JPH05167377A - Package for accommodating electronic component - Google Patents

Abstract

PURPOSE:To operate an electronic component normally and stably for a long period by preventing a solder being a seal member from being adhered to the electronic component accommodated in the inside. CONSTITUTION:The package for accommodating an electronic component consists of an insulation base 1 and a cover 2, and the electronic component 3 is accommodated air-tightly in the inside of the package 4 comprising the insulation base 1 and the cover 2 by adhering the cover 2 to the insulation base 1 through a frame shaped sealing member 10 made of a solder. Then a metallic layer 11 with excellent solderability is coated to a position apart by a prescribed interval from the frame shaped sealing member 10 to the inner side surface of the frame shaped sealing member 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved electronic component storage package for storing electronic components such as piezoelectric vibrators and surface acoustic wave filters.

[0002]

2. Description of the Related Art Conventionally, an electronic component housing package for housing an electronic component, for example, a piezoelectric vibrator for obtaining a predetermined vibration frequency, is generally made of an electrically insulating material such as alumina ceramics as shown in FIG. Insulating substrate 21 having a metallized wiring layer 22 made of high melting point metal powder such as tungsten, molybdenum, and manganese derived from the top surface to the bottom surface, and attached to a part of the metallized wiring layer 22 via a conductive adhesive, A holding metal fitting 23 for holding the piezoelectric vibrator 25 and connecting an electrode of the piezoelectric vibrator 25 to an external electric circuit, and a bowl-shaped lid body 24 also made of an electrically insulating material are provided on the holding metal fitting 23. The piezoelectric vibrator 25 is bonded and held via a conductive adhesive made of polyimide conductive resin, and each electrode of the piezoelectric vibrator 25 is electrically connected to the holding metal fitting 23. After that, the lid 24 is joined to the upper surface of the insulating substrate 21 by the frame-shaped sealing material 26 made of solder,
A piezoelectric vibrator 25 is provided inside a container composed of an insulating base 21 and a lid 24.
Is hermetically accommodated to form a piezoelectric vibrating element as a final product.

In the package for housing electronic parts, frame-shaped metallized metal layers 27 and 28 made of refractory metal powder such as tungsten and molybdenum are preliminarily formed on the outer periphery of the upper surface of the insulating substrate 21 and the outer periphery of the lower surface of the lid 24. The lid 24 is bonded to the insulating substrate 21 by bonding the metallized metal layers 27 and 28, which are respectively deposited, with the sealing material 26 made of solder.

Further, the sealing material 26 made of the solder is an insulating substrate.
When the lid 24 is joined to the lid 21 and the piezoelectric vibrator 25 is housed in the container in an airtight manner, in order to improve the workability of the joining, a metallized metal layer usually attached to the outer periphery of the lower surface of the lid 24. The sealing material 26 is bonded to the metallized metal layer 28 of the lid 24 in advance, and the solder paste containing flux in the solder powder is bonded to the surface of the metallized metal layer 28 by the conventional screen printing method. It is carried out by printing and coating by a method or the like and heating this to a temperature of about 350 ° C. to heat and melt the solder.

[0005]

However, in this conventional package for storing electronic components, the solder paste is heated and melted, and the sealing material 26 made of solder is previously bonded to the surface of the metallized metal layer 28 of the lid 24. At this time, a part of the solder scatters and adheres to the surface of the central portion of the lid body 24 due to the evaporation of the flux in the solder paste, which causes the piezoelectric vibrator 25 to be placed inside the container including the insulating base 21 and the lid body 24. After being housed, when external vibration is applied, it falls off from the surface of the lid body 24 and adheres to the piezoelectric vibrator 25, causing variations in the vibration frequency of the piezoelectric vibrator 25, or short-circuiting of the electrodes to cause piezoelectric vibration. It had the drawback of losing the function of the child 25.

[0006]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and an object of the present invention is to keep an electronic component in a normal condition for a long period of time without the solder of an encapsulating material being attached to the electronic component housed inside. An object of the present invention is to provide a package for storing electronic components that can be stably operated.

