TW200510573A - Electroplating apparatus and electroplating method for electronic component, and the electronic component - Google Patents
Electroplating apparatus and electroplating method for electronic component, and the electronic componentInfo
- Publication number
- TW200510573A TW200510573A TW093120477A TW93120477A TW200510573A TW 200510573 A TW200510573 A TW 200510573A TW 093120477 A TW093120477 A TW 093120477A TW 93120477 A TW93120477 A TW 93120477A TW 200510573 A TW200510573 A TW 200510573A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- plating
- insulating plate
- drum
- outside
- Prior art date
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003276539A JP4358568B2 (ja) | 2003-07-18 | 2003-07-18 | 電子部品の電気めっき装置及び電気めっき方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200510573A true TW200510573A (en) | 2005-03-16 |
TWI351449B TWI351449B (zh) | 2011-11-01 |
Family
ID=34212835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093120477A TW200510573A (en) | 2003-07-18 | 2004-07-08 | Electroplating apparatus and electroplating method for electronic component, and the electronic component |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4358568B2 (zh) |
CN (1) | CN1576400B (zh) |
TW (1) | TW200510573A (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101141479B1 (ko) | 2010-07-13 | 2012-05-04 | 삼성전기주식회사 | 셀 도금장치 |
CN102851725A (zh) * | 2011-06-30 | 2013-01-02 | 扬州市金杨电镀设备有限公司 | 电镀装置绝缘板 |
CN103668373B (zh) * | 2014-01-03 | 2016-06-08 | 深圳顺络电子股份有限公司 | 旋转电镀机及其自动卸料装置 |
CN104988572B (zh) * | 2015-07-29 | 2017-09-29 | 俞雄飞 | 电镀线钢珠回收系统 |
CN105154948A (zh) * | 2015-10-20 | 2015-12-16 | 江苏华久辐条制造有限公司 | 一种斜式辐条用电镀装置 |
TWI648434B (zh) * | 2016-12-28 | 2019-01-21 | 黃愽道 | 小型零件的電鍍裝置 |
JP6593365B2 (ja) * | 2017-02-03 | 2019-10-23 | 株式会社村田製作所 | めっき用セル及びそのセルを備えるめっき装置 |
JP6878345B2 (ja) * | 2018-03-29 | 2021-05-26 | 上村工業株式会社 | 回転式表面処理装置 |
CN108425142A (zh) * | 2018-05-02 | 2018-08-21 | 高峰 | 一种便于取件的小五金件电镀设备 |
TWI690620B (zh) * | 2018-08-22 | 2020-04-11 | 華紹國際有限公司 | 化學鍍裝置及金屬化基板的製造方法 |
JP2021165423A (ja) * | 2020-04-08 | 2021-10-14 | オムロン株式会社 | 部分めっき装置 |
CN112575354A (zh) * | 2020-11-10 | 2021-03-30 | 宁波革创新材料科技有限公司 | 一种内管电镀致密层的方法和装置 |
JP6993537B1 (ja) * | 2020-12-25 | 2022-01-13 | 株式会社荏原製作所 | めっき装置、めっき装置の制御方法 |
CN114592229B (zh) * | 2022-03-14 | 2023-03-24 | 淮安市泽邦电子有限公司 | 一种电阻用加工装置及其加工方法 |
KR102430630B1 (ko) * | 2022-06-29 | 2022-08-16 | 오알오 주식회사 | 금속파우더 전해도금장치 |
CN116288628B (zh) * | 2023-03-15 | 2023-12-19 | 肇庆顺创精密机械有限公司 | 一种吊桶式离心电镀篮 |
CN116847566A (zh) * | 2023-07-07 | 2023-10-03 | 武汉新辉天科技有限公司 | 一种高集成化的电路板加工方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4820970B1 (zh) * | 1968-05-11 | 1973-06-25 | ||
JP3126867B2 (ja) * | 1993-08-31 | 2001-01-22 | 上村工業株式会社 | 小物のめっき装置及びめっき方法 |
-
2003
- 2003-07-18 JP JP2003276539A patent/JP4358568B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-08 TW TW093120477A patent/TW200510573A/zh unknown
- 2004-07-19 CN CN 200410071305 patent/CN1576400B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN1576400B (zh) | 2011-09-07 |
TWI351449B (zh) | 2011-11-01 |
JP4358568B2 (ja) | 2009-11-04 |
JP2005036298A (ja) | 2005-02-10 |
CN1576400A (zh) | 2005-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200510573A (en) | Electroplating apparatus and electroplating method for electronic component, and the electronic component | |
EP1070772A3 (en) | Electroplating device, and process for electroplating work using the device | |
WO2002004711A3 (en) | Method and associated apparatus for tilting a substrate upon entry for metal deposition | |
WO2006096418A3 (en) | Plating of a thin metal seed layer | |
WO2002029137A3 (en) | Method and associated apparatus for tilting a substrate upon entry for metal deposition | |
WO2006135211A1 (en) | Electrode plate vibration structure of oxygen/hydrogen mixture gas generator | |
TW200513548A (en) | Insoluble anode with an auxiliary electrode | |
MX2019011879A (es) | Metodo y dispositivo de electroenchapado. | |
CN214193501U (zh) | 用于离心电镀机的电镀缸 | |
WO2006012112A3 (en) | Electrochemical plating cell with an auxiliary electrode in an isolated anolyte compartment | |
WO2006055145A3 (en) | Current collimation for thin seed and direct plating | |
CN205046213U (zh) | 一种高效电镀缸 | |
KR20060131696A (ko) | 산소/수소 혼합가스 발생장치의 전극판 진동구조 | |
US6017427A (en) | Apparatus for testing high speed electroplating | |
Wadhawan et al. | Sono-emulsion electrosynthesis: electrode-insensitive Kolbe reactions | |
CN109687043A (zh) | 一种电极旋转的防枝晶电池装置 | |
CN108580199A (zh) | 一种带有三辊轮的涂抹装置 | |
CN201080506Y (zh) | 管件内表面镀镉定位装置 | |
TW200638479A (en) | Uniform current distribution for ECP loading of wafers | |
CN106411181B (zh) | 一种超大功率滑差调节器绝缘电解液箱 | |
CN216891272U (zh) | 一种针对腔体工件的专用辅助阴极 | |
CN206580911U (zh) | 一种电解池 | |
US20030049526A1 (en) | Power generating device for an electrical appliance that consumes little electricity | |
JP2011084797A (ja) | バレルめっき装置 | |
CN218857335U (zh) | 一种水泥加工配料设备 |