CN116847566A - 一种高集成化的电路板加工方法 - Google Patents
一种高集成化的电路板加工方法 Download PDFInfo
- Publication number
- CN116847566A CN116847566A CN202310831577.6A CN202310831577A CN116847566A CN 116847566 A CN116847566 A CN 116847566A CN 202310831577 A CN202310831577 A CN 202310831577A CN 116847566 A CN116847566 A CN 116847566A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electroplating
- processing method
- board processing
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 19
- 238000009713 electroplating Methods 0.000 claims abstract description 98
- 239000007788 liquid Substances 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- 238000010586 diagram Methods 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 5
- 238000005516 engineering process Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000000712 assembly Effects 0.000 claims description 10
- 238000000429 assembly Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 3
- 235000017491 Bambusa tulda Nutrition 0.000 claims 3
- 241001330002 Bambuseae Species 0.000 claims 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 3
- 239000011425 bamboo Substances 0.000 claims 3
- 210000003205 muscle Anatomy 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000005381 potential energy Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0743—Mechanical agitation of fluid, e.g. during cleaning of the conductive pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310831577.6A CN116847566B (zh) | 2023-07-07 | 2023-07-07 | 一种高集成化的电路板加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310831577.6A CN116847566B (zh) | 2023-07-07 | 2023-07-07 | 一种高集成化的电路板加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN116847566A true CN116847566A (zh) | 2023-10-03 |
CN116847566B CN116847566B (zh) | 2024-08-20 |
Family
ID=88173968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310831577.6A Active CN116847566B (zh) | 2023-07-07 | 2023-07-07 | 一种高集成化的电路板加工方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN116847566B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117858365A (zh) * | 2024-02-06 | 2024-04-09 | 武汉辉天精密工业有限公司 | 一种复合电路板的加工方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005036298A (ja) * | 2003-07-18 | 2005-02-10 | Kamaya Denki Kk | 電子部品の電気めっき装置及び電気めっき方法、並びに該電子部品 |
CN211394680U (zh) * | 2020-01-11 | 2020-09-01 | 惠州市瑞基环保科技有限公司 | 一种电镀均匀的电镀槽 |
CN112813484A (zh) * | 2020-12-31 | 2021-05-18 | 重庆桃园金属表面处理有限公司 | 一种电镀池 |
CN114182336A (zh) * | 2021-12-13 | 2022-03-15 | 胡良 | 一种铜排电镀锡槽 |
CN114318476A (zh) * | 2021-12-28 | 2022-04-12 | 上海瑞昱新材料有限公司 | 一种多轴转动电镀架 |
CN115976613A (zh) * | 2023-03-17 | 2023-04-18 | 江苏润硕管业有限公司 | 一种管件电镀设备 |
-
2023
- 2023-07-07 CN CN202310831577.6A patent/CN116847566B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005036298A (ja) * | 2003-07-18 | 2005-02-10 | Kamaya Denki Kk | 電子部品の電気めっき装置及び電気めっき方法、並びに該電子部品 |
CN211394680U (zh) * | 2020-01-11 | 2020-09-01 | 惠州市瑞基环保科技有限公司 | 一种电镀均匀的电镀槽 |
CN112813484A (zh) * | 2020-12-31 | 2021-05-18 | 重庆桃园金属表面处理有限公司 | 一种电镀池 |
CN114182336A (zh) * | 2021-12-13 | 2022-03-15 | 胡良 | 一种铜排电镀锡槽 |
CN114318476A (zh) * | 2021-12-28 | 2022-04-12 | 上海瑞昱新材料有限公司 | 一种多轴转动电镀架 |
CN115976613A (zh) * | 2023-03-17 | 2023-04-18 | 江苏润硕管业有限公司 | 一种管件电镀设备 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117858365A (zh) * | 2024-02-06 | 2024-04-09 | 武汉辉天精密工业有限公司 | 一种复合电路板的加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN116847566B (zh) | 2024-08-20 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20240109 Address after: Room G1650, 4th Floor, Building 1, Phase III, International Enterprise Center, No. 1 Guanggu Avenue, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430205 Applicant after: Hubei Yueyan Technology Co.,Ltd. Address before: Room 501, 5 / F, 1-5 / F, Hekang inverter (Wuhan) Industrial Park, 6 fozuling 3rd road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 Applicant before: Wuhan xinhuitian Technology Co.,Ltd. |
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Effective date of registration: 20240724 Address after: Room 614, 6th Floor, Building B, Jinghe Zhigu, East of Jingchen Road, Chongwen Town, Jinghe New City, Xixian New Area, Xi'an City, Shaanxi Province 712000 Applicant after: Xi'an Qisheng Electronic Technology Co.,Ltd. Country or region after: China Address before: Room G1650, 4th Floor, Building 1, Phase III, International Enterprise Center, No. 1 Guanggu Avenue, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430205 Applicant before: Hubei Yueyan Technology Co.,Ltd. Country or region before: China |
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