JP4230679B2 - 半導体樹脂モールド装置および半導体樹脂モールド方法 - Google Patents

半導体樹脂モールド装置および半導体樹脂モールド方法 Download PDF

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Publication number
JP4230679B2
JP4230679B2 JP2001188772A JP2001188772A JP4230679B2 JP 4230679 B2 JP4230679 B2 JP 4230679B2 JP 2001188772 A JP2001188772 A JP 2001188772A JP 2001188772 A JP2001188772 A JP 2001188772A JP 4230679 B2 JP4230679 B2 JP 4230679B2
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Prior art keywords
suction
resin
tape substrate
mold
resin tape
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Expired - Fee Related
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JP2001188772A
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English (en)
Japanese (ja)
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JP2002079547A5 (enExample
JP2002079547A (ja
Inventor
美佳 桐谷
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Toshiba Corp
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Toshiba Corp
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Priority to JP2001188772A priority Critical patent/JP4230679B2/ja
Priority to US09/887,104 priority patent/US6787093B2/en
Publication of JP2002079547A publication Critical patent/JP2002079547A/ja
Publication of JP2002079547A5 publication Critical patent/JP2002079547A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2001188772A 2000-06-26 2001-06-21 半導体樹脂モールド装置および半導体樹脂モールド方法 Expired - Fee Related JP4230679B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001188772A JP4230679B2 (ja) 2000-06-26 2001-06-21 半導体樹脂モールド装置および半導体樹脂モールド方法
US09/887,104 US6787093B2 (en) 2000-06-26 2001-06-25 Semiconductor resin molding method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-190547 2000-06-26
JP2000190547 2000-06-26
JP2001188772A JP4230679B2 (ja) 2000-06-26 2001-06-21 半導体樹脂モールド装置および半導体樹脂モールド方法

Publications (3)

Publication Number Publication Date
JP2002079547A JP2002079547A (ja) 2002-03-19
JP2002079547A5 JP2002079547A5 (enExample) 2005-10-20
JP4230679B2 true JP4230679B2 (ja) 2009-02-25

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JP (1) JP4230679B2 (enExample)

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JP4583020B2 (ja) * 2003-11-17 2010-11-17 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5128047B2 (ja) * 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 光デバイス及び光デバイスの生産方法
JP4548199B2 (ja) * 2005-04-22 2010-09-22 株式会社デンソー 電子回路装置の製造方法
JP4744947B2 (ja) * 2005-06-23 2011-08-10 本田技研工業株式会社 電子制御ユニット及びその製造方法
US7985357B2 (en) 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
US7712213B2 (en) * 2005-12-02 2010-05-11 Aai Corporation Angular encapsulation of tandem stacked printed circuit boards
JP2008066696A (ja) * 2006-08-10 2008-03-21 Denso Corp 半導体製造装置および半導体製造方法
US8252615B2 (en) 2006-12-22 2012-08-28 Stats Chippac Ltd. Integrated circuit package system employing mold flash prevention technology
US8852986B2 (en) * 2007-05-16 2014-10-07 Stats Chippac Ltd. Integrated circuit package system employing resilient member mold system technology
TWI344226B (en) * 2007-10-29 2011-06-21 Ind Tech Res Inst Method of packaging light emitted diode
JP5280102B2 (ja) * 2008-05-26 2013-09-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2010153466A (ja) * 2008-12-24 2010-07-08 Elpida Memory Inc 配線基板
US8705065B2 (en) * 2009-03-26 2014-04-22 Brother Kogyo Kabushiki Kaisha System, device and storage device storing a program for selectively preventing scanned images from being displayed
JP2013021199A (ja) * 2011-07-13 2013-01-31 Apic Yamada Corp 樹脂吸着搬送方法及び樹脂吸着搬送装置並びに樹脂封止方法
JP5877083B2 (ja) * 2012-02-14 2016-03-02 住友重機械工業株式会社 樹脂封止装置及び樹脂封止方法
JP5587464B2 (ja) * 2013-05-30 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR102545290B1 (ko) * 2018-08-29 2023-06-16 삼성전자주식회사 반도체 패키지 몰딩 장치
CN110277323B (zh) * 2019-06-28 2021-05-11 广东工业大学 扇出型模块负压封装工艺、结构以及设备
DE102020214020A1 (de) 2020-11-09 2022-05-12 Robert Bosch Gesellschaft mit beschränkter Haftung Positionssensor und Führungswagen mit einem Positionssensor und Verfahren zur Herstellung eines Positionssensors
JP7468906B2 (ja) * 2021-04-26 2024-04-16 アピックヤマダ株式会社 樹脂封止装置
US11729915B1 (en) * 2022-03-22 2023-08-15 Tactotek Oy Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure
CN115648532B (zh) * 2022-10-31 2025-11-25 长电科技管理有限公司 半导体封装注塑模具、注塑装置及半导体封装注塑方法

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