JP4410076B2 - 現像処理装置 - Google Patents
現像処理装置 Download PDFInfo
- Publication number
- JP4410076B2 JP4410076B2 JP2004294827A JP2004294827A JP4410076B2 JP 4410076 B2 JP4410076 B2 JP 4410076B2 JP 2004294827 A JP2004294827 A JP 2004294827A JP 2004294827 A JP2004294827 A JP 2004294827A JP 4410076 B2 JP4410076 B2 JP 4410076B2
- Authority
- JP
- Japan
- Prior art keywords
- outer peripheral
- substrate
- wafer
- processing apparatus
- development processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
Description
2倍程度の0.5mm程度に設定される。こうすることにより,気体吹出し口130から吹出された気体がウェハWの裏面,外周部140の水平部140bの裏面に沿って強制的に流され,隙間Dの下端部側を外側に向かって通過する強い気流が形成される。したがって,隙間Dから漏れた液体をより効率的に外側に押し流し外周板140の裏面を伝って排除できる。
30 現像処理装置
120 チャック
123 内周カップ
130 気体吹出し口
140 外周板
160 洗浄液供給ノズル
D 隙間
W ウェハ
Claims (11)
- 基板を現像処理する現像処理装置であって,
基板を保持する基板保持部材と,
基板から飛散する液体を受け止めるために,前記基板保持部材の周囲に設けられたカップと,
前記基板保持部材に保持された基板の外周部を囲み,前記基板の外周部との間で隙間を形成する外周板と,
前記基板保持部材に保持された基板の裏面において基板の中央部側から前記基板の外周部側に向かって流れて前記隙間の下端部側を通過する気流を形成する気体吹出し口と,を有し,
前記外周板は,水平部と垂直部とを有し,
前記水平部の表面は,前記基板保持部材に保持された基板の表面と同一平面上に位置していると共に,当該水平部の厚さは,基板と同じ厚さを有し,前記垂直部は前記カップ内に配置されていることを特徴とする,現像処理装置。 - 前記外周板と基板の外周部との隙間は,基板の表面側から前記隙間を通過した液体が前記外周板の裏面を伝って流れるような幅に設定されていることを特徴とする,請求項1に記載の現像処理装置。
- 前記外周板の裏面には,親水化処理が施されていることを特徴とする,請求項1または2のいずれかに記載の現像処理装置。
- 前記気体吹出し口は,上方向から基板の外周部側に傾いた斜め上方に気体を吹き出すように形成されていることを特徴とする,請求項1〜3のいずれかに記載の現像処理装置。
- 前記気体吹出し口は,基板の外周部に直接気体を吹き付けるように形成されていることを特徴とする,請求項4に記載の現像処理装置。
- 前記気体吹出し口は,前記基板の裏面側において同心円状に多重に形成されていることを特徴とする,請求項4に記載の現像処理装置。
- 前記多重の気体吹出し口の中の外側の気体吹出し口は,基板の外周部に直接気体を吹き付けるように形成されていることを特徴とする,請求項6に記載の現像処理装置。
- 前記外周板を昇降する昇降駆動部をさらに有することを特徴とする,請求項1〜7のいずれかに記載の現像処理装置。
- 前記外周板の裏面は,前記隙間の下端部を形成する部分から外側に向かって次第に下がるように傾斜していることを特徴とする,請求項1〜8のいずれかに記載の現像処理装置。
- 前記基板の裏面側には,前記気体吹出し口から吹き出された気体を前記基板の裏面と前記外周板の裏面に沿って流す流路が形成されていることを特徴とする,請求項1〜9のいずれかに記載の現像処理装置。
- 前記外周板の表面には,疎水化処理が施されていることを特徴とする,請求項1に記載の現像処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004294827A JP4410076B2 (ja) | 2004-10-07 | 2004-10-07 | 現像処理装置 |
US11/243,483 US7419316B2 (en) | 2004-10-07 | 2005-10-05 | Developing treatment apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004294827A JP4410076B2 (ja) | 2004-10-07 | 2004-10-07 | 現像処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006108481A JP2006108481A (ja) | 2006-04-20 |
JP4410076B2 true JP4410076B2 (ja) | 2010-02-03 |
Family
ID=36205120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004294827A Expired - Fee Related JP4410076B2 (ja) | 2004-10-07 | 2004-10-07 | 現像処理装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7419316B2 (ja) |
JP (1) | JP4410076B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100900628B1 (ko) * | 2006-09-15 | 2009-06-02 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
JP4737638B2 (ja) * | 2007-01-19 | 2011-08-03 | 東京エレクトロン株式会社 | 現像処理装置 |
US8092599B2 (en) * | 2007-07-10 | 2012-01-10 | Veeco Instruments Inc. | Movable injectors in rotating disc gas reactors |
JP5312923B2 (ja) * | 2008-01-31 | 2013-10-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5029486B2 (ja) * | 2008-05-13 | 2012-09-19 | 東京エレクトロン株式会社 | 塗布装置、塗布方法及び記憶媒体 |
JP5012651B2 (ja) * | 2008-05-14 | 2012-08-29 | 東京エレクトロン株式会社 | 塗布装置、塗布方法、塗布、現像装置及び記憶媒体 |
JP5275275B2 (ja) * | 2010-02-25 | 2013-08-28 | 株式会社東芝 | 基板処理方法、euvマスクの製造方法、euvマスクおよび半導体装置の製造方法 |
KR101098987B1 (ko) * | 2010-04-19 | 2011-12-28 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
JP5795917B2 (ja) * | 2010-09-27 | 2015-10-14 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP5006464B1 (ja) * | 2011-10-25 | 2012-08-22 | ミクロ技研株式会社 | 基板処理装置及び基板処理方法 |
CN104425323B (zh) * | 2013-08-30 | 2018-01-19 | 细美事有限公司 | 处理基板的装置和清洁该装置的方法 |
JP6559706B2 (ja) | 2014-01-27 | 2019-08-14 | ビーコ インストルメンツ インコーポレイテッド | 化学蒸着システム用の複合半径を有する保持ポケットを有するウェハキャリア |
JP6391524B2 (ja) * | 2015-03-31 | 2018-09-19 | 株式会社Screenホールディングス | 脱酸素装置および基板処理装置 |
CN106356316B (zh) * | 2015-07-14 | 2018-10-09 | 沈阳芯源微电子设备有限公司 | 一种工艺单元排废积液检测装置 |
WO2017042974A1 (ja) * | 2015-09-11 | 2017-03-16 | ギガフォトン株式会社 | 極端紫外光生成装置 |
TWI645913B (zh) * | 2016-11-10 | 2019-01-01 | 辛耘企業股份有限公司 | 液體製程裝置 |
JP7137986B2 (ja) * | 2018-07-19 | 2022-09-15 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
KR20220059638A (ko) * | 2020-11-03 | 2022-05-10 | 삼성전자주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG103277A1 (en) * | 1996-09-24 | 2004-04-29 | Tokyo Electron Ltd | Method and apparatus for cleaning treatment |
JPH10340948A (ja) * | 1997-06-09 | 1998-12-22 | M Setetsuku Kk | 表面処理装置 |
JP3265238B2 (ja) * | 1997-08-01 | 2002-03-11 | 東京エレクトロン株式会社 | 液膜形成装置及びその方法 |
JP3923676B2 (ja) * | 1999-04-21 | 2007-06-06 | 株式会社東芝 | 基板処理方法 |
KR100597287B1 (ko) * | 1999-07-28 | 2006-07-04 | 동경 엘렉트론 주식회사 | 기판처리장치 및 그 방법 |
US6289550B1 (en) * | 2000-03-10 | 2001-09-18 | United Microelectronics Corp. | Jet cleaning device for developing station |
JP3920608B2 (ja) * | 2001-09-21 | 2007-05-30 | 東京エレクトロン株式会社 | 現像装置及び現像方法 |
JP3718647B2 (ja) * | 2001-10-19 | 2005-11-24 | 東京エレクトロン株式会社 | 現像装置及び現像方法 |
JP3761457B2 (ja) * | 2001-12-04 | 2006-03-29 | Necエレクトロニクス株式会社 | 半導体基板の薬液処理装置 |
JP4194302B2 (ja) | 2002-06-07 | 2008-12-10 | 東京エレクトロン株式会社 | 現像装置及び現像処理方法 |
-
2004
- 2004-10-07 JP JP2004294827A patent/JP4410076B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-05 US US11/243,483 patent/US7419316B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7419316B2 (en) | 2008-09-02 |
US20060086460A1 (en) | 2006-04-27 |
JP2006108481A (ja) | 2006-04-20 |
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