and efficiently joined to the plurality of insulating substrates, and the plurality of electronic devices can be manufactured efficiently.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an example of an embodiment of an electronic device container according to the present invention and a sealing method thereof.

FIG. 2 is an enlarged perspective view of a main part of the electronic device container shown in FIG.

FIG. 3 is a perspective view for explaining a method of sealing an electronic device container of the present invention.

4 is an enlarged sectional view of a main part of the electronic device container shown in FIG. 3;

FIG. 5 is a perspective view for explaining a method for sealing an electronic device container of the present invention.

FIG. 6 is a perspective view showing another example of the embodiment of the lid in the electronic device container of the present invention.

FIG. 7 is a perspective view showing still another example of the embodiment of the lid in the electronic device container of the present invention.

FIG. 8 is a perspective view showing another example of the embodiment of the insulating base in the electronic device container of the present invention.

FIG. 9 is a cross-sectional view illustrating a conventional electronic device container.

FIG. 10 is a cross-sectional view for explaining a conventional method of sealing an electronic device container.

FIG. 11 is a perspective view for explaining a conventional electronic device container and a sealing method thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Lid 2a, 2b, 2c ... Connection part 3 ... Sealing member 4 ... Electronic parts

Claims (3)

[Claims] 1. A plurality of insulating bases having a mounting portion on which an electronic component is mounted on an upper surface, and a plurality of lids joined on the insulating base and sealing the electronic components between the insulating bases. An electronic device container comprising: a body; and a plurality of sealing members for joining the insulating base and the lid, wherein the plurality of lids are connected and integrated by a connecting portion. . 2. The electronic component is mounted on the mounting portion of a plurality of insulating bases having a mounting portion on which an electronic component is mounted on an upper surface, and a plurality of lids connected and integrated by a connecting portion are sealed. The electronic component is sealed between the insulating base and the lid by joining the sealing base with the sealing member, and then the plurality of insulating bases are in contact with the insulating bases via the stopper member. A method for sealing a container for an electronic device, comprising: separating a lid from the connecting portion. 3. The method according to claim 2, wherein said lid is made of metal, said sealing member is made of brazing material, and said insulative base and said lid are joined by electron beam welding. A method for sealing a container for an electronic device.