KR20010043642A - 기판 리테이너 - Google Patents

기판 리테이너 Download PDF

Info

Publication number
KR20010043642A
KR20010043642A KR1020007012822A KR20007012822A KR20010043642A KR 20010043642 A KR20010043642 A KR 20010043642A KR 1020007012822 A KR1020007012822 A KR 1020007012822A KR 20007012822 A KR20007012822 A KR 20007012822A KR 20010043642 A KR20010043642 A KR 20010043642A
Authority
KR
South Korea
Prior art keywords
substrate
retainer
circumference
annular
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020007012822A
Other languages
English (en)
Korean (ko)
Inventor
스티븐 엠. 주니가
흉 시 첸
Original Assignee
조셉 제이. 스위니
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조셉 제이. 스위니, 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 조셉 제이. 스위니
Publication of KR20010043642A publication Critical patent/KR20010043642A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020007012822A 1998-05-15 1999-04-30 기판 리테이너 Withdrawn KR20010043642A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/080,094 US6436228B1 (en) 1998-05-15 1998-05-15 Substrate retainer
US09/080,094 1998-05-15
PCT/US1999/009569 WO1999059776A1 (en) 1998-05-15 1999-04-30 Substrate retainer

Publications (1)

Publication Number Publication Date
KR20010043642A true KR20010043642A (ko) 2001-05-25

Family

ID=22155219

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007012822A Withdrawn KR20010043642A (ko) 1998-05-15 1999-04-30 기판 리테이너

Country Status (6)

Country Link
US (5) US6436228B1 (enExample)
EP (1) EP1077789A1 (enExample)
JP (1) JP4408566B2 (enExample)
KR (1) KR20010043642A (enExample)
TW (1) TW541229B (enExample)
WO (1) WO1999059776A1 (enExample)

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US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
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US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
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CN107088829B (zh) * 2017-05-16 2023-08-08 张家港市宇安精密机械有限公司 套筒研磨夹具
CN107030592A (zh) * 2017-05-16 2017-08-11 遵义顺峰汽车零部件制造有限公司 一种汽车套筒加工用工装
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US20230063687A1 (en) * 2021-08-27 2023-03-02 Taiwan Semiconductor Manufacturing Company Limited Apparatus for polishing a wafer
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
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USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
CN115008342B (zh) * 2022-06-15 2023-08-25 安徽禾臣新材料有限公司 一种晶片抛光用防崩角的无蜡垫及其生产工艺
WO2024049890A1 (en) * 2022-09-01 2024-03-07 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head
JP1745925S (ja) * 2022-10-20 2023-06-08 サセプタカバー
JP1741174S (ja) * 2022-10-20 2023-04-06 サセプタ
JP1741172S (ja) * 2022-10-20 2023-04-06 サセプタカバー
JP1741176S (ja) * 2022-10-20 2023-04-06 サセプタ用カバーベース
JP1745873S (ja) * 2022-10-20 2023-06-08 サセプタ
JP1746406S (ja) * 2023-01-11 2023-06-15 サセプタユニット
JP1746405S (ja) * 2023-01-11 2023-06-15 サセプタカバー
JP1746403S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746407S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746408S (ja) * 2023-01-11 2023-06-15 サセプタ

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Also Published As

Publication number Publication date
EP1077789A1 (en) 2001-02-28
JP4408566B2 (ja) 2010-02-03
US20110104990A1 (en) 2011-05-05
TW541229B (en) 2003-07-11
JP2002515349A (ja) 2002-05-28
US7459057B2 (en) 2008-12-02
US20020179251A1 (en) 2002-12-05
US20130115858A1 (en) 2013-05-09
US6436228B1 (en) 2002-08-20
US20090047873A1 (en) 2009-02-19
US7883397B2 (en) 2011-02-08
WO1999059776A1 (en) 1999-11-25
US8628378B2 (en) 2014-01-14
US8298047B2 (en) 2012-10-30

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20001115

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid