JP4361516B2 - ウェーハ分割方法 - Google Patents

ウェーハ分割方法 Download PDF

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Publication number
JP4361516B2
JP4361516B2 JP2005171440A JP2005171440A JP4361516B2 JP 4361516 B2 JP4361516 B2 JP 4361516B2 JP 2005171440 A JP2005171440 A JP 2005171440A JP 2005171440 A JP2005171440 A JP 2005171440A JP 4361516 B2 JP4361516 B2 JP 4361516B2
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JP
Japan
Prior art keywords
wafer
sheet
vacuum suction
holding surface
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005171440A
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English (en)
Japanese (ja)
Other versions
JP2006344910A (ja
Inventor
顕 中津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Canon Machinery Inc
Original Assignee
Hamamatsu Photonics KK
Canon Machinery Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK, Canon Machinery Inc filed Critical Hamamatsu Photonics KK
Priority to JP2005171440A priority Critical patent/JP4361516B2/ja
Priority to TW095114859A priority patent/TWI393180B/zh
Priority to DE102006019709A priority patent/DE102006019709A1/de
Priority to MYPI20062156A priority patent/MY147978A/en
Priority to KR1020060045719A priority patent/KR101226578B1/ko
Publication of JP2006344910A publication Critical patent/JP2006344910A/ja
Application granted granted Critical
Publication of JP4361516B2 publication Critical patent/JP4361516B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005171440A 2005-06-10 2005-06-10 ウェーハ分割方法 Active JP4361516B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005171440A JP4361516B2 (ja) 2005-06-10 2005-06-10 ウェーハ分割方法
TW095114859A TWI393180B (zh) 2005-06-10 2006-04-26 晶圓切割方法以及晶圓切割裝置
DE102006019709A DE102006019709A1 (de) 2005-06-10 2006-04-27 Verfahren und Vorrichtung zum Zerschneiden von Wafern
MYPI20062156A MY147978A (en) 2005-06-10 2006-05-10 Wafer cutting method
KR1020060045719A KR101226578B1 (ko) 2005-06-10 2006-05-22 웨이퍼 절단 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005171440A JP4361516B2 (ja) 2005-06-10 2005-06-10 ウェーハ分割方法

Publications (2)

Publication Number Publication Date
JP2006344910A JP2006344910A (ja) 2006-12-21
JP4361516B2 true JP4361516B2 (ja) 2009-11-11

Family

ID=37440160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005171440A Active JP4361516B2 (ja) 2005-06-10 2005-06-10 ウェーハ分割方法

Country Status (5)

Country Link
JP (1) JP4361516B2 (ko)
KR (1) KR101226578B1 (ko)
DE (1) DE102006019709A1 (ko)
MY (1) MY147978A (ko)
TW (1) TWI393180B (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101335051B1 (ko) * 2009-11-20 2013-11-29 도꾸리쯔교세이호진상교기쥬쯔소고겡뀨죠 결함을 검사하는 방법, 결함의 검사를 행한 웨이퍼 또는 그 웨이퍼를 이용하여 제조된 반도체 소자, 웨이퍼 또는 반도체 소자의 품질관리 방법 및 결함검사 장치
JP5414486B2 (ja) * 2009-12-01 2014-02-12 シチズン電子株式会社 半導体製造装置
JP5546873B2 (ja) * 2010-01-12 2014-07-09 キヤノンマシナリー株式会社 半導体ウェハの分割方法及び装置
CN102194652B (zh) * 2010-03-11 2013-04-10 中芯国际集成电路制造(上海)有限公司 防止晶圆翘曲的方法以及由该方法得到的晶圆
US8658436B2 (en) * 2010-04-19 2014-02-25 Tokyo Electron Limited Method for separating and transferring IC chips
JP6029334B2 (ja) * 2012-06-07 2016-11-24 株式会社ディスコ 分割装置
US10090430B2 (en) 2014-05-27 2018-10-02 Sunpower Corporation System for manufacturing a shingled solar cell module
WO2015183827A2 (en) * 2014-05-27 2015-12-03 Cogenra Solar, Inc. Shingled solar cell module
WO2014098771A1 (en) * 2012-12-17 2014-06-26 Agency For Science, Technology And Research Wafer dicing apparatus and wafer dicing method
JP6091335B2 (ja) * 2013-05-28 2017-03-08 株式会社ディスコ 分割方法及び分割装置
JP6301658B2 (ja) * 2014-01-15 2018-03-28 株式会社ディスコ ウェーハの加工方法
US11949026B2 (en) 2014-05-27 2024-04-02 Maxeon Solar Pte. Ltd. Shingled solar cell module
CN114582986A (zh) * 2014-05-27 2022-06-03 迈可晟太阳能有限公司 叠盖式太阳能电池模块
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
CL2016003045A1 (es) * 2014-05-27 2017-06-09 Sunpower Corp Modulo escalonado de celda solar
CN104409386B (zh) * 2014-10-20 2018-05-15 上海技美电子科技有限公司 晶圆裂片装置
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects
CN110828591B (zh) 2015-08-18 2023-05-02 迈可晟太阳能有限公司 太阳能面板
JP6576735B2 (ja) * 2015-08-19 2019-09-18 株式会社ディスコ ウエーハの分割方法
JP7125650B2 (ja) * 2018-03-27 2022-08-25 株式会社東京精密 ウェーハ分割装置及び方法
CN112701066B (zh) * 2021-01-07 2021-07-20 深圳市粤海翔精密科技有限公司 一种晶圆裂片用劈裂刀设备及其使用方法
CN112847853B (zh) * 2021-01-20 2022-12-27 中国科学院微电子研究所 一种裂片装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE759715A (nl) * 1969-12-12 1971-06-02 Shell Int Research Blokcopolymeren als viscositeitsindexverbeterende middelen
JPH0574933A (ja) * 1991-09-17 1993-03-26 Seiko Epson Corp ダイシング装置
JP3276506B2 (ja) * 1994-03-16 2002-04-22 株式会社日立製作所 半導体装置の製造方法
JPH0817767A (ja) * 1994-06-29 1996-01-19 Hitachi Ltd 半導体ウエハのブレーキング方法および装置
JP3408805B2 (ja) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
KR20040009802A (ko) * 2002-07-25 2004-01-31 삼성전자주식회사 굴곡형 장착 면을 갖는 프레임 고정 고무판을 구비하는패키지 절단 장치
TWI274406B (en) * 2003-07-16 2007-02-21 Freescale Semiconductor Inc Dual gauge leadframe
JP7254577B2 (ja) * 2019-03-27 2023-04-10 積水化学工業株式会社 配管材

Also Published As

Publication number Publication date
TW200701355A (en) 2007-01-01
KR20060128641A (ko) 2006-12-14
DE102006019709A1 (de) 2006-12-14
MY147978A (en) 2013-02-28
TWI393180B (zh) 2013-04-11
JP2006344910A (ja) 2006-12-21
KR101226578B1 (ko) 2013-01-28

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