JP4408566B2 - 基板保持器 - Google Patents

基板保持器 Download PDF

Info

Publication number
JP4408566B2
JP4408566B2 JP2000549428A JP2000549428A JP4408566B2 JP 4408566 B2 JP4408566 B2 JP 4408566B2 JP 2000549428 A JP2000549428 A JP 2000549428A JP 2000549428 A JP2000549428 A JP 2000549428A JP 4408566 B2 JP4408566 B2 JP 4408566B2
Authority
JP
Japan
Prior art keywords
substrate
polishing
retainer
periphery
sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000549428A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002515349A5 (enExample
JP2002515349A (ja
Inventor
スティーヴン， エム． ズニガ，
ハン， チー チェン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2002515349A publication Critical patent/JP2002515349A/ja
Publication of JP2002515349A5 publication Critical patent/JP2002515349A5/ja
Application granted granted Critical
Publication of JP4408566B2 publication Critical patent/JP4408566B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000549428A 1998-05-15 1999-04-30 基板保持器 Expired - Fee Related JP4408566B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/080,094 1998-05-15
US09/080,094 US6436228B1 (en) 1998-05-15 1998-05-15 Substrate retainer
PCT/US1999/009569 WO1999059776A1 (en) 1998-05-15 1999-04-30 Substrate retainer

Publications (3)

Publication Number Publication Date
JP2002515349A JP2002515349A (ja) 2002-05-28
JP2002515349A5 JP2002515349A5 (enExample) 2009-07-30
JP4408566B2 true JP4408566B2 (ja) 2010-02-03

Family

ID=22155219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000549428A Expired - Fee Related JP4408566B2 (ja) 1998-05-15 1999-04-30 基板保持器

Country Status (6)

Country Link
US (5) US6436228B1 (enExample)
EP (1) EP1077789A1 (enExample)
JP (1) JP4408566B2 (enExample)
KR (1) KR20010043642A (enExample)
TW (1) TW541229B (enExample)
WO (1) WO1999059776A1 (enExample)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6361419B1 (en) * 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
DE60138343D1 (de) * 2000-07-31 2009-05-28 Ebara Corp Substrathalter und Poliervorrichtung
US20040020012A1 (en) * 2002-08-02 2004-02-05 Gupte Sheel A. Self-contained hinge for flip-style device
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
US7198548B1 (en) * 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US20100120335A1 (en) * 2008-11-07 2010-05-13 Novellus Systems, Inc. Partial Contact Wafer Retaining Ring Apparatus
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
JP2011255464A (ja) * 2010-06-09 2011-12-22 Tokyo Seimitsu Co Ltd テンプレート押圧ウェハ研磨方式
US20120021673A1 (en) * 2010-07-20 2012-01-26 Applied Materials, Inc. Substrate holder to reduce substrate edge stress during chemical mechanical polishing
JP6073222B2 (ja) 2010-08-06 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保定リングを用いた基板縁部調整
US20120040591A1 (en) * 2010-08-16 2012-02-16 Strasbaugh, Inc. Replaceable cover for membrane carrier
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
CN104919575B (zh) 2013-01-11 2018-09-18 应用材料公司 化学机械抛光设备及方法
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD766849S1 (en) 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
US9368371B2 (en) * 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
CN107112260A (zh) * 2014-12-08 2017-08-29 俞贤贞 化学研磨装置用承载头的固定环以及包括其的承载头
US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
JP1556433S (enExample) * 2015-10-06 2016-08-15
US10029346B2 (en) 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド
CN107088829B (zh) * 2017-05-16 2023-08-08 张家港市宇安精密机械有限公司 套筒研磨夹具
CN107030592A (zh) * 2017-05-16 2017-08-11 遵义顺峰汽车零部件制造有限公司 一种汽车套筒加工用工装
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11344991B2 (en) 2019-02-28 2022-05-31 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head
JP1651618S (enExample) * 2019-07-11 2020-01-27
JP1651619S (enExample) * 2019-07-11 2020-01-27
JP1651623S (enExample) * 2019-07-18 2020-01-27
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US11511390B2 (en) 2019-08-30 2022-11-29 Applied Materials, Inc. Pivotable substrate retaining ring
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
JP7518175B2 (ja) 2020-10-13 2024-07-17 アプライド マテリアルズ インコーポレイテッド 接点延長部又は調節可能な止め具を有する基板研磨装置
US11623321B2 (en) * 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
US20230063687A1 (en) * 2021-08-27 2023-03-02 Taiwan Semiconductor Manufacturing Company Limited Apparatus for polishing a wafer
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
CN115008342B (zh) * 2022-06-15 2023-08-25 安徽禾臣新材料有限公司 一种晶片抛光用防崩角的无蜡垫及其生产工艺
WO2024049890A1 (en) * 2022-09-01 2024-03-07 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head
JP1741174S (ja) * 2022-10-20 2023-04-06 サセプタ
JP1745925S (ja) * 2022-10-20 2023-06-08 サセプタカバー
JP1745873S (ja) * 2022-10-20 2023-06-08 サセプタ
JP1741176S (ja) * 2022-10-20 2023-04-06 サセプタ用カバーベース
JP1741172S (ja) * 2022-10-20 2023-04-06 サセプタカバー
JP1746407S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746405S (ja) * 2023-01-11 2023-06-15 サセプタカバー
JP1746403S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746408S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746406S (ja) * 2023-01-11 2023-06-15 サセプタユニット