[0007]

The present invention comprises an insulating base having a frame-shaped metallized metal layer on the upper surface and a lid having a frame-shaped metallized metal layer on the lower surface, and the metallization of each of the insulating base and the lid. What is claimed is: 1. A package for storing electronic parts, wherein an electronic part is hermetically housed inside a container composed of an insulating base and a lid by joining a metal layer with a sealing material made of solder. The body is characterized in that, on the inner surface of the frame-shaped metallized metal layer, a metal layer having a good solder joint property is applied at a position separated from the frame-shaped metallized metal layer by a predetermined distance.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment in which the electronic component housing package of the present invention is applied to a package housing a piezoelectric vibrator, wherein 1 is an insulating substrate and 2 is a lid. This insulating substrate 1
The lid 4 and the lid 2 constitute a container 4 for housing the piezoelectric vibrator 3.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, and a silicon carbide sintered body. Alumina (Al ₂ O
₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (M
gO) and other raw material powders are mixed with an appropriate organic solvent and solvent to form a slurry, and a ceramic green sheet (ceramic green sheet) is obtained by applying the well-known doctor blade method and kander roll method. After that, appropriate punching process is applied to the ceramic green sheets and multiple sheets are laminated at high temperature (about 1600 ℃)
It is manufactured by firing at a temperature of.

Further, the insulating substrate 1 has a metallized wiring layer 6 extending from the upper surface thereof to the lower surface thereof through through holes 5.
The holding member 7 for holding the piezoelectric vibrator 3 is attached to the upper surface of the insulating base 1 of the metallized wiring layer 6 via a conductive adhesive, and the lower surface of the insulating base 1 is adhered. Is connected to an external electric circuit via a brazing material such as solder.

The metallized wiring layer 6 is made of tungsten.
(W), molybdenum (Mo), manganese (Mn) and other refractory metal powders, such as a refractory metal powder such as tungsten, a suitable organic solvent, a metal paste obtained by adding and mixing a solvent insulating substrate 1 The ceramic green sheet to be the above is printed and applied in advance by a thick film method such as a well-known screen printing method, so that the through hole 5 is formed from the upper surface of the insulating substrate 1.
It is formed so as to be led out to the lower surface via.

On the surface of the metallized wiring layer 6, a metal of good conductivity such as nickel (Ni), gold (Au) and excellent in corrosion resistance is formed by plating or the like to a thickness of 1.0 to 20.0 μm. If it is attached, the metallized wiring layer 6 can be effectively prevented from being oxidized and corroded. Therefore, in order to effectively prevent the metallized wiring layer 6 from being oxidized and corroded, it is preferable to deposit nickel, gold or the like in a thickness of 1.0 to 20.0 μm on the surface of the metallized wiring layer 6.

A holding member 7 is attached to the metallized wiring layer 6 on the upper surface of the insulating substrate 1 through a conductive adhesive such as conductive polyimide, and the upper portion of the holding member 7 is also made of the conductive polyimide. The piezoelectric vibrator 3 is adhesively held by electrically connecting its electrodes to the holding member 7 via a conductive adhesive such as.

The holding member 7 holds the piezoelectric vibrator 3 and electrically connects the electrodes of the piezoelectric vibrator 3 to the metallized wiring layer 6, for example, nickel silver (Cu-Zn-Ni alloy) or Kovar metal (Fe-Ni-Co alloy), 42 alloy (Fe-Ni
It is formed of a metal material having elasticity such as an alloy).

The holding member 7 is formed into a predetermined shape by adopting a conventionally known metal working method such as a rolling working method, a punching working method and a bending working method for an ingot (lump) made of a metallic material such as nickel silver. Molded.

The insulating substrate 1 to which the holding member 7 is attached also has a frame-shaped metallized metal layer 8 adhered to the outer peripheral surface of the upper surface thereof, and the metallized metal layer 8 has a bowl-shaped lid 2. They are joined together via a sealing material 10 made of solder, whereby the inside of the container 4 made of the insulating base 1 and the lid 2 is hermetically sealed.

The metallized metal layer 8 deposited on the outer peripheral portion of the upper surface of the insulating substrate 1 is made of a refractory metal powder such as tungsten or molybdenum, and a suitable organic solvent or solvent is added to the refractory metal powder such as tungsten. The metal paste obtained by mixing is pre-printed on the ceramic green sheet to be the insulating substrate 1 by a thick film method such as the well-known screen printing method, so that it is adhered in a frame shape to the outer peripheral portion of the upper surface of the insulating substrate 1. It is formed.

It should be noted that the metallized metal layer 8 is made of nickel (Ni) having a good wettability with respect to the solder by a plating method or the like so that the solder constituting the sealing material 10 is firmly bonded to the surface thereof.
Layered to a thickness of 20.0 μm.

Further, the metallized metal layer 8 of the insulating substrate 1
The bowl-shaped lid 2 to be joined to is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, and a silicon carbide sintered body. A frame-shaped metallized metal layer 9 applied to the outer periphery of the lower surface.
Is bonded to the metallized metal layer 8 on the upper surface of the insulating substrate 1 via the sealing material 10 to bond to the upper surface of the insulating substrate 1.

When the lid 2 is made of, for example, an aluminum oxide sintered body, alumina (Al ₂ O ₃ ) and silica (Si
O _2), calcia (CaO), and molded by applying a constant pressure to fill in the press mold having a magnesia (MgO) material powder in a suitable organic solvent, a predetermined shape which solvent was added and mixed, such as Then, the molded product is manufactured by firing at a temperature of about 1600 ° C.

The metallized metal layer 9 deposited on the outer peripheral portion of the lower surface of the lid 2 is made of a metal such as silver and palladium, and is obtained by adding glass frit, an organic solvent, and a solvent to powder of silver and palladium and mixing them. The metal paste is applied to the outer peripheral surface of the lower surface of the lid body 2 by a thick film method such as a well-known screen printing method and is baked at a temperature of about 1000 ° C. to form a frame shape on the outer peripheral surface of the lower surface of the lid body 2. Be applied.

Further, a sealing material 10 made of solder is pre-deposited on the surface of the metallized metal layer 9 in order to improve workability when the lid 2 is joined to the insulating substrate 1. The encapsulant 10 is made of a solder paste containing a flux and the like printed on the metallized metal layer 9 by a well-known screen printing method or the like, and is heated and melted at a temperature of about 350 ° C. to be metallized. It is adhered and bonded to the surface of the metal layer 9.

On the lower surface of the lid body 2, a metal layer 11 made of a metal material having a good bonding property with solder is applied at a position separated from the metallized metal layer 9 by a distance L of 0.1 mm or more.

The metal layer 11 has a function of firmly bonding the solder scattered on the central portion of the lid body 2 to the lid body 2, and the metallized metal layer 9 of the lid body 2 is covered with the sealing material 10 made of solder. At the time of adhering and joining, even if a part of the solder is scattered to the central portion side of the lid body 2, the scattered solder is covered by the metal layer 11
After the piezoelectric vibrator 3 is housed inside the container 4 consisting of the insulating substrate 1 and the lid 2,
Even if external vibration is applied to 4, the scattered solder is a lid
It is possible to operate the piezoelectric vibrator 3 normally and stably for a long period of time without dropping off from 2 and adhering to the piezoelectric vibrator 3.

When the distance L from the metallized metal layer 9 of the metal layer 11 adhered to the lid 2 is less than 0.1 mm, the sealing material 10 made of solder is adhered and bonded to the metallized metal layer 9. At this time, a part of the solder flows out onto the metal layer 11 to reduce the amount of the sealing material 10 in the metallized metal layer 9, and as a result, it becomes difficult to firmly bond the lid body 2 to the insulating base body 1. .. Therefore, the metal layer 11 is located at a distance from the metallized metal layer 9
It is formed at a position where L is 0.1 mm or more.

