TW200510573A - Electroplating apparatus and electroplating method for electronic component, and the electronic component - Google Patents

Electroplating apparatus and electroplating method for electronic component, and the electronic component

Info

Publication number
TW200510573A
TW200510573A TW093120477A TW93120477A TW200510573A TW 200510573 A TW200510573 A TW 200510573A TW 093120477 A TW093120477 A TW 093120477A TW 93120477 A TW93120477 A TW 93120477A TW 200510573 A TW200510573 A TW 200510573A
Authority
TW
Taiwan
Prior art keywords
electronic component
plating
insulating plate
drum
outside
Prior art date
Application number
TW093120477A
Other languages
English (en)
Other versions
TWI351449B (zh
Inventor
Toshihide Yoshida
Eiji Kamiya
Original Assignee
Kamaya Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kamaya Electric Co Ltd filed Critical Kamaya Electric Co Ltd
Publication of TW200510573A publication Critical patent/TW200510573A/zh
Application granted granted Critical
Publication of TWI351449B publication Critical patent/TWI351449B/zh

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  • Electroplating Methods And Accessories (AREA)
TW093120477A 2003-07-18 2004-07-08 Electroplating apparatus and electroplating method for electronic component, and the electronic component TW200510573A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003276539A JP4358568B2 (ja) 2003-07-18 2003-07-18 電子部品の電気めっき装置及び電気めっき方法

Publications (2)

Publication Number Publication Date
TW200510573A true TW200510573A (en) 2005-03-16
TWI351449B TWI351449B (zh) 2011-11-01

Family

ID=34212835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120477A TW200510573A (en) 2003-07-18 2004-07-08 Electroplating apparatus and electroplating method for electronic component, and the electronic component

Country Status (3)

Country Link
JP (1) JP4358568B2 (zh)
CN (1) CN1576400B (zh)
TW (1) TW200510573A (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101141479B1 (ko) 2010-07-13 2012-05-04 삼성전기주식회사 셀 도금장치
CN102851725A (zh) * 2011-06-30 2013-01-02 扬州市金杨电镀设备有限公司 电镀装置绝缘板
CN103668373B (zh) * 2014-01-03 2016-06-08 深圳顺络电子股份有限公司 旋转电镀机及其自动卸料装置
CN104988572B (zh) * 2015-07-29 2017-09-29 俞雄飞 电镀线钢珠回收系统
CN105154948A (zh) * 2015-10-20 2015-12-16 江苏华久辐条制造有限公司 一种斜式辐条用电镀装置
TWI648434B (zh) * 2016-12-28 2019-01-21 黃愽道 小型零件的電鍍裝置
JP6593365B2 (ja) * 2017-02-03 2019-10-23 株式会社村田製作所 めっき用セル及びそのセルを備えるめっき装置
JP6878345B2 (ja) * 2018-03-29 2021-05-26 上村工業株式会社 回転式表面処理装置
CN108425142A (zh) * 2018-05-02 2018-08-21 高峰 一种便于取件的小五金件电镀设备
TWI690620B (zh) * 2018-08-22 2020-04-11 華紹國際有限公司 化學鍍裝置及金屬化基板的製造方法
JP2021165423A (ja) * 2020-04-08 2021-10-14 オムロン株式会社 部分めっき装置
CN112575354A (zh) * 2020-11-10 2021-03-30 宁波革创新材料科技有限公司 一种内管电镀致密层的方法和装置
JP6993537B1 (ja) * 2020-12-25 2022-01-13 株式会社荏原製作所 めっき装置、めっき装置の制御方法
CN114592229B (zh) * 2022-03-14 2023-03-24 淮安市泽邦电子有限公司 一种电阻用加工装置及其加工方法
KR102430630B1 (ko) * 2022-06-29 2022-08-16 오알오 주식회사 금속파우더 전해도금장치
CN116288628B (zh) * 2023-03-15 2023-12-19 肇庆顺创精密机械有限公司 一种吊桶式离心电镀篮
CN116847566A (zh) * 2023-07-07 2023-10-03 武汉新辉天科技有限公司 一种高集成化的电路板加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4820970B1 (zh) * 1968-05-11 1973-06-25
JP3126867B2 (ja) * 1993-08-31 2001-01-22 上村工業株式会社 小物のめっき装置及びめっき方法

Also Published As

Publication number Publication date
CN1576400B (zh) 2011-09-07
TWI351449B (zh) 2011-11-01
JP4358568B2 (ja) 2009-11-04
JP2005036298A (ja) 2005-02-10
CN1576400A (zh) 2005-02-09

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