DE69316849T2 - Verfahren und Gerät zum Polieren eines Werkstückes - Google Patents

Verfahren und Gerät zum Polieren eines Werkstückes

Info

Publication number
DE69316849T2
DE69316849T2 DE69316849T DE69316849T DE69316849T2 DE 69316849 T2 DE69316849 T2 DE 69316849T2 DE 69316849 T DE69316849 T DE 69316849T DE 69316849 T DE69316849 T DE 69316849T DE 69316849 T2 DE69316849 T2 DE 69316849T2
Authority
DE
Germany
Prior art keywords
polishing
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69316849T
Other languages
English (en)
Other versions
DE69316849D1 (de
Inventor
Katsuya Okumura
Tohru Watanabe
Riichirou Aoki
Hiroyuki Yano
Masako Kodera
Atsushi Shigeta
You Ishii
Norio Kimura
Masayoshi Hirose
Yukio Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69316849D1 publication Critical patent/DE69316849D1/de
Publication of DE69316849T2 publication Critical patent/DE69316849T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B39/00—Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69316849T 1992-11-27 1993-11-24 Verfahren und Gerät zum Polieren eines Werkstückes Expired - Fee Related DE69316849T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34116292 1992-11-27

Publications (2)

Publication Number Publication Date
DE69316849D1 DE69316849D1 (de) 1998-03-12
DE69316849T2 true DE69316849T2 (de) 1998-09-10

Family

ID=18343822

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69316849T Expired - Fee Related DE69316849T2 (de) 1992-11-27 1993-11-24 Verfahren und Gerät zum Polieren eines Werkstückes

Country Status (4)

Country Link
US (1) US5398459A (de)
EP (1) EP0599299B1 (de)
KR (1) KR100314936B1 (de)
DE (1) DE69316849T2 (de)

