JPS56107556A - Setting device of exposure position - Google Patents
Setting device of exposure positionInfo
- Publication number
- JPS56107556A JPS56107556A JP982780A JP982780A JPS56107556A JP S56107556 A JPS56107556 A JP S56107556A JP 982780 A JP982780 A JP 982780A JP 982780 A JP982780 A JP 982780A JP S56107556 A JPS56107556 A JP S56107556A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- wafer
- amount
- substrate
- print gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/703—Gap setting, e.g. in proximity printer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To provide exposure with high resolving power by a method wherein, in connection with a mechanism for setting the amount of a print gap during the process of manufacturing a semiconductor, parallel beams are applied in between a substrate coated with photoresist and a mask, and the change of the volume of beams is detected by moving the substrate or the mask in order to set the most suitable amount of a print gap, allowing the mechanism to maintain the value. CONSTITUTION:In a proximity exposure device for setting the amount of a print gap between a semiconductor substrate and a photomask, a beam generating means 1 is arranged on one side of a mask provided in the direction opposite to a wafer 5 coated with photoresist 6. A beam 2 is applied to the portion in almost nearly parallel with that between the wafer 5 and the mask 4 to move the wafer or the mask and detect the amount of light of the beam with a detecting means 3, and the wafer or the mask is stopped where the most suitable amount of the gap has been set. By so doing, a proximate condition becomes available, while definition is improved, so that minute processing can be carried out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP982780A JPS56107556A (en) | 1980-01-29 | 1980-01-29 | Setting device of exposure position |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP982780A JPS56107556A (en) | 1980-01-29 | 1980-01-29 | Setting device of exposure position |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56107556A true JPS56107556A (en) | 1981-08-26 |
Family
ID=11730959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP982780A Pending JPS56107556A (en) | 1980-01-29 | 1980-01-29 | Setting device of exposure position |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56107556A (en) |
-
1980
- 1980-01-29 JP JP982780A patent/JPS56107556A/en active Pending
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