JP1651619S - - Google Patents

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Publication number
JP1651619S
JP1651619S JPD2019-15588F JP2019015588F JP1651619S JP 1651619 S JP1651619 S JP 1651619S JP 2019015588 F JP2019015588 F JP 2019015588F JP 1651619 S JP1651619 S JP 1651619S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-15588F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-15588F priority Critical patent/JP1651619S/ja
Priority to TW109305076F priority patent/TWD212772S/zh
Priority to US29/718,678 priority patent/USD962184S1/en
Application granted granted Critical
Publication of JP1651619S publication Critical patent/JP1651619S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-15588F 2019-07-11 2019-07-11 Active JP1651619S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-15588F JP1651619S (enExample) 2019-07-11 2019-07-11
TW109305076F TWD212772S (zh) 2019-07-11 2019-11-13 基板處理裝置用吸頂式加熱器的保持板
US29/718,678 USD962184S1 (en) 2019-07-11 2019-12-27 Retainer plate of top heater for wafer processing furnace

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-15588F JP1651619S (enExample) 2019-07-11 2019-07-11

Publications (1)

Publication Number Publication Date
JP1651619S true JP1651619S (enExample) 2020-01-27

Family

ID=69183082

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-15588F Active JP1651619S (enExample) 2019-07-11 2019-07-11

Country Status (3)

Country Link
US (1) USD962184S1 (enExample)
JP (1) JP1651619S (enExample)
TW (1) TWD212772S (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024539058A (ja) 2021-10-18 2024-10-28 ラム リサーチ コーポレーション マルチステーション型半導体処理チャンバのクリーニングのための装置
USD1114751S1 (en) * 2021-10-18 2026-02-24 Lam Research Corporation Hub with gas deflectors
CN118891705A (zh) 2021-11-23 2024-11-01 朗姆研究公司 用于清洁多站半导体处理室的装置和技术
USD1107669S1 (en) * 2022-05-02 2025-12-30 Lam Research Corporation Processing chamber purge plate
JP1732202S (ja) 2022-06-22 2022-12-14 基板保持具
JP1775347S (ja) * 2024-01-30 2024-07-12 基板搬送用保持具

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
TWD125598S1 (zh) * 2006-09-28 2008-10-21 東京威力科創股份有限公司 半導體製造用加熱器
TWD125599S1 (zh) * 2006-09-28 2008-10-21 東京威力科創股份有限公司 半導體製造用加熱器
JP2008177248A (ja) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd 研磨ヘッド用リテーナリング
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
CN109243976B (zh) * 2013-01-11 2023-05-23 应用材料公司 化学机械抛光设备及方法
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
JP1541874S (enExample) * 2015-03-16 2016-01-18
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1556433S (enExample) * 2015-10-06 2016-08-15
JP1560719S (enExample) * 2015-12-01 2016-10-11
JP1581406S (enExample) * 2016-10-14 2017-07-18
JP6912497B2 (ja) * 2016-12-01 2021-08-04 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、天井ヒータおよび半導体装置の製造方法
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR20190008101A (ko) * 2017-07-14 2019-01-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법
JP1651623S (enExample) * 2019-07-18 2020-01-27
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device

Also Published As

Publication number Publication date
TWD212772S (zh) 2021-07-21
USD962184S1 (en) 2022-08-30

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