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US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
EP0808231B1 (de) * 1995-02-10 2000-11-02 Advanced Micro Devices, Inc. Chemisch-mechanisch polieren mit gebogenen traegern
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
JP3072962B2 (ja) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 研磨のための被加工物の保持具及びその製法
US5658190A (en) * 1995-12-15 1997-08-19 Micron Technology, Inc. Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
ATE228915T1 (de) * 1996-01-24 2002-12-15 Lam Res Corp Halbleiterscheiben-polierkopf
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
JPH09314457A (ja) * 1996-05-29 1997-12-09 Speedfam Co Ltd ドレッサ付き片面研磨装置
JPH09321002A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨方法およびその研磨用テンプレー ト
US5830806A (en) * 1996-10-18 1998-11-03 Micron Technology, Inc. Wafer backing member for mechanical and chemical-mechanical planarization of substrates
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5857899A (en) * 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US5885135A (en) * 1997-04-23 1999-03-23 International Business Machines Corporation CMP wafer carrier for preferential polishing of a wafer
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6116990A (en) * 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
US6113479A (en) 1997-07-25 2000-09-05 Obsidian, Inc. Wafer carrier for chemical mechanical planarization polishing
US5989103A (en) * 1997-09-19 1999-11-23 Applied Materials, Inc. Magnetic carrier head for chemical mechanical polishing
US5989104A (en) * 1998-01-12 1999-11-23 Speedfam-Ipec Corporation Workpiece carrier with monopiece pressure plate and low gimbal point
JP2917992B1 (ja) * 1998-04-10 1999-07-12 日本電気株式会社 研磨装置
JP2000015572A (ja) * 1998-04-29 2000-01-18 Speedfam Co Ltd キャリア及び研磨装置
US6572462B1 (en) * 1998-05-04 2003-06-03 Motorola, Inc. Carrier assembly for chemical mechanical planarization systems and method
US6143127A (en) * 1998-05-14 2000-11-07 Applied Materials, Inc. Carrier head with a retaining ring for a chemical mechanical polishing system
US6436228B1 (en) 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
JP2907209B1 (ja) * 1998-05-29 1999-06-21 日本電気株式会社 ウェハ研磨装置用裏面パッド
US6267655B1 (en) * 1998-07-15 2001-07-31 Mosel Vitelic, Inc. Retaining ring for wafer polishing
JP3920465B2 (ja) * 1998-08-04 2007-05-30 信越半導体株式会社 研磨方法および研磨装置
US6386957B1 (en) * 1998-10-30 2002-05-14 Shin-Etsu Handotai Co., Ltd. Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6383056B1 (en) 1999-12-02 2002-05-07 Yin Ming Wang Plane constructed shaft system used in precision polishing and polishing apparatuses
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6436828B1 (en) 2000-05-04 2002-08-20 Applied Materials, Inc. Chemical mechanical polishing using magnetic force
US6419567B1 (en) 2000-08-14 2002-07-16 Semiconductor 300 Gmbh & Co. Kg Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
US6592439B1 (en) 2000-11-10 2003-07-15 Applied Materials, Inc. Platen for retaining polishing material
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US6890249B1 (en) 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
JP3978780B2 (ja) * 2002-08-09 2007-09-19 信越半導体株式会社 ウエーハの研磨方法及び装置
US20130052919A1 (en) * 2011-08-25 2013-02-28 Space Administrationo Graphite composite panel polishing fixture and assembly
TWI639485B (zh) * 2012-01-31 2018-11-01 日商荏原製作所股份有限公司 Substrate holding device, polishing device, and polishing method
US9597771B2 (en) * 2013-12-19 2017-03-21 Taiwan Semiconductor Manufacturing Co., Ltd. Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system
KR20210061273A (ko) * 2019-11-19 2021-05-27 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치
CN112497043B (zh) * 2020-10-14 2022-09-23 大连理工大学 一种多工位立式旋转磨粒流抛光装置及其工作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1491103A (en) * 1919-07-08 1924-04-22 Pratt & Whitney Co Method of and machine for making gauges and other articles
US3304662A (en) * 1964-04-28 1967-02-21 Speedlap Corp Apparatus for lapping
US3374582A (en) * 1964-12-08 1968-03-26 Speedfam Corp Lapping machine
US3453783A (en) * 1966-06-30 1969-07-08 Texas Instruments Inc Apparatus for holding silicon slices
DE1300836B (de) * 1967-04-15 1969-08-07 Peter Wolters Kratzenfabrik Un Abrichtvorrichtung an einer Einscheiben-Laeppmaschine
US3841028A (en) * 1972-08-24 1974-10-15 Crane Packing Co Apparatus for handling workpieces to be polished
NL7404364A (nl) * 1974-04-01 1975-10-03 Philips Nv Werkwijze en inrichting voor het bewerken van vlakke voorwerpen.
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
US4256535A (en) * 1979-12-05 1981-03-17 Western Electric Company, Inc. Method of polishing a semiconductor wafer
US4373991A (en) * 1982-01-28 1983-02-15 Western Electric Company, Inc. Methods and apparatus for polishing a semiconductor wafer
JPS58171255A (ja) * 1982-03-29 1983-10-07 Toshiba Corp 両面鏡面研摩装置
US4671145A (en) * 1983-12-23 1987-06-09 Basf Aktiengesellschaft Method and apparatus for the surface machining of substrate plates for magnetic memory plates
US4567938A (en) * 1984-05-02 1986-02-04 Varian Associates, Inc. Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system
JPS60249568A (ja) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd 半導体ウエハの研磨方法
US5232875A (en) * 1992-10-15 1993-08-03 Micron Technology, Inc. Method and apparatus for improving planarity of chemical-mechanical planarization operations

Also Published As

Publication number Publication date
KR940011128A (ko) 1994-06-20
EP0599299A1 (de) 1994-06-01
US5398459A (en) 1995-03-21
EP0599299B1 (de) 1998-02-04
KR100314936B1 (ko) 2002-02-19
DE69316849D1 (de) 1998-03-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee