JP2851745B2 - Electronic component storage package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a package for accommodating electronic components such as semiconductor elements and quartz oscillators.

[0002]

2. Description of the Related Art Conventionally, a package for accommodating an electronic component, for example, a piezoelectric vibrator for obtaining a predetermined vibration frequency, is generally made of an electrically insulating material such as alumina ceramics as shown in FIG. A rectangular insulating base 21 having a metallized wiring layer 22 made of a refractory metal powder such as tungsten, molybdenum, manganese or the like led out from the top surface to the bottom surface, and a part of the metallized wiring layer 22 are attached via a conductive adhesive. And a holder 23 for holding the piezoelectric vibrator 25 and connecting the electrodes of the piezoelectric vibrator 25 to an external electric circuit board, and a bowl-shaped lid 24 also made of an electrically insulating material. The piezoelectric vibrator 25 is bonded and held on the holding fitting 23 via a conductive adhesive such as polyimide, and each electrode of the piezoelectric vibrator 25 is connected to the holding fitting 2. Then, a lid 24 is joined to the upper surface of the insulating base 21 with a sealing material 26 made of solder, and the piezoelectric vibrator 25 is placed inside a container formed of the insulating base 21 and the lid 24. Is airtightly sealed to form a piezoelectric vibrating element as a final product.

In the package for storing electronic components, frame-shaped metallized metal layers 27 and 28 made of a high melting point powder such as tungsten, molybdenum or the like are previously provided on the outer peripheral portion of the upper surface of the insulating base 21 and the outer peripheral portion of the lower surface of the lid 24, respectively. The cover 24 is attached to the insulating base 2 by joining the metallized metal layers 27 and 28 with a sealing material 26 made of solder.
1 will be joined.

In order to improve the workability, the lid 24 is bonded to the insulating base 21 by bonding a solder as a sealing material 26 to a metallized metal layer 28 previously applied to the lid 24. Every other metallized metal layer 2 of the insulating substrate 21
7, a lid 24 is placed so that the solder is sandwiched therebetween, and then the lid 24 is pressed against the insulating base 21 at a constant pressure and a temperature of about 300 to 350 ° C. is applied to the solder. This is performed by heating and melting the solder.

[0005]

However, in this conventional electronic component housing package, the insulating base 21 and the lid 24 are not wettable because the alumina ceramics constituting the insulating base 21 and the lid 24 have poor wettability to solder. When the piezoelectric vibrator 25 is hermetically sealed inside the container made of the following, the solder as the sealing material 26 is heated and melted while the lid 24 is pressed against the insulating base 21 side. )
Is pushed to the corners of the insulating base 21 and the lid 24 by the pressing force of the lid 24, and a part thereof protrudes outside to form a spherical projection 29 as shown in FIG.
This has the disadvantage that when the piezoelectric vibrating element is mounted on an external electric circuit board, it falls onto the external electric circuit board and short-circuits the wiring conductors of the external electric circuit board.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and it is an object of the present invention to make it possible for solder as a sealing material to protrude out of an insulating base and a lid as spherical projections. Another object of the present invention is to provide an electronic component housing package that can prevent the protrusions from dropping onto the external electric circuit board and short-circuit the wiring conductors of the external electric circuit board.

[0007]

According to the present invention, there is provided a rectangular insulating substrate having a frame-shaped metal layer adhered to an outer peripheral portion of an upper surface, and a rectangular insulating substrate having a frame-shaped metal layer adhered to an outer peripheral portion of a lower surface. An electronic component housing package comprising an insulating base and a metal layer of each of the cover and an electronic component being hermetically housed therein by joining the respective metal layers of the lid via a sealing material made of solder. A notch was formed in at least one corner of the insulating substrate or the lid, and a metal layer communicating with the metal layer attached to the insulating substrate or the lid was formed on the surface of the notch. It is characterized by the following.

[0008]

According to the electronic component storage package of the present invention,
A notch is formed in at least one corner of the rectangular insulating base and the lid, and a metal layer communicating with the frame-shaped metal layer provided on the insulating base or the lid is formed on the surface of the notch. When the lid is joined to the insulating base, even if the solder as a sealing material protrudes from the corners of the insulating base and the lid, the protruding solder is formed in the notch formed in the corner of the insulating base or the lid. Out of and adhere to the metal layer, and do not protrude as spherical projections.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

FIGS. 1 and 2 show an embodiment in which the package for accommodating an electronic component according to the present invention is applied to a package for accommodating a piezoelectric vibrator, wherein 1 is an insulating base, and 2 is a lid. The insulating base 1 and the lid 2 constitute a container 4 for housing the piezoelectric vibrator 3.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide aggregate, etc., for example, an aluminum oxide sintered body. In this case, an appropriate binder and an organic solvent are added to the raw material powder of alumina, silica, calcia, magnesia, etc. to form a slurry, and the mixture is formed into a ceramic green by a conventionally known doctor blade method, calender roll method, or the like. The sheet (ceramic green sheet) is obtained, and thereafter, is subjected to appropriate punching, laminated, and fired at a high temperature (about 1600 ° C.).

A metallized wiring layer 6 extending from the upper surface of the insulating substrate 1 to the lower surface through the through hole 5 is formed on the insulating substrate 1. A piezoelectric vibrator is provided on the upper surface of the insulating substrate 1 of the metallized wiring layer 6. A holding member 7 for holding 3 is attached via a conductive adhesive, and a lower surface portion of the insulating base 1 is connected to an external electric circuit board via a conductive adhesive such as solder.

The metallized wiring layer 6 is made of a high melting point metal powder such as tungsten, molybdenum, manganese or the like. The metal paste obtained by adding a suitable binder and an organic solvent to the high melting point metal powder such as tungsten is mixed. The ceramic green sheet serving as the base 1 is printed and applied in advance by using a conventionally known thick film method such as a screen printing method, so that the upper surface of the insulating base 1 is guided to the lower surface via the through holes 5 so as to be drawn out. Is formed.

The metallized wiring layer 6 is formed by plating a metal having good conductivity and excellent corrosion resistance, such as nickel or gold, to a thickness of 1.0 to 20.0 μm by plating. The oxidative corrosion of the wiring layer 6 can be effectively prevented. Accordingly, nickel, gold, or the like is applied to the surface of the metallized wiring layer 6 in an amount of 1.0 to 20.0 to prevent the metallized wiring layer 6 from being oxidized and corroded.
It is preferable to form a layer having a thickness of μm.

A holding member 7 is attached to the metallized wiring layer 6 on the upper surface of the insulating base 1 via a conductive adhesive such as conductive polyimide. The piezoelectric vibrator 3 is bonded and held via a conductive adhesive such as polyimide so that its electrodes are electrically connected to the holding member 7.

The holding member 7 functions to hold the piezoelectric vibrator 3 and to electrically connect the electrodes of the piezoelectric vibrator 3 to the metallized wiring layer 6.
Ni alloy), Kovar (Fe-Ni-Co alloy), 42
It is formed of a metal having elasticity such as an alloy (Fe-Ni alloy).

The holding member 7 is manufactured in a predetermined shape by employing a conventionally known metal working method such as punching or bending a plate made of a sheet of white or the like.

A frame-shaped metallized metal layer 8 is adhered to the outer peripheral portion of the upper surface of the insulating base 1, and the metallized metal layer 8 has a bowl-shaped lid 2 covered with a sealing material 10 made of solder.
, Whereby the piezoelectric vibrator 3 is hermetically sealed inside a container 4 including the insulating base 1 and the lid 2.

The metallized metal layer 8 attached to the outer peripheral portion of the upper surface of the insulating base 1 is made of a high melting point metal powder such as tungsten, molybdenum, manganese, etc. Is added and mixed in advance to a ceramic green sheet serving as the insulating substrate 1 by a known thick film technique such as a screen printing method so as to form a frame on the outer peripheral portion of the upper surface of the insulating substrate 1. Be deposited.

The metallized metal layer 8 is plated with a metal having good wettability to the solder such as nickel or gold by plating so that the solder constituting the sealing material 10 is firmly bonded to the surface thereof. Layered to a thickness of 20.0 μm.

The insulating substrate 1 has a notch A formed from the upper surface to the lower surface of the corner, and a metallized metal layer 8 on the upper surface of the insulating substrate 1 is formed on the surface of the notch A.
A metallized metal layer 11 made of a high melting point metal powder such as tungsten, molybdenum or the like, which is in communication with the substrate, is formed.

The notch A having the metallized metal layer 11 formed on the insulating base 1 is used for bonding the cover 2 to the metallized metal layer 8 of the insulating base 1 via the sealing material 10 made of solder. By causing the sealing material 10 protruding from between the insulating base 1 and the lid 2 to flow out and adhere to the metal layer 11, it is possible to effectively form a spherical projection made of the sealing material 10 outside the container 4. This prevents the spherical projections made of the sealing material 10 from dropping onto the external electric circuit board and short-circuiting between the wiring conductors.

The notch A provided at the corner of the insulating base 1 is formed by punching a ceramic green sheet serving as the insulating base 1 into a predetermined shape in advance from the upper surface to the lower surface of the corner of the insulating base 1. Metallized metal layer 1 formed and adhered to the surface of the notch A
Reference numeral 1 denotes a metal paste obtained by adding and mixing a suitable binder and an organic solvent to a high melting point metal powder such as tungsten or molybdenum on a ceramic green sheet serving as an insulating substrate 1 by a conventionally known thick film method such as a screen printing method. By printing and applying, it is adhered and formed on the surface of the cutout portion A at the corner of the insulating base 1.

If the notch A has a depth t of less than 0.1 mm, it is difficult to satisfactorily flow and adhere the sealing material 10 protruding from the container 4 onto the metallized metal layer 10. The notch A preferably has a depth t of 0.1 mm or more.

Further, the metallized metal layer 11 to be adhered to the surface of the notch A is plated with a metal having good wettability with respect to solder such as nickel or gold to a thickness of 1.0 to 20.0 μm by plating. When the layers are adhered, the outflow adhesion of the sealing material 10 made of solder to the metallized metal layer 11 can be further improved. Therefore, it is preferable that a metal having good wettability with respect to solder, such as nickel or gold, is applied to the surface of the metallized metal layer 10 by plating to a thickness of 1.0 to 20.0 μm.

