JP4209688B2 - 決定された比率のプロセス流体を供給する方法および装置 - Google Patents
決定された比率のプロセス流体を供給する方法および装置 Download PDFInfo
- Publication number
- JP4209688B2 JP4209688B2 JP2002591927A JP2002591927A JP4209688B2 JP 4209688 B2 JP4209688 B2 JP 4209688B2 JP 2002591927 A JP2002591927 A JP 2002591927A JP 2002591927 A JP2002591927 A JP 2002591927A JP 4209688 B2 JP4209688 B2 JP 4209688B2
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- fluid
- flow
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- pressure
- supply
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- 238000000034 method Methods 0.000 title claims description 194
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- 101100023111 Schizosaccharomyces pombe (strain 972 / ATCC 24843) mfc1 gene Proteins 0.000 description 4
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Images
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
- G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
- G05D7/0664—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a plurality of diverging flows from a single flow
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
- G05D11/132—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0363—For producing proportionate flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0379—By fluid pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7759—Responsive to change in rate of fluid flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7761—Electrically actuated valve
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87249—Multiple inlet with multiple outlet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/877—With flow control means for branched passages
- Y10T137/87877—Single inlet with multiple distinctly valved outlets
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Flow Control (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29335601P | 2001-05-24 | 2001-05-24 | |
| PCT/US2002/016289 WO2002095519A1 (en) | 2001-05-24 | 2002-05-23 | Method and apparatus for providing a determined ratio of process fluids |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008027621A Division JP2008217779A (ja) | 2001-05-24 | 2008-02-07 | 決定された比率のプロセス流体を供給する方法および装置 |
| JP2008027627A Division JP2008198203A (ja) | 2001-05-24 | 2008-02-07 | 決定された比率のプロセス流体を供給する方法および装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004527856A JP2004527856A (ja) | 2004-09-09 |
| JP2004527856A5 JP2004527856A5 (enExample) | 2007-08-02 |
| JP4209688B2 true JP4209688B2 (ja) | 2009-01-14 |
Family
ID=23128747
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002591927A Expired - Fee Related JP4209688B2 (ja) | 2001-05-24 | 2002-05-23 | 決定された比率のプロセス流体を供給する方法および装置 |
| JP2008027627A Pending JP2008198203A (ja) | 2001-05-24 | 2008-02-07 | 決定された比率のプロセス流体を供給する方法および装置 |
| JP2008027621A Pending JP2008217779A (ja) | 2001-05-24 | 2008-02-07 | 決定された比率のプロセス流体を供給する方法および装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008027627A Pending JP2008198203A (ja) | 2001-05-24 | 2008-02-07 | 決定された比率のプロセス流体を供給する方法および装置 |
| JP2008027621A Pending JP2008217779A (ja) | 2001-05-24 | 2008-02-07 | 決定された比率のプロセス流体を供給する方法および装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US6752166B2 (enExample) |
| EP (1) | EP1399789A1 (enExample) |
| JP (3) | JP4209688B2 (enExample) |
| KR (1) | KR20040019293A (enExample) |
| CN (1) | CN100403198C (enExample) |
| TW (1) | TW573240B (enExample) |
| WO (1) | WO2002095519A1 (enExample) |
Families Citing this family (120)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7418504B2 (en) | 1998-10-30 | 2008-08-26 | Virnetx, Inc. | Agile network protocol for secure communications using secure domain names |
| US7188180B2 (en) | 1998-10-30 | 2007-03-06 | Vimetx, Inc. | Method for establishing secure communication link between computers of virtual private network |
| US6502135B1 (en) | 1998-10-30 | 2002-12-31 | Science Applications International Corporation | Agile network protocol for secure communications with assured system availability |
| US10511573B2 (en) | 1998-10-30 | 2019-12-17 | Virnetx, Inc. | Agile network protocol for secure communications using secure domain names |
| US7010604B1 (en) | 1998-10-30 | 2006-03-07 | Science Applications International Corporation | Agile network protocol for secure communications with assured system availability |
| WO2002061179A1 (en) * | 2001-01-19 | 2002-08-08 | Tokyo Electron Limited | Method and apparatus for gas injection system with minimum particulate contamination |
| EP1399789A1 (en) | 2001-05-24 | 2004-03-24 | Unit Instruments, Inc. | Method and apparatus for providing a determined ratio of process fluids |
| US6766260B2 (en) * | 2002-01-04 | 2004-07-20 | Mks Instruments, Inc. | Mass flow ratio system and method |
| US7039999B2 (en) * | 2002-04-25 | 2006-05-09 | Tarr Adam L | Method for installation of semiconductor fabrication tools |
| US7534363B2 (en) | 2002-12-13 | 2009-05-19 | Lam Research Corporation | Method for providing uniform removal of organic material |
| US7169231B2 (en) * | 2002-12-13 | 2007-01-30 | Lam Research Corporation | Gas distribution system with tuning gas |
| US20040168719A1 (en) * | 2003-02-28 | 2004-09-02 | Masahiro Nambu | System for dividing gas flow |
| US6796332B1 (en) * | 2003-04-04 | 2004-09-28 | Texaco Inc | Fluid balance control system for use in a fuel processor |
| WO2004109420A1 (ja) * | 2003-06-09 | 2004-12-16 | Ckd Corporation | 相対的圧力制御システム及び相対的流量制御システム |
| JP4454964B2 (ja) * | 2003-06-09 | 2010-04-21 | 東京エレクトロン株式会社 | 分圧制御システム及び流量制御システム |
| JP4331539B2 (ja) * | 2003-07-31 | 2009-09-16 | 株式会社フジキン | チャンバへのガス供給装置及びこれを用いたチャンバの内圧制御方法 |
| US7201179B2 (en) * | 2003-09-23 | 2007-04-10 | Air Liquide Industrial U.S. Lp | Modular fluid supply system |
| US20050075685A1 (en) * | 2003-10-02 | 2005-04-07 | Forsberg John W. | Medical device programmer with infrared communication |
| JP4399227B2 (ja) * | 2003-10-06 | 2010-01-13 | 株式会社フジキン | チャンバの内圧制御装置及び内圧被制御式チャンバ |
| JP4550507B2 (ja) * | 2004-07-26 | 2010-09-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| US7461549B1 (en) * | 2007-06-27 | 2008-12-09 | Mks Instruments, Inc. | Mass flow verifiers capable of providing different volumes, and related methods |
| US7673645B2 (en) * | 2005-04-21 | 2010-03-09 | Mks Instruments, Inc. | Gas delivery method and system including a flow ratio controller using a multiple antisymmetric optimal control arrangement |
| US7621290B2 (en) * | 2005-04-21 | 2009-11-24 | Mks Instruments, Inc. | Gas delivery method and system including a flow ratio controller using antisymmetric optimal control |
| US7394639B2 (en) * | 2005-07-08 | 2008-07-01 | Advanced Energy Industries, Inc. | System and method for driving an industrial control device |
| US8776717B2 (en) * | 2005-10-11 | 2014-07-15 | Intermolecular, Inc. | Systems for discretized processing of regions of a substrate |
| JP4788920B2 (ja) * | 2006-03-20 | 2011-10-05 | 日立金属株式会社 | 質量流量制御装置、その検定方法及び半導体製造装置 |
| US8997791B2 (en) * | 2006-04-14 | 2015-04-07 | Mks Instruments, Inc. | Multiple-channel flow ratio controller |
| JP2008039513A (ja) * | 2006-08-03 | 2008-02-21 | Hitachi Metals Ltd | 質量流量制御装置の流量制御補正方法 |
| US7637143B2 (en) * | 2006-11-10 | 2009-12-29 | Tokyo Electron Limited | Substrate processing apparatus and analysis method therefor |
| US9405298B2 (en) * | 2006-11-20 | 2016-08-02 | Applied Materials, Inc. | System and method to divide fluid flow in a predetermined ratio |
| US8011317B2 (en) * | 2006-12-29 | 2011-09-06 | Intermolecular, Inc. | Advanced mixing system for integrated tool having site-isolated reactors |
| US7706925B2 (en) * | 2007-01-10 | 2010-04-27 | Mks Instruments, Inc. | Integrated pressure and flow ratio control system |
| WO2008095009A2 (en) * | 2007-01-30 | 2008-08-07 | Bradley University | A heat transfer apparatus and method |
| US8074677B2 (en) * | 2007-02-26 | 2011-12-13 | Applied Materials, Inc. | Method and apparatus for controlling gas flow to a processing chamber |
| US7846497B2 (en) * | 2007-02-26 | 2010-12-07 | Applied Materials, Inc. | Method and apparatus for controlling gas flow to a processing chamber |
| US20080254217A1 (en) * | 2007-04-16 | 2008-10-16 | Boroson Michael L | Fine control of vaporized organic material |
| US8387657B2 (en) * | 2007-06-15 | 2013-03-05 | Fisher Controls International, Llc | Methods and apparatus to determine a position of a valve |
| JP5001757B2 (ja) * | 2007-08-31 | 2012-08-15 | シーケーディ株式会社 | 流体混合システム及び流体混合装置 |
| US7621302B2 (en) * | 2007-09-28 | 2009-11-24 | Airgas, Inc. | Coriolis dosing system for filling gas cylinders |
| JP5459895B2 (ja) * | 2007-10-15 | 2014-04-02 | Ckd株式会社 | ガス分流供給ユニット |
| KR100951683B1 (ko) * | 2007-12-10 | 2010-04-07 | 주식회사 테라세미콘 | 소스가스 공급방법 |
| JP5377513B2 (ja) * | 2007-12-27 | 2013-12-25 | ラム リサーチ コーポレーション | ショートエッチングレシピのためのガス輸送遅延の解消のための装置、方法、及びプログラム格納デバイス |
| KR101028213B1 (ko) * | 2007-12-27 | 2011-04-11 | 가부시키가이샤 호리바 에스텍 | 유량 비율 제어 장치 |
| US20090178714A1 (en) | 2008-01-14 | 2009-07-16 | Tokyo Electron Limited | Flow control system and method for multizone gas distribution |
| US20090236447A1 (en) * | 2008-03-21 | 2009-09-24 | Applied Materials, Inc. | Method and apparatus for controlling gas injection in process chamber |
| US8205629B2 (en) * | 2008-04-25 | 2012-06-26 | Applied Materials, Inc. | Real time lead-line characterization for MFC flow verification |
| JP5430007B2 (ja) * | 2008-05-21 | 2014-02-26 | 株式会社フジキン | 圧力式流量制御装置を用いた流体の非連続式流量切替制御方法 |
| EP3812870B1 (en) * | 2008-06-26 | 2022-09-21 | Belparts Group N.V. | Flow control system |
| ATE545900T1 (de) * | 2008-08-13 | 2012-03-15 | Shell Int Research | Verfahren zur steuerung eines gasstroms zwischen mehreren gasströmen |
| US20100084023A1 (en) * | 2008-10-07 | 2010-04-08 | Chris Melcer | Flow control module for a fluid delivery system |
| KR101936536B1 (ko) | 2009-06-10 | 2019-01-08 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 유체 가공 시스템 및 방법 |
| CN102473634B (zh) * | 2009-08-20 | 2015-02-18 | 东京毅力科创株式会社 | 等离子体处理装置和等离子体处理方法 |
| US9127361B2 (en) * | 2009-12-07 | 2015-09-08 | Mks Instruments, Inc. | Methods of and apparatus for controlling pressure in multiple zones of a process tool |
| US8397739B2 (en) | 2010-01-08 | 2013-03-19 | Applied Materials, Inc. | N-channel flow ratio controller calibration |
| US20110186017A1 (en) * | 2010-02-03 | 2011-08-04 | Achates Power, Inc. | Single-crankshaft, opposed-piston engine constructions |
| WO2011097015A2 (en) | 2010-02-03 | 2011-08-11 | Achates Power, Inc. | Rolling thrust bearing constructions |
| JP5562712B2 (ja) * | 2010-04-30 | 2014-07-30 | 東京エレクトロン株式会社 | 半導体製造装置用のガス供給装置 |
| KR101772723B1 (ko) * | 2010-06-28 | 2017-08-29 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 방법 |
| US8905074B2 (en) * | 2010-10-22 | 2014-12-09 | Applied Materials, Inc. | Apparatus for controlling gas distribution using orifice ratio conductance control |
| JP5528374B2 (ja) * | 2011-03-03 | 2014-06-25 | 東京エレクトロン株式会社 | ガス減圧供給装置、これを備えるシリンダキャビネット、バルブボックス、及び基板処理装置 |
| KR102001247B1 (ko) | 2011-06-30 | 2019-07-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 고속 가스 교환, 고속 가스 전환 및 프로그램 가능한 가스 전달을 위한 방법 및 장치 |
| JP5739261B2 (ja) * | 2011-07-28 | 2015-06-24 | 株式会社堀場エステック | ガス供給システム |
| US9188989B1 (en) | 2011-08-20 | 2015-11-17 | Daniel T. Mudd | Flow node to deliver process gas using a remote pressure measurement device |
| US9958302B2 (en) | 2011-08-20 | 2018-05-01 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
| US8849466B2 (en) | 2011-10-04 | 2014-09-30 | Mks Instruments, Inc. | Method of and apparatus for multiple channel flow ratio controller system |
| US20130255784A1 (en) * | 2012-03-30 | 2013-10-03 | Applied Materials, Inc. | Gas delivery systems and methods of use thereof |
| US8925588B2 (en) | 2012-08-17 | 2015-01-06 | Novellus Systems, Inc. | Flow balancing in gas distribution networks |
| CN103591458B (zh) * | 2012-08-17 | 2017-04-12 | 诺发系统公司 | 气体分配网络中的流量平衡 |
| US9004107B2 (en) * | 2012-08-21 | 2015-04-14 | Applied Materials, Inc. | Methods and apparatus for enhanced gas flow rate control |
| US9781994B2 (en) * | 2012-12-07 | 2017-10-10 | Taiwan Semiconductor Manufacturing Company Limited | Wafer cleaning |
| US9090972B2 (en) | 2012-12-31 | 2015-07-28 | Lam Research Corporation | Gas supply systems for substrate processing chambers and methods therefor |
| US20140230910A1 (en) * | 2013-02-20 | 2014-08-21 | Agilent Technologies, Inc. | Split-channel gas flow control |
| JP6193679B2 (ja) * | 2013-08-30 | 2017-09-06 | 株式会社フジキン | ガス分流供給装置及びガス分流供給方法 |
| US9335768B2 (en) * | 2013-09-12 | 2016-05-10 | Lam Research Corporation | Cluster mass flow devices and multi-line mass flow devices incorporating the same |
| JP6158111B2 (ja) * | 2014-02-12 | 2017-07-05 | 東京エレクトロン株式会社 | ガス供給方法及び半導体製造装置 |
| CN104514759A (zh) * | 2014-12-30 | 2015-04-15 | 天津福云天翼科技有限公司 | 一种大流量分离式蓄能器组的恒定压力调节系统 |
| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| DE102015100762A1 (de) * | 2015-01-20 | 2016-07-21 | Infineon Technologies Ag | Behälterschalteinrichtung und Verfahren zum Überwachen einer Fluidrate |
| KR102004633B1 (ko) | 2015-02-12 | 2019-07-26 | 엔테그리스, 아이엔씨. | 스마트 패키지 |
| US10146233B2 (en) * | 2015-04-06 | 2018-12-04 | Horiba Stec, Co., Ltd. | Flow rate ratio control apparatus and program for flow rate ratio control apparatus |
| US10957561B2 (en) * | 2015-07-30 | 2021-03-23 | Lam Research Corporation | Gas delivery system |
| US10261523B2 (en) * | 2015-08-17 | 2019-04-16 | Rainboxx, Inc. | Apparatus and method for controlling irrigation process by sending encoded acoustical messages along irrigation conduit |
| US10825659B2 (en) | 2016-01-07 | 2020-11-03 | Lam Research Corporation | Substrate processing chamber including multiple gas injection points and dual injector |
| US10699878B2 (en) | 2016-02-12 | 2020-06-30 | Lam Research Corporation | Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
| US10651015B2 (en) | 2016-02-12 | 2020-05-12 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
| US10438833B2 (en) | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
| US20190047840A1 (en) * | 2016-02-23 | 2019-02-14 | Electro Controles Del Noroeste S.A. De C.V. | Modular fluid-dosing system and its processes |
| US10453721B2 (en) * | 2016-03-15 | 2019-10-22 | Applied Materials, Inc. | Methods and assemblies for gas flow ratio control |
| US10269600B2 (en) * | 2016-03-15 | 2019-04-23 | Applied Materials, Inc. | Methods and assemblies for gas flow ratio control |
| US10303189B2 (en) | 2016-06-30 | 2019-05-28 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
| US10838437B2 (en) | 2018-02-22 | 2020-11-17 | Ichor Systems, Inc. | Apparatus for splitting flow of process gas and method of operating same |
| US10679880B2 (en) | 2016-09-27 | 2020-06-09 | Ichor Systems, Inc. | Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same |
| US11144075B2 (en) | 2016-06-30 | 2021-10-12 | Ichor Systems, Inc. | Flow control system, method, and apparatus |
| US10410832B2 (en) | 2016-08-19 | 2019-09-10 | Lam Research Corporation | Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment |
| CN106730545B (zh) * | 2016-12-26 | 2020-05-19 | 威特龙消防安全集团股份公司 | 细水雾灭火系统添加剂计量注入系统 |
| US10663337B2 (en) | 2016-12-30 | 2020-05-26 | Ichor Systems, Inc. | Apparatus for controlling flow and method of calibrating same |
| JP6914063B2 (ja) * | 2017-03-10 | 2021-08-04 | 株式会社堀場エステック | ガス制御システム、該ガス制御システムを備えた成膜装置、該ガス制御システムに用いるプログラム及びガス制御方法。 |
| US10656662B2 (en) * | 2017-09-15 | 2020-05-19 | Kabushiki Kaisha Toshiba | Variable pressure device and actuator |
| KR102182298B1 (ko) | 2017-11-21 | 2020-11-25 | 램 리써치 코포레이션 | 하단 링 및 중간 에지 링 |
| JP7027151B2 (ja) | 2017-12-13 | 2022-03-01 | 株式会社堀場エステック | 濃度制御装置、ガス制御システム、成膜装置、濃度制御方法、及び濃度制御装置用プログラム |
| US10591934B2 (en) * | 2018-03-09 | 2020-03-17 | Lam Research Corporation | Mass flow controller for substrate processing |
| JP7031093B2 (ja) * | 2018-03-30 | 2022-03-08 | 三機工業株式会社 | 供給システムおよび供給システムの制御方法 |
| WO2019210127A1 (en) | 2018-04-28 | 2019-10-31 | Applied Materials, Inc. | Gas-pulsing-based shared precursor distribution system and methods of use |
| KR20230106754A (ko) | 2018-08-13 | 2023-07-13 | 램 리써치 코포레이션 | 에지 링 포지셔닝 및 센터링 피처들을 포함하는 플라즈마 시스 튜닝을 위한 교체가능한 에지 링 어셈블리 및/또는 접을 수 있는 에지 링 어셈블리 |
| JP7024740B2 (ja) * | 2019-01-16 | 2022-02-24 | 株式会社デンソー | 半導体製造装置 |
| JP7281285B2 (ja) * | 2019-01-28 | 2023-05-25 | 株式会社堀場エステック | 濃度制御装置、及び、ゼロ点調整方法、濃度制御装置用プログラム |
| JP7495742B2 (ja) * | 2019-04-25 | 2024-06-05 | 株式会社フジキン | 流量制御装置および流量制御方法 |
| WO2021098982A1 (en) * | 2019-11-19 | 2021-05-27 | Linde Gmbh | Smart gas mixer |
| WO2021194470A1 (en) | 2020-03-23 | 2021-09-30 | Lam Research Corporation | Mid-ring erosion compensation in substrate processing systems |
| JP2021179739A (ja) * | 2020-05-12 | 2021-11-18 | 株式会社堀場エステック | 流量比率制御システム、成膜システム、異常診断方法、及び異常診断プログラム |
| CN111913504B (zh) * | 2020-08-17 | 2023-10-20 | 中国地质大学(北京) | 一种恒定流量分流装置 |
| US12068135B2 (en) * | 2021-02-12 | 2024-08-20 | Applied Materials, Inc. | Fast gas exchange apparatus, system, and method |
| WO2022186971A1 (en) | 2021-03-03 | 2022-09-09 | Ichor Systems, Inc. | Fluid flow control system comprising a manifold assembly |
| TW202300693A (zh) * | 2021-05-26 | 2023-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 氣體系統、半導體處理系統、及氣體流動控制方法 |
| US11940307B2 (en) | 2021-06-08 | 2024-03-26 | Mks Instruments, Inc. | Methods and apparatus for pressure based mass flow ratio control |
| US12000723B2 (en) | 2022-02-18 | 2024-06-04 | Mks Instruments, Inc. | Method and apparatus for pressure based mass flow control |
| US11940819B1 (en) * | 2023-01-20 | 2024-03-26 | Applied Materials, Inc. | Mass flow controller based fast gas exchange |
| US20250264892A1 (en) * | 2024-02-15 | 2025-08-21 | Illinois Tool Works Inc. | Flow ratio controllers with mass accumulation compensation and gas distribution systems utilizing mass accumulation compensation |
| US20250264891A1 (en) * | 2024-02-15 | 2025-08-21 | Illinois Tool Works Inc. | Flow ratio controllers and gas distribution systems utilizing flow ratio controllers |
| CN119916848B (zh) * | 2025-04-03 | 2025-06-24 | 常州高凯电子有限公司 | 一种用于多通道气体流量比例控制方法及系统 |
Family Cites Families (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2676603A (en) * | 1946-04-12 | 1954-04-27 | Kollsman Paul | Fluid flow divider |
| DE2517957C2 (de) * | 1975-04-23 | 1977-05-12 | Norddeutsche Affinerie | Verfahren zur unabhaengigen gemisch- und leistungseinstellung bei vielbrenner-schachtoefen zum schmelzen von metallen |
| DE2915983C2 (de) * | 1979-04-20 | 1983-03-31 | Klöckner Ionon GmbH, 5000 Köln | Verfahren zum Erzeugen eines Gasgemisches |
| US4396031A (en) * | 1981-01-07 | 1983-08-02 | Conoco Inc. | Method for restricting uncontrolled fluid flow through a pipe |
| US4369031A (en) * | 1981-09-15 | 1983-01-18 | Thermco Products Corporation | Gas control system for chemical vapor deposition system |
| JPS58151614A (ja) * | 1982-03-04 | 1983-09-08 | Mitsubishi Electric Corp | 流量制御装置 |
| US4949670A (en) | 1988-11-04 | 1990-08-21 | Tegal Corporation | Method and apparatus for low pressure plasma |
| US5240046A (en) | 1989-03-03 | 1993-08-31 | Eaton Corporation | Fluid flow control method and apparatus for minimizing particle contamination |
| US5031674A (en) | 1989-03-03 | 1991-07-16 | Eaton Corporation | Fluid flow control method and apparatus for minimizing particle contamination |
| US5134965A (en) | 1989-06-16 | 1992-08-04 | Hitachi, Ltd. | Processing apparatus and method for plasma processing |
| US5013398A (en) | 1990-05-29 | 1991-05-07 | Micron Technology, Inc. | Anisotropic etch method for a sandwich structure |
| US5062446A (en) * | 1991-01-07 | 1991-11-05 | Sematech, Inc. | Intelligent mass flow controller |
| US5165450A (en) | 1991-12-23 | 1992-11-24 | Texaco Inc. | Means for separating a fluid stream into two separate streams |
| JP2894658B2 (ja) | 1992-01-17 | 1999-05-24 | 株式会社東芝 | ドライエッチング方法およびその装置 |
| US5307833A (en) | 1992-10-26 | 1994-05-03 | Texaco Inc. | Method and apparatus for automatically transferring and measuring wet steam between priority and secondary users |
| US5997950A (en) | 1992-12-22 | 1999-12-07 | Applied Materials, Inc. | Substrate having uniform tungsten silicide film and method of manufacture |
| JPH06205935A (ja) | 1992-12-25 | 1994-07-26 | Toshiba Corp | 脱硝制御装置 |
| US5453124A (en) | 1992-12-30 | 1995-09-26 | Texas Instruments Incorporated | Programmable multizone gas injector for single-wafer semiconductor processing equipment |
| US5916369A (en) | 1995-06-07 | 1999-06-29 | Applied Materials, Inc. | Gas inlets for wafer processing chamber |
| US5647945A (en) | 1993-08-25 | 1997-07-15 | Tokyo Electron Limited | Vacuum processing apparatus |
| US5614055A (en) | 1993-08-27 | 1997-03-25 | Applied Materials, Inc. | High density plasma CVD and etching reactor |
| US5522934A (en) | 1994-04-26 | 1996-06-04 | Tokyo Electron Limited | Plasma processing apparatus using vertical gas inlets one on top of another |
| US5736457A (en) | 1994-12-09 | 1998-04-07 | Sematech | Method of making a damascene metallization |
| JP2837112B2 (ja) | 1995-06-09 | 1998-12-14 | 株式会社平井 | 音速ノズルを用いた質量流量制御方法および装置 |
| US5702530A (en) | 1995-06-23 | 1997-12-30 | Applied Materials, Inc. | Distributed microwave plasma reactor for semiconductor processing |
| IT1275825B1 (it) | 1995-10-30 | 1997-10-17 | Nuovo Pignone Spa | Sistema perfezionato per la misura e la regolazione della portata massica di gas |
| US5772771A (en) | 1995-12-13 | 1998-06-30 | Applied Materials, Inc. | Deposition chamber for improved deposition thickness uniformity |
| US5761606A (en) * | 1996-02-08 | 1998-06-02 | Wolzien; Thomas R. | Media online services access via address embedded in video or audio program |
| US5778181A (en) * | 1996-03-08 | 1998-07-07 | Actv, Inc. | Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments |
| US6018768A (en) * | 1996-03-08 | 2000-01-25 | Actv, Inc. | Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments |
| US5774664A (en) * | 1996-03-08 | 1998-06-30 | Actv, Inc. | Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments |
| US5662143A (en) | 1996-05-16 | 1997-09-02 | Gasonics International | Modular gas box system |
| US6013155A (en) | 1996-06-28 | 2000-01-11 | Lam Research Corporation | Gas injection system for plasma processing |
| US6083569A (en) | 1996-10-25 | 2000-07-04 | Applied Materials, Inc. | Discharging a wafer after a plasma process for dielectric deposition |
| US5911834A (en) | 1996-11-18 | 1999-06-15 | Applied Materials, Inc. | Gas delivery system |
| US6294026B1 (en) | 1996-11-26 | 2001-09-25 | Siemens Aktiengesellschaft | Distribution plate for a reaction chamber with multiple gas inlets and separate mass flow control loops |
| US6321782B1 (en) * | 1997-01-08 | 2001-11-27 | Ronald Hollister | Apparatus for controlling the flow of fluids |
| US6190233B1 (en) | 1997-02-20 | 2001-02-20 | Applied Materials, Inc. | Method and apparatus for improving gap-fill capability using chemical and physical etchbacks |
| US5843239A (en) | 1997-03-03 | 1998-12-01 | Applied Materials, Inc. | Two-step process for cleaning a substrate processing chamber |
| US6125859A (en) | 1997-03-05 | 2000-10-03 | Applied Materials, Inc. | Method for improved cleaning of substrate processing systems |
| US5865205A (en) | 1997-04-17 | 1999-02-02 | Applied Materials, Inc. | Dynamic gas flow controller |
| US6042687A (en) | 1997-06-30 | 2000-03-28 | Lam Research Corporation | Method and apparatus for improving etch and deposition uniformity in plasma semiconductor processing |
| JP3317209B2 (ja) | 1997-08-12 | 2002-08-26 | 東京エレクトロンエイ・ティー株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JPH11303758A (ja) | 1998-04-17 | 1999-11-02 | Nissan Motor Co Ltd | 電動ポンプの制御装置 |
| US6217937B1 (en) | 1998-07-15 | 2001-04-17 | Cornell Research Foundation, Inc. | High throughput OMVPE apparatus |
| JP3522544B2 (ja) * | 1998-08-24 | 2004-04-26 | 忠弘 大見 | 流体可変型流量制御装置 |
| US6217659B1 (en) | 1998-10-16 | 2001-04-17 | Air Products And Chemical, Inc. | Dynamic blending gas delivery system and method |
| CA2371275A1 (en) * | 1998-11-20 | 2000-06-02 | Sepiatec Gmbh | Method and device for regulating individual sub-flows of a system for conveying fluid media |
| EP1096351A4 (en) | 1999-04-16 | 2004-12-15 | Fujikin Kk | FLUID SUPPLY DEVICE OF THE PARALLEL BYPASS TYPE, AND METHOD AND DEVICE FOR CONTROLLING THE FLOW OF A VARIABLE FLUID TYPE PRESSURE SYSTEM USED IN SAID DEVICE |
| US6210482B1 (en) | 1999-04-22 | 2001-04-03 | Fujikin Incorporated | Apparatus for feeding gases for use in semiconductor manufacturing |
| JP2000306884A (ja) | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | プラズマ処理装置およびプラズマ処理方法 |
| US6343617B1 (en) * | 1999-07-09 | 2002-02-05 | Millipore Corporation | System and method of operation of a digital mass flow controller |
| US6389364B1 (en) * | 1999-07-10 | 2002-05-14 | Mykrolis Corporation | System and method for a digital mass flow controller |
| US6581623B1 (en) * | 1999-07-16 | 2003-06-24 | Advanced Technology Materials, Inc. | Auto-switching gas delivery system utilizing sub-atmospheric pressure gas supply vessels |
| JP2002110570A (ja) | 2000-10-04 | 2002-04-12 | Asm Japan Kk | 半導体製造装置用ガスラインシステム |
| US6333272B1 (en) | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| US6631334B2 (en) * | 2000-12-26 | 2003-10-07 | Mks Instruments, Inc. | Pressure-based mass flow controller system |
| US6418954B1 (en) * | 2001-04-17 | 2002-07-16 | Mks Instruments, Inc. | System and method for dividing flow |
| EP1399789A1 (en) | 2001-05-24 | 2004-03-24 | Unit Instruments, Inc. | Method and apparatus for providing a determined ratio of process fluids |
| US6766260B2 (en) | 2002-01-04 | 2004-07-20 | Mks Instruments, Inc. | Mass flow ratio system and method |
| US6913652B2 (en) * | 2002-06-17 | 2005-07-05 | Applied Materials, Inc. | Gas flow division in a wafer processing system having multiple chambers |
| US7169231B2 (en) * | 2002-12-13 | 2007-01-30 | Lam Research Corporation | Gas distribution system with tuning gas |
-
2002
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- 2002-05-23 JP JP2002591927A patent/JP4209688B2/ja not_active Expired - Fee Related
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| US7143774B2 (en) | 2006-12-05 |
| US7424894B2 (en) | 2008-09-16 |
| US20060272703A1 (en) | 2006-12-07 |
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