JP4439090B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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JP4439090B2
JP4439090B2 JP2000224975A JP2000224975A JP4439090B2 JP 4439090 B2 JP4439090 B2 JP 4439090B2 JP 2000224975 A JP2000224975 A JP 2000224975A JP 2000224975 A JP2000224975 A JP 2000224975A JP 4439090 B2 JP4439090 B2 JP 4439090B2
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conductor wire
semiconductor chip
bonding
semiconductor device
bonding pad
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Japanese (ja)
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JP2002043357A5 (enExample
JP2002043357A (ja
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健治 桝本
睦 升本
彰 辛島
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日本テキサス・インスツルメンツ株式会社
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Priority to JP2000224975A priority Critical patent/JP4439090B2/ja
Priority to US09/909,340 priority patent/US6583483B2/en
Publication of JP2002043357A publication Critical patent/JP2002043357A/ja
Priority to US10/414,847 priority patent/US6780749B2/en
Publication of JP2002043357A5 publication Critical patent/JP2002043357A5/ja
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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
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US10/414,847 US6780749B2 (en) 2000-07-26 2003-04-16 Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges

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Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070086954A1 (en) * 1998-11-23 2007-04-19 Miller Christopher C Method and apparatus for treatment of respiratory infections by nitric oxide inhalation
US6456099B1 (en) * 1998-12-31 2002-09-24 Formfactor, Inc. Special contact points for accessing internal circuitry of an integrated circuit
TW465064B (en) * 2000-12-22 2001-11-21 Advanced Semiconductor Eng Bonding process and the structure thereof
US7021520B2 (en) * 2001-12-05 2006-04-04 Micron Technology, Inc. Stacked chip connection using stand off stitch bonding
JP2004172477A (ja) * 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP4427298B2 (ja) 2003-10-28 2010-03-03 富士通株式会社 多段バンプの形成方法
US7091124B2 (en) 2003-11-13 2006-08-15 Micron Technology, Inc. Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US7064434B2 (en) * 2003-11-26 2006-06-20 Atmel Corporation Customized microelectronic device and method for making customized electrical interconnections
US7074705B2 (en) * 2004-02-25 2006-07-11 Agere Systems Inc. Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
US7064433B2 (en) * 2004-03-01 2006-06-20 Asm Technology Singapore Pte Ltd Multiple-ball wire bonds
US7214606B2 (en) * 2004-03-11 2007-05-08 Asm Technology Singapore Pte Ltd. Method of fabricating a wire bond with multiple stitch bonds
US20050247894A1 (en) 2004-05-05 2005-11-10 Watkins Charles M Systems and methods for forming apertures in microfeature workpieces
JP4083142B2 (ja) * 2004-06-02 2008-04-30 富士通株式会社 半導体装置
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7009305B2 (en) * 2004-06-30 2006-03-07 Agere Systems Inc. Methods and apparatus for integrated circuit ball bonding using stacked ball bumps
US7425499B2 (en) 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
US7083425B2 (en) * 2004-08-27 2006-08-01 Micron Technology, Inc. Slanted vias for electrical circuits on circuit boards and other substrates
CN101002314A (zh) * 2004-08-31 2007-07-18 松下电器产业株式会社 微型机械设备
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7271482B2 (en) 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US8016182B2 (en) 2005-05-10 2011-09-13 Kaijo Corporation Wire loop, semiconductor device having same and wire bonding method
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
KR100698527B1 (ko) * 2005-08-11 2007-03-22 삼성전자주식회사 금속 범프를 이용한 기둥 범프를 구비하는 칩 적층 패키지및 그의 제조방법
US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7622377B2 (en) * 2005-09-01 2009-11-24 Micron Technology, Inc. Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
JP4881620B2 (ja) * 2006-01-06 2012-02-22 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
US7573137B2 (en) * 2006-03-31 2009-08-11 Texas Instruments Incorporated Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
US7749899B2 (en) 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
DE102006033222B4 (de) * 2006-07-18 2014-04-30 Epcos Ag Modul mit flachem Aufbau und Verfahren zur Bestückung
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
KR101269329B1 (ko) 2006-12-27 2013-05-29 매그나칩 반도체 유한회사 반도체 칩
US7719122B2 (en) * 2007-01-11 2010-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. System-in-package packaging for minimizing bond wire contamination and yield loss
JP2008198909A (ja) * 2007-02-15 2008-08-28 Elpida Memory Inc 半導体パッケージ
US20080246129A1 (en) * 2007-04-04 2008-10-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing semiconductor device and semiconductor device
US20080272487A1 (en) * 2007-05-04 2008-11-06 Il Kwon Shim System for implementing hard-metal wire bonds
SG150395A1 (en) 2007-08-16 2009-03-30 Micron Technology Inc Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
SG150410A1 (en) 2007-08-31 2009-03-30 Micron Technology Inc Partitioned through-layer via and associated systems and methods
CN100585842C (zh) * 2007-10-29 2010-01-27 瑞鼎科技股份有限公司 芯片及其制造方法
US7884015B2 (en) 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7800238B2 (en) * 2008-06-27 2010-09-21 Micron Technology, Inc. Surface depressions for die-to-die interconnects and associated systems and methods
CN101924046A (zh) * 2009-06-16 2010-12-22 飞思卡尔半导体公司 在半导体器件中形成引线键合的方法
US8008785B2 (en) * 2009-12-22 2011-08-30 Tessera Research Llc Microelectronic assembly with joined bond elements having lowered inductance
TWI409933B (zh) * 2010-06-15 2013-09-21 力成科技股份有限公司 晶片堆疊封裝結構及其製法
US20120224332A1 (en) * 2011-03-02 2012-09-06 Yun Jaeun Integrated circuit packaging system with bump bonded dies and method of manufacture thereof
JP6227223B2 (ja) * 2012-03-30 2017-11-08 富士通テン株式会社 半導体装置、及び半導体装置の製造方法
JP6100648B2 (ja) * 2013-08-28 2017-03-22 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
US9515049B2 (en) * 2013-12-19 2016-12-06 Intel Corporation Flexibly-wrapped integrated circuit die
CN111916419B (zh) * 2019-05-08 2024-01-09 菲尼萨公司 用于光电模块的电耦合配件和方法
JP7249302B2 (ja) * 2020-03-19 2023-03-30 株式会社東芝 半導体装置
JP7548942B2 (ja) * 2020-03-27 2024-09-10 京東方科技集團股▲ふん▼有限公司 表示パネル及び表示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296744A (en) * 1991-07-12 1994-03-22 Vlsi Technology, Inc. Lead frame assembly and method for wiring same
JPH09232465A (ja) * 1996-02-27 1997-09-05 Fuji Kiko Denshi Kk 半導体実装用プリント配線板
JP2001127246A (ja) * 1999-10-29 2001-05-11 Fujitsu Ltd 半導体装置
US6291898B1 (en) * 2000-03-27 2001-09-18 Advanced Semiconductor Engineering, Inc. Ball grid array package

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