On the other hand, a bowl-shaped lid 2 is joined to the metallized metal layer 8 attached to the outer peripheral portion of the upper surface of the insulating substrate 1, and the lid 2 is made of an aluminum oxide sintered body, a mullite sintered body. It is made of an electrically insulating material such as a sintered body, an aluminum nitride-based sintered body, a silicon carbide-based sintered body. For example, in the case of an aluminum oxide-based sintered body, it is suitable for a raw material powder such as alumina, silica, calcia, and magnesia. It is manufactured by filling a mixture of a binder and an organic solvent into a press mold having a predetermined shape, applying a constant pressure and molding, and then firing the molded product at a temperature of about 1600 ° C. You.

A frame-shaped metallized metal layer 9 is adhered to the outer peripheral portion of the lower surface of the lid 2, and the frame-shaped metallized metal layer 9 is formed on the upper surface of the insulating base 1.
To the insulating base 1 by bonding the
The lid 2 is joined to the upper surface of.

The metallized metal layer 9 attached to the lid 2 is made of a metal such as silver-palladium, and a metal paste obtained by adding a glass frit, a binder and an organic solvent to silver and palladium powders. Is printed on the outer peripheral portion of the lower surface of the lid 2 by a conventionally known thick film method such as a screen printing method, and is baked at a temperature of about 1000 ° C. to be attached in a frame shape on the outer peripheral portion of the lower surface of the lid 2. You.

Further, on the surface of the metallized metal layer 9, a sealing material 10 made of solder is previously adhered and joined in order to improve workability in joining the lid 2 to the insulating base 1. The sealing material 10 is formed by applying a solder paste obtained by adding and mixing a suitable binder and an organic solvent to the solder powder on the metallized metal layer 9 by a conventionally known screen printing method, and applying the solder paste at a temperature of about 350 ° C. And heat-fused to adhere to the surface of the metallized metal layer 9.

Thus, according to the electronic component housing package of the present invention, the piezoelectric vibrator 3 is bonded and fixed to the holding member 7 attached to the insulating base 1 with a conductive adhesive and is attached to the upper surface of the insulating base 1. Metallized metal layer 8 with lid 2
The metallized metal layer 9 adhered to the lower surface of the container is joined via a sealing material 10 made of solder previously adhered to the lid 2, and the inside of the container 4 composed of the insulating base 1 and the lid 2 The piezoelectric vibrator 3 is hermetically sealed to form a piezoelectric vibrating element as a product.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. Although the notch A is formed from the upper surface to the lower surface of the insulating base 1, the notch A may be formed only on a part of the upper surface of the insulating base 1, and the notch A may be formed at a corner of the lid 2. May be.

In the above-described embodiment, the electronic component housing package for housing the piezoelectric vibrator is used. However, the electronic component housing package for housing the integrated circuit element and the surface acoustic wave filter may be used.

[0033]

According to the electronic component housing package of the present invention, the notch A having the metallized metal layer 11 communicating with the metallized metal layer 8 is formed at the corner of the insulating base 1, so that the insulating base 1 is formed. Cover 2 on metallized metal layer 8
Is bonded through a sealing material 10 made of solder, the sealing material 10 that protrudes from between the insulating base 1 and the lid 2 flows out and adheres to the metallized metal layer 11 in the cutout portion A, and the container 4
Does not protrude in a spherical shape outside of the device.As a result, when the piezoelectric vibrating element is mounted on an external electric circuit board,
The projection made of the spherical solder does not fall on the external electric circuit board and short-circuits between the wiring conductors.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment in which the present invention is applied to an electronic component housing package for housing a piezoelectric vibrator.

FIG. 2 is a cross-sectional view of the electronic component storage package shown in FIG.

FIG. 3 is an exploded perspective view of a conventional electronic component storage package.

FIG. 4 is a perspective view of an electronic component using a conventional electronic component storage package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Lid 3 ... Piezoelectric vibrator 4 ... Container 5 ... ... Metallized wiring layers 8, 9, 11 ... Metallized metal layers 10 ... Sealing material A ... Notch

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-270351 (JP, A) JP-A-2-250359 (JP, A) Japanese Utility Model Sho 59-3547 (JP, U) (58) Survey Field (Int.Cl. ⁶ , DB name) H01L 23/02 H01L 23/10

Claims (1)

(57) [Claims] An insulating base comprising: a rectangular insulating base having a frame-shaped metal layer adhered to an outer peripheral portion of an upper surface; and a rectangular lid having a frame-shaped metal layer adhered to an outer peripheral portion of a lower surface. An electronic component housing package in which electronic components are hermetically housed by joining respective metal layers of a base and a lid via a sealing material made of solder, wherein the insulating base or the lid is provided. A notch part is formed in at least one corner of the body, and a metal layer communicating with the metal layer adhered to the insulating base or the lid is formed on the surface of the notch part. For package.