JP4358568B2 - 電子部品の電気めっき装置及び電気めっき方法 - Google Patents

電子部品の電気めっき装置及び電気めっき方法 Download PDF

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Publication number
JP4358568B2
JP4358568B2 JP2003276539A JP2003276539A JP4358568B2 JP 4358568 B2 JP4358568 B2 JP 4358568B2 JP 2003276539 A JP2003276539 A JP 2003276539A JP 2003276539 A JP2003276539 A JP 2003276539A JP 4358568 B2 JP4358568 B2 JP 4358568B2
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Japan
Prior art keywords
plating
drum
hole
insulating plate
plating drum
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Expired - Lifetime
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JP2003276539A
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Japanese (ja)
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JP2005036298A (ja
Inventor
俊秀 吉田
英二 神谷
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Kamaya Electric Co Ltd
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Kamaya Electric Co Ltd
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Application filed by Kamaya Electric Co Ltd filed Critical Kamaya Electric Co Ltd
Priority to JP2003276539A priority Critical patent/JP4358568B2/ja
Priority to TW093120477A priority patent/TW200510573A/zh
Priority to CN 200410071305 priority patent/CN1576400B/zh
Publication of JP2005036298A publication Critical patent/JP2005036298A/ja
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Publication of JP4358568B2 publication Critical patent/JP4358568B2/ja
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  • Electroplating Methods And Accessories (AREA)
JP2003276539A 2003-07-18 2003-07-18 電子部品の電気めっき装置及び電気めっき方法 Expired - Lifetime JP4358568B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003276539A JP4358568B2 (ja) 2003-07-18 2003-07-18 電子部品の電気めっき装置及び電気めっき方法
TW093120477A TW200510573A (en) 2003-07-18 2004-07-08 Electroplating apparatus and electroplating method for electronic component, and the electronic component
CN 200410071305 CN1576400B (zh) 2003-07-18 2004-07-19 电子部件的电镀装置和电镀方法、以及该电子部件

Applications Claiming Priority (1)

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JP2003276539A JP4358568B2 (ja) 2003-07-18 2003-07-18 電子部品の電気めっき装置及び電気めっき方法

Publications (2)

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JP2005036298A JP2005036298A (ja) 2005-02-10
JP4358568B2 true JP4358568B2 (ja) 2009-11-04

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JP2003276539A Expired - Lifetime JP4358568B2 (ja) 2003-07-18 2003-07-18 電子部品の電気めっき装置及び電気めっき方法

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JP (1) JP4358568B2 (zh)
CN (1) CN1576400B (zh)
TW (1) TW200510573A (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101141479B1 (ko) 2010-07-13 2012-05-04 삼성전기주식회사 셀 도금장치
CN102851725A (zh) * 2011-06-30 2013-01-02 扬州市金杨电镀设备有限公司 电镀装置绝缘板
CN103668373B (zh) * 2014-01-03 2016-06-08 深圳顺络电子股份有限公司 旋转电镀机及其自动卸料装置
CN104988572B (zh) * 2015-07-29 2017-09-29 俞雄飞 电镀线钢珠回收系统
CN105154948A (zh) * 2015-10-20 2015-12-16 江苏华久辐条制造有限公司 一种斜式辐条用电镀装置
TWI648434B (zh) * 2016-12-28 2019-01-21 黃愽道 小型零件的電鍍裝置
JP6593365B2 (ja) * 2017-02-03 2019-10-23 株式会社村田製作所 めっき用セル及びそのセルを備えるめっき装置
JP6878345B2 (ja) * 2018-03-29 2021-05-26 上村工業株式会社 回転式表面処理装置
CN108425142A (zh) * 2018-05-02 2018-08-21 高峰 一种便于取件的小五金件电镀设备
TWI690620B (zh) * 2018-08-22 2020-04-11 華紹國際有限公司 化學鍍裝置及金屬化基板的製造方法
JP2021165423A (ja) * 2020-04-08 2021-10-14 オムロン株式会社 部分めっき装置
CN112575354A (zh) * 2020-11-10 2021-03-30 宁波革创新材料科技有限公司 一种内管电镀致密层的方法和装置
CN114981488B (zh) * 2020-12-25 2023-05-26 株式会社荏原制作所 镀敷装置、镀敷装置的控制方法
CN114592229B (zh) * 2022-03-14 2023-03-24 淮安市泽邦电子有限公司 一种电阻用加工装置及其加工方法
KR102430630B1 (ko) * 2022-06-29 2022-08-16 오알오 주식회사 금속파우더 전해도금장치
CN116288628B (zh) * 2023-03-15 2023-12-19 肇庆顺创精密机械有限公司 一种吊桶式离心电镀篮
CN116847566A (zh) * 2023-07-07 2023-10-03 武汉新辉天科技有限公司 一种高集成化的电路板加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4820970B1 (zh) * 1968-05-11 1973-06-25
JP3126867B2 (ja) * 1993-08-31 2001-01-22 上村工業株式会社 小物のめっき装置及びめっき方法

Also Published As

Publication number Publication date
TW200510573A (en) 2005-03-16
CN1576400A (zh) 2005-02-09
JP2005036298A (ja) 2005-02-10
TWI351449B (zh) 2011-11-01
CN1576400B (zh) 2011-09-07

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