JP1651623S - - Google Patents
Info
- Publication number
- JP1651623S JP1651623S JPD2019-16134F JP2019016134F JP1651623S JP 1651623 S JP1651623 S JP 1651623S JP 2019016134 F JP2019016134 F JP 2019016134F JP 1651623 S JP1651623 S JP 1651623S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-16134F JP1651623S (enExample) | 2019-07-18 | 2019-07-18 | |
| TW108307122F TWD206653S (zh) | 2019-07-18 | 2019-11-21 | 基板處理裝置用吸頂式加熱器的保持板 |
| US29/718,687 USD918848S1 (en) | 2019-07-18 | 2019-12-27 | Retainer of ceiling heater for semiconductor fabrication apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-16134F JP1651623S (enExample) | 2019-07-18 | 2019-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1651623S true JP1651623S (enExample) | 2020-01-27 |
Family
ID=69183226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-16134F Active JP1651623S (enExample) | 2019-07-18 | 2019-07-18 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD918848S1 (enExample) |
| JP (1) | JP1651623S (enExample) |
| TW (1) | TWD206653S (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD954567S1 (en) | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
| JP1651618S (enExample) * | 2019-07-11 | 2020-01-27 | ||
| JP1651619S (enExample) * | 2019-07-11 | 2020-01-27 | ||
| USD940131S1 (en) * | 2019-07-29 | 2022-01-04 | Samsung Display Co., Ltd. | Display panel |
| USD966276S1 (en) | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
| USD958094S1 (en) | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
| USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
| JP1684468S (ja) * | 2020-09-24 | 2021-05-10 | 基板処理装置用天井ヒータ | |
| JP1684469S (ja) * | 2020-09-24 | 2021-05-10 | 基板処理装置用天井ヒータ | |
| USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
| TWD223375S (zh) | 2021-03-29 | 2023-02-01 | 大陸商北京北方華創微電子裝備有限公司 | 靜電卡盤 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5533924A (en) * | 1994-09-01 | 1996-07-09 | Micron Technology, Inc. | Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers |
| USD405427S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| US6030487A (en) * | 1997-06-19 | 2000-02-29 | International Business Machines Corporation | Wafer carrier assembly |
| US6116992A (en) * | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
| US6531397B1 (en) * | 1998-01-09 | 2003-03-11 | Lsi Logic Corporation | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
| US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
| US6390904B1 (en) * | 1998-05-21 | 2002-05-21 | Applied Materials, Inc. | Retainers and non-abrasive liners used in chemical mechanical polishing |
| US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
| US6719874B1 (en) * | 2001-03-30 | 2004-04-13 | Lam Research Corporation | Active retaining ring support |
| TW504460B (en) * | 2001-05-25 | 2002-10-01 | Benq Corp | Chip protection device |
| DE10247179A1 (de) * | 2002-10-02 | 2004-04-15 | Ensinger Kunststofftechnologie Gbr | Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung |
| US7344434B2 (en) * | 2003-11-13 | 2008-03-18 | Applied Materials, Inc. | Retaining ring with shaped surface |
| US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
| TWD125599S1 (zh) * | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | 半導體製造用加熱器 |
| TWD125598S1 (zh) * | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | 半導體製造用加熱器 |
| JP2008229790A (ja) * | 2007-03-22 | 2008-10-02 | Nec Electronics Corp | リテーナリングおよび研磨装置 |
| USD600220S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| TWD130834S1 (zh) * | 2008-03-28 | 2009-09-11 | 東京威力科創股份有限公司 | 半導體製造用保溫筒之散熱翼片 |
| USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
| USD615937S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| US8517803B2 (en) * | 2009-09-16 | 2013-08-27 | SPM Technology, Inc. | Retaining ring for chemical mechanical polishing |
| US8298046B2 (en) * | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
| USD732094S1 (en) * | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
| CN109243976B (zh) * | 2013-01-11 | 2023-05-23 | 应用材料公司 | 化学机械抛光设备及方法 |
| USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
| USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| WO2015141792A1 (ja) * | 2014-03-20 | 2015-09-24 | 株式会社日立国際電気 | 基板処理装置、天井部及び半導体装置の製造方法 |
| JP1541874S (enExample) * | 2015-03-16 | 2016-01-18 | ||
| US10174437B2 (en) * | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
| JP1556433S (enExample) * | 2015-10-06 | 2016-08-15 | ||
| JP1560719S (enExample) * | 2015-12-01 | 2016-10-11 | ||
| USD814432S1 (en) * | 2016-02-09 | 2018-04-03 | Witricity Corporation | Resonator coil |
| JP1581406S (enExample) | 2016-10-14 | 2017-07-18 | ||
| JP6912497B2 (ja) * | 2016-12-01 | 2021-08-04 | 株式会社Kokusai Electric | 基板処理装置、天井ヒータおよび半導体装置の製造方法 |
| USD825503S1 (en) * | 2017-06-07 | 2018-08-14 | Witricity Corporation | Resonator coil |
| USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
| KR20190008101A (ko) * | 2017-07-14 | 2019-01-23 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법 |
| TWD191614S (zh) * | 2017-08-04 | 2018-07-11 | 合利億股份有限公司 | 無線充電線圈 |
-
2019
- 2019-07-18 JP JPD2019-16134F patent/JP1651623S/ja active Active
- 2019-11-21 TW TW108307122F patent/TWD206653S/zh unknown
- 2019-12-27 US US29/718,687 patent/USD918848S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD918848S1 (en) | 2021-05-11 |
| TWD206653S (zh) | 2020-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BR112019017762A2 (enExample) | ||
| BR112021008711A2 (enExample) | ||
| BR112019016141A2 (enExample) | ||
| JP1651619S (enExample) | ||
| AU2020104490A5 (enExample) | ||
| BR112021013944A2 (enExample) | ||
| JP1651618S (enExample) | ||
| BR112019016138A2 (enExample) | ||
| BR112019016142A2 (enExample) | ||
| BR112021012348A2 (enExample) | ||
| AT524962A5 (enExample) | ||
| BR112021013128A2 (enExample) | ||
| BR112019016136A2 (enExample) | ||
| BR102020020816B1 (pt) | Veículo, e, método para controlar o movimento de ar através de um veículo com uma ventoinha do veículo | |
| BR102020020846B1 (pt) | Niveladora, e, método para serviço em uma niveladora | |
| BR102020018650B1 (pt) | Método para preparar óxido de cálcio usando um forno pré- aquecedor de suspensão de múltiplos estágios | |
| BR102020017390B1 (pt) | Bomba multifásica | |
| BR102020016297B1 (pt) | Bolsa de forro para um contentor e método para criar e prender uma bolsa de forro a um contentor | |
| BR102020011722B1 (pt) | Porta de tela para um pacote de radiadores | |
| BR102020005984B1 (pt) | Dispositivo de arranque-gerador combinado, e, conjunto de trem de acionamento | |
| BR112021012379B1 (pt) | Material de aço adequado para uso em ambiente ácido | |
| BR112021012064B1 (pt) | Sistema e método de previsão de risco de ataque de insetos | |
| BR112021010564B1 (pt) | Sistema de armadilha para animais e método de monitoramento do mesmo | |
| BR112021014592B1 (pt) | Compostos fotosensibilizadores, métodos de fabricação e aplicação em plantas | |
| BR112021013470B1 (pt) | Conector de acesso sem agulha para facilitar a entrega de instrumento a um conjunto de cateter |