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2671368A (en) * 1951-03-12 1954-03-09 Diebold Fritz Wrench, including movable or stationary jaws
JPS5027195A (enExample) 1973-07-13 1975-03-20
US4319432A (en) * 1980-05-13 1982-03-16 Spitfire Tool And Machine Co. Polishing fixture
USD271939S (en) * 1981-07-24 1983-12-27 Little William D C-clamp
US4954142A (en) 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
JPH04118968A (ja) 1990-09-10 1992-04-20 Seiko Epson Corp 半導体集積回路装置
JPH0727748A (ja) 1991-11-15 1995-01-31 Hideaki Takahashi 板材の熱応力破壊試験法
US5205082A (en) 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
JP3218572B2 (ja) 1992-07-01 2001-10-15 不二越機械工業株式会社 ウェーハ加圧用ポリッシングプレート
DE69316849T2 (de) 1992-11-27 1998-09-10 Ebara Corp., Tokio/Tokyo Verfahren und Gerät zum Polieren eines Werkstückes
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
US5351585A (en) * 1993-08-11 1994-10-04 Petersen Manufacturing Co. Inc. Large capacity locking pliers
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3329034B2 (ja) 1993-11-06 2002-09-30 ソニー株式会社 半導体基板の研磨装置
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5533924A (en) 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
TW400567B (en) * 1995-04-10 2000-08-01 Matsushita Electric Industrial Co Ltd The polishing device and its polishing method for the substrate
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
KR100485002B1 (ko) * 1996-02-16 2005-08-29 가부시키가이샤 에바라 세이사꾸쇼 작업물폴리싱장치및방법
US5876273A (en) 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
JP2979382B2 (ja) 1996-04-12 1999-11-15 元旦ビューティ工業株式会社 建築物の縦葺き外装構造
JP4118968B2 (ja) 1996-07-23 2008-07-16 関西ペイント株式会社 水性防食塗料組成物
US6146259A (en) * 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
USD457410S1 (en) * 1996-12-05 2002-05-21 Eric Von Fange C-clamp
US5865074A (en) * 1997-03-19 1999-02-02 Hsieh; Chih-Ching Box end wrench with stop means to hold down the bolt or nut to be turned
US5893307A (en) * 1997-04-25 1999-04-13 Tao; Liang-Che Pliers with biasing element
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US5944593A (en) * 1997-09-01 1999-08-31 United Microelectronics Corp. Retainer ring for polishing head of chemical-mechanical polish machines
US6080040A (en) * 1997-11-05 2000-06-27 Aplex Group Wafer carrier head with inflatable bladder and attack angle control for polishing
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6109601A (en) * 1998-02-05 2000-08-29 St. John, Sr.; Robert W. Fly tying device
JPH11279774A (ja) 1998-03-26 1999-10-12 Hitachi Chem Co Ltd エッチング装置
US6712672B1 (en) * 1998-05-06 2004-03-30 Samsung Electronics Co., Ltd. Clamping wafer holder for chemica-mechanical planarization machines and method for using it
KR100306824B1 (ko) 1998-05-06 2001-11-30 윤종용 화학적기계적평탄화기계를위한웨이퍼홀더
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390904B1 (en) 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6267655B1 (en) * 1998-07-15 2001-07-31 Mosel Vitelic, Inc. Retaining ring for wafer polishing
JP2000094307A (ja) * 1998-09-18 2000-04-04 Ebara Corp ポリッシング装置
JP3873557B2 (ja) * 2000-01-07 2007-01-24 株式会社日立製作所 半導体装置の製造方法
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US7381276B2 (en) * 2002-07-16 2008-06-03 International Business Machines Corporation Susceptor pocket with beveled projection sidewall
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7597609B2 (en) * 2006-10-12 2009-10-06 Iv Technologies Co., Ltd. Substrate retaining ring for CMP
US20090023362A1 (en) * 2007-07-17 2009-01-22 Tzu-Shin Chen Retaining ring for chemical mechanical polishing, its operational method and application system
JP5027195B2 (ja) 2009-10-05 2012-09-19 日本電波工業株式会社 電圧制御発振器

Also Published As

Publication number Publication date
US8628378B2 (en) 2014-01-14
KR20010043642A (ko) 2001-05-25
TW541229B (en) 2003-07-11
EP1077789A1 (en) 2001-02-28
US7459057B2 (en) 2008-12-02
WO1999059776A1 (en) 1999-11-25
US20090047873A1 (en) 2009-02-19
US7883397B2 (en) 2011-02-08
US20020179251A1 (en) 2002-12-05
US20130115858A1 (en) 2013-05-09
US20110104990A1 (en) 2011-05-05
US6436228B1 (en) 2002-08-20
JP2002515349A (ja) 2002-05-28
US8298047B2 (en) 2012-10-30

Similar Documents

Publication Publication Date Title
JP4408566B2 (ja) 基板保持器
US6116992A (en) Substrate retaining ring
US6890402B2 (en) Substrate holding apparatus and substrate polishing apparatus
US6872130B1 (en) Carrier head with non-contact retainer
JP4238244B2 (ja) ウエハ研磨システム
US6220944B1 (en) Carrier head to apply pressure to and retain a substrate
EP1133380B1 (en) A carrier head with edge control for chemical mechanical polishing
US6776694B2 (en) Methods for carrier head with multi-part flexible membrane
US7052375B2 (en) Method of making carrier head backing plate having low-friction coating
US6361419B1 (en) Carrier head with controllable edge pressure
US6890249B1 (en) Carrier head with edge load retaining ring
TWI314763B (en) Carrier head with flexible membrane

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060327

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081209

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090309

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090316

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090409

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090416

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090511

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090518

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20090609

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20090609

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091104

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091110

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121120

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121120

Year of fee payment: 3

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131120

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees