JP4203109B2 - 振動制御用質量体 - Google Patents
振動制御用質量体 Download PDFInfo
- Publication number
- JP4203109B2 JP4203109B2 JP2007515550A JP2007515550A JP4203109B2 JP 4203109 B2 JP4203109 B2 JP 4203109B2 JP 2007515550 A JP2007515550 A JP 2007515550A JP 2007515550 A JP2007515550 A JP 2007515550A JP 4203109 B2 JP4203109 B2 JP 4203109B2
- Authority
- JP
- Japan
- Prior art keywords
- vibration control
- mass body
- members
- control mass
- tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0031—Matrix based on refractory metals, W, Mo, Nb, Hf, Ta, Zr, Ti, V or alloys thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F7/00—Vibration-dampers; Shock-absorbers
- F16F7/10—Vibration-dampers; Shock-absorbers using inertia effect
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Health & Medical Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Powder Metallurgy (AREA)
- Vibration Prevention Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
まず、質量比率でタングステン(W)粉末:97%、ニッケル(Ni)粉末:2%、鉄(Fe)粉末:1%を配合し、ミキサで30分間乾式混合した。その後、上記の金属混合粉を篩目で1回篩い分けした。タイラ(Tyler)粒度メッシュが#150の篩目を用いた。
まず、質量比率でタングステン(W)粉末:97%、ニッケル(Ni)粉末:2%、鉄(Fe)粉末:1%を配合し、ミキサで30分間乾式混合した。その後、上記の金属混合粉を篩目で1回篩い分けした。タイラ(Tyler)粒度メッシュが#150の篩目を用いた。
Claims (3)
- 移動体を有するステージ装置において移動体の移動に伴う振動を制御するために用いられる振動制御用質量体であって、
略直方体形状をした複数の部材を備え、この複数の部材の各々がタングステン合金からなり、このタングステン合金は主成分としてタングステンを80質量%以上99質量%以下含み、
前記略直方体形状をした複数の部材が、対向する二つの部材を形成し、
前記対向する二つの部材は、リニアガイドに取り付けられるものであり、
前記略直方体形状をした複数の部材を組み合わせて凹部が形成され、
前記凹部の幅は、前記略直方体形状をした部材の一辺寸法で規定され、かつ、前記対向する二つの部材の間の間隔を規定することを特徴とする、振動制御用質量体。 - 前記対向する二つの部材は、連結部材を介材させてリニアガイドに取り付けられている、請求項1に記載の振動制御用質量体。
- 前記移動体がマスクまたは基板を保持して移動するものであり、前記ステージ装置が露光装置である、請求項1に記載の振動制御用質量体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005356979 | 2005-12-09 | ||
JP2005356979 | 2005-12-09 | ||
PCT/JP2006/323895 WO2007066560A1 (ja) | 2005-12-09 | 2006-11-30 | 振動制御用質量体 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007128856A Division JP4083205B1 (ja) | 2007-05-15 | 2007-05-15 | 振動制御用質量体 |
JP2008050029A Division JP2008196701A (ja) | 2005-12-09 | 2008-02-29 | 振動制御用質量体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4203109B2 true JP4203109B2 (ja) | 2008-12-24 |
JPWO2007066560A1 JPWO2007066560A1 (ja) | 2009-05-14 |
Family
ID=38122705
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007515550A Expired - Fee Related JP4203109B2 (ja) | 2005-12-09 | 2006-11-30 | 振動制御用質量体 |
JP2008050029A Pending JP2008196701A (ja) | 2005-12-09 | 2008-02-29 | 振動制御用質量体 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008050029A Pending JP2008196701A (ja) | 2005-12-09 | 2008-02-29 | 振動制御用質量体 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20090039575A1 (ja) |
EP (1) | EP1959157A1 (ja) |
JP (2) | JP4203109B2 (ja) |
KR (1) | KR101314701B1 (ja) |
CN (1) | CN101326384B (ja) |
CA (1) | CA2631351C (ja) |
TW (1) | TW200728634A (ja) |
WO (1) | WO2007066560A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101837342B (zh) * | 2009-03-20 | 2013-01-16 | 平湖市海特合金有限公司 | 用于机械振动的偏心块及其原料制备方法 |
US9249851B2 (en) * | 2012-11-14 | 2016-02-02 | The Boeing Company | Apparatus and method for tuning a vibratory response of a rotor blade |
JP6212716B2 (ja) * | 2014-02-21 | 2017-10-18 | パナソニックIpマネジメント株式会社 | 洗濯機 |
CN107077898B (zh) | 2014-10-01 | 2019-11-12 | Qsa全球有限公司 | 用于伽马射线照相术的防护装置 |
CN105154700A (zh) * | 2015-09-24 | 2015-12-16 | 瑞声精密制造科技(常州)有限公司 | 高比重钨合金的烧结工艺 |
JP2019078685A (ja) | 2017-10-26 | 2019-05-23 | 株式会社ブイ・テクノロジー | Ledチップの検査方法、その検査装置及びledディスプレイの製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2957424B2 (ja) * | 1993-10-08 | 1999-10-04 | 住友電気工業株式会社 | 耐食性タングステン基焼結合金 |
JPH0932880A (ja) * | 1995-07-17 | 1997-02-04 | Tokai Rubber Ind Ltd | ダイナミックダンパ |
JP3963410B2 (ja) * | 1997-04-22 | 2007-08-22 | キヤノン株式会社 | 位置決め装置およびこれを用いた露光装置 |
US5984233A (en) * | 1997-11-26 | 1999-11-16 | Lord Corporation | Elastomeric tuned vibration absorber |
JP3205987B2 (ja) * | 1999-02-03 | 2001-09-04 | 三菱マテリアルシ−エムアイ株式会社 | タングステン基焼結合金部品 |
JP2001116082A (ja) * | 1999-10-15 | 2001-04-27 | Tokai Rubber Ind Ltd | 建築構造物の制振装置 |
JP2001193788A (ja) * | 1999-12-31 | 2001-07-17 | Inter Seiko Co Ltd | ダイナミックダンパ用ウエイトの製法 |
JP2003193167A (ja) * | 2001-12-26 | 2003-07-09 | Toho Kinzoku Co Ltd | 高密度合金 |
JP2004176825A (ja) * | 2002-11-27 | 2004-06-24 | Thk Co Ltd | ダイナミックダンパ付運動案内装置及びテーブル装置 |
JP2005030486A (ja) | 2003-07-11 | 2005-02-03 | Nikon Corp | 制振装置及びステージ装置並びに露光装置 |
JP2005098325A (ja) * | 2003-09-22 | 2005-04-14 | Sendai Nikon:Kk | 制振装置及び露光装置 |
-
2006
- 2006-11-30 JP JP2007515550A patent/JP4203109B2/ja not_active Expired - Fee Related
- 2006-11-30 US US12/084,769 patent/US20090039575A1/en not_active Abandoned
- 2006-11-30 KR KR1020087010490A patent/KR101314701B1/ko not_active IP Right Cessation
- 2006-11-30 WO PCT/JP2006/323895 patent/WO2007066560A1/ja active Application Filing
- 2006-11-30 EP EP06833698A patent/EP1959157A1/en not_active Withdrawn
- 2006-11-30 CA CA2631351A patent/CA2631351C/en not_active Expired - Fee Related
- 2006-11-30 CN CN2006800463098A patent/CN101326384B/zh not_active Expired - Fee Related
- 2006-12-08 TW TW095145976A patent/TW200728634A/zh not_active IP Right Cessation
-
2008
- 2008-02-29 JP JP2008050029A patent/JP2008196701A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TW200728634A (en) | 2007-08-01 |
KR101314701B1 (ko) | 2013-10-07 |
CN101326384B (zh) | 2012-01-04 |
CA2631351A1 (en) | 2007-06-14 |
EP1959157A1 (en) | 2008-08-20 |
US20090039575A1 (en) | 2009-02-12 |
CA2631351C (en) | 2014-06-03 |
JPWO2007066560A1 (ja) | 2009-05-14 |
WO2007066560A1 (ja) | 2007-06-14 |
TWI366634B (ja) | 2012-06-21 |
JP2008196701A (ja) | 2008-08-28 |
KR20080077100A (ko) | 2008-08-21 |
CN101326384A (zh) | 2008-12-17 |
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