The metal layer 11 is made of a metal such as silver (Ag), gold (Au), and nickel (Ni) that has good bonding properties with solder. For example, when the metal layer 11 is made of silver, the silver powder is 80.0 to 95.0% by weight. 5.0 to 20.0 wt% PbO-B ₂ O ₃ -ZnO system or PbO-B ₂ O ₃ -ZnO
-Metallic paste is obtained by adding and mixing glass powder such as SiO ₂ system and an appropriate organic binder and solvent, and then the metallic paste is applied to the lower surface of the lid 2 by the conventional screen printing method or dropping method. By applying and finally this at about 800 ° C
It is attached to the lower surface of the lid body 2 by baking at the temperature of.

Thus, according to the package for storing electronic components of the present invention, the piezoelectric vibrator 3 is adhered and fixed to the holding member 7 attached to the insulating base 1 with a conductive adhesive and is attached to the upper surface of the insulating base 1. The metallized metal layer 8 is attached to the metallized metal layer 8 on the lower surface of the lid 2, and the metallized metal layer 9 is attached to the lid 2 via an encapsulant 10 made of solder which is previously attached and joined to the insulating base 1 and the lid. The piezoelectric vibrator 3 is hermetically housed in the container 4 including the body 2 to form a piezoelectric vibrator as a product.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the gist of the present invention. For example, in the embodiment, the insulating substrate 1 is formed into a flat plate shape. None, the lid 2 has a bowl shape, but as shown in FIG. 2, the insulating base 1 may be provided with a concave portion 1a for accommodating an electronic component, and the lid 2 may have a flat plate shape. In this case, a flat lid
The metal layer 11 having a good bondability with the solder deposited on the second layer 2 is formed at a distance L of 0.1 mm or more from the frame-shaped metallized metal layer 9 deposited on the outer peripheral portion.

Further, in the above-mentioned embodiments, the package for accommodating the piezoelectric vibrator is explained as an example, but other electronic parts,
For example, it can be applied to a package containing a surface acoustic wave filter or the like.

[0030]

According to the electronic component storing package of the present invention, the solder bondability is provided on the inner surface of the frame-shaped metallized metal layer for bonding, which is attached to the lid, at a position separated from the metallized metal layer by a predetermined distance. When a sealing material made of solder is previously attached and bonded to the metallized metal layer because a good metal layer is deposited, even if a part of the solder scatters on the central portion side of the lid, the scattered solder is It is firmly bonded to the lid by the metal layer, and as a result, after the electronic components are housed inside the container consisting of the insulating substrate and the lid, the solder that has scattered even if external vibration is applied to the container is the lid. It will not fall off and adhere to the electronic components at all, and the electronic components can always be stably operated for a long period of time.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a package for storing electronic components of the present invention.

FIG. 2 is a sectional view showing another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a conventional electronic component storage package.

[Explanation of symbols]

 1 ... Insulating substrate 2 ... Lid body 3 ... Piezoelectric vibrator as an electronic component 4 ... Container 6 ... Metallized wiring layer 7 ... -Holding member 8 ... Metallized metal layer provided on the insulating substrate 9 ... Metallized metal layer provided on the lid 10 ... Sealing material made of solder 11 ... Solder A metal layer with good bonding properties

Claims (1)

[Claims] 1. A seal comprising an insulating base having a frame-shaped metallized metal layer on an upper surface and a lid having a frame-shaped metallized metal layer on a lower surface, each metallized metal layer of the insulating base and the lid being made of solder. A package for storing electronic parts, wherein electronic parts are hermetically housed in a container composed of an insulating base and a cover by joining with a stopper, the cover being a frame-shaped metallized metal layer. A package for storing electronic parts, characterized in that a metal layer having a good solder joint property is deposited on the inner surface of the substrate at a position spaced a predetermined distance from the frame-shaped metallized metal layer.