JP4200761B2 - プリント配線板の製造法及びそれに用いる感光性樹脂組成物 - Google Patents

プリント配線板の製造法及びそれに用いる感光性樹脂組成物 Download PDF

Info

Publication number
JP4200761B2
JP4200761B2 JP2002577648A JP2002577648A JP4200761B2 JP 4200761 B2 JP4200761 B2 JP 4200761B2 JP 2002577648 A JP2002577648 A JP 2002577648A JP 2002577648 A JP2002577648 A JP 2002577648A JP 4200761 B2 JP4200761 B2 JP 4200761B2
Authority
JP
Japan
Prior art keywords
resin composition
photosensitive resin
plating
meth
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002577648A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2002079877A1 (ja
Inventor
聡彦 赤堀
賢 沢辺
美智子 名取
知明 青木
卓哉 梶原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2002079877A1 publication Critical patent/JPWO2002079877A1/ja
Application granted granted Critical
Publication of JP4200761B2 publication Critical patent/JP4200761B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2002577648A 2001-03-29 2002-03-29 プリント配線板の製造法及びそれに用いる感光性樹脂組成物 Expired - Lifetime JP4200761B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001096367 2001-03-29
JP2001096367 2001-03-29
PCT/JP2002/003147 WO2002079877A1 (en) 2001-03-29 2002-03-29 Method for manufacturing printeed wiring board and photosensitive resin composition to be used for it

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007126646A Division JP4428399B2 (ja) 2001-03-29 2007-05-11 プリント配線板の製造に用いる感光性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2002079877A1 JPWO2002079877A1 (ja) 2004-07-22
JP4200761B2 true JP4200761B2 (ja) 2008-12-24

Family

ID=18950286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002577648A Expired - Lifetime JP4200761B2 (ja) 2001-03-29 2002-03-29 プリント配線板の製造法及びそれに用いる感光性樹脂組成物

Country Status (6)

Country Link
US (1) US7338751B2 (esLanguage)
JP (1) JP4200761B2 (esLanguage)
KR (2) KR100884438B1 (esLanguage)
CN (2) CN1828411B (esLanguage)
TW (1) TWI296738B (esLanguage)
WO (1) WO2002079877A1 (esLanguage)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2417127A (en) * 2004-08-12 2006-02-15 Vetco Gray Controls Ltd Surface metallization of contact pads
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法
JP4804001B2 (ja) * 2004-12-28 2011-10-26 イビデン株式会社 プリント配線板の製造方法
KR100934046B1 (ko) * 2005-05-23 2009-12-24 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP2007012735A (ja) * 2005-06-29 2007-01-18 Cmk Corp プリント配線板の表面処理方法
JP4747770B2 (ja) * 2005-10-04 2011-08-17 日立化成工業株式会社 プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法
JP4730071B2 (ja) * 2005-11-29 2011-07-20 凸版印刷株式会社 回路基板の製造方法
JP4919921B2 (ja) * 2007-10-02 2012-04-18 東洋アルミニウム株式会社 Ｉｃカード・タグ用アンテナ回路構成体とその製造方法
JP4645776B2 (ja) * 2008-06-18 2011-03-09 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法
JP2010217903A (ja) * 2010-04-19 2010-09-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びプリント配線板の製造方法
JP5697461B2 (ja) * 2011-01-17 2015-04-08 ユニチカ株式会社 ポリエステルフィルム、および感光性樹脂構造体
CN102413629A (zh) * 2011-07-27 2012-04-11 大唐移动通信设备有限公司 一种印制电路板及其制造方法
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
KR102025036B1 (ko) * 2011-12-05 2019-09-24 히타치가세이가부시끼가이샤 터치패널용 전극의 보호막의 형성 방법, 감광성 수지 조성물 및 감광성 엘리먼트, 및, 터치패널의 제조 방법
WO2013084283A1 (ja) * 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
JP5787239B2 (ja) * 2012-06-29 2015-09-30 荒川化学工業株式会社 印刷レジスト用活性エネルギー線硬化性樹脂組成物、これを用いたレジストパターンの形成方法、印刷レジスト積層体およびプリント配線基板
KR20140018016A (ko) * 2012-08-03 2014-02-12 삼성전기주식회사 인쇄회로기판의 제조방법
CN104883808B (zh) * 2015-05-05 2017-12-01 华为技术有限公司 一种印刷电路板及印刷电路板的制造方法
CN108027675B (zh) * 2015-09-30 2021-10-08 富士胶片株式会社 静电电容型输入装置及其电极保护膜及其膜用组合物、转印薄膜、层叠体、图像显示装置
JP6421161B2 (ja) * 2015-11-27 2018-11-07 株式会社タムラ製作所 感光性樹脂組成物
CN108490737B (zh) * 2018-03-14 2021-11-02 杭州福斯特电子材料有限公司 一种感光性树脂组合物及其用途
JP7593314B2 (ja) * 2019-06-26 2024-12-03 三菱瓦斯化学株式会社 レジンシート、金属箔張積層板、及びプリント配線板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0131824B1 (en) * 1983-07-01 1990-05-09 Fuji Photo Film Co., Ltd. Photopolymerizable composition
US6703181B1 (en) * 1993-03-12 2004-03-09 Kabushiki Kaisha Toshiba Photosensitive composition having uniform concentration distribution of components and pattern formation method using the same
JPH06282069A (ja) * 1993-03-25 1994-10-07 Asahi Chem Ind Co Ltd 厚膜回路用感光性樹脂組成物
JP3115449B2 (ja) 1993-05-07 2000-12-04 イビデン株式会社 配線板用めっきレジスト組成物およびプリント配線板
US6093509A (en) * 1995-02-14 2000-07-25 Toray Industries, Inc. Lithographic printing plate
KR0150344B1 (ko) * 1995-12-21 1998-10-01 이웅열 감광성 수지 조성물
JPH09265188A (ja) * 1996-03-28 1997-10-07 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
WO1998004407A1 (en) * 1996-07-30 1998-02-05 Hitachi Chemical Co., Ltd. Manufacture of laminated film and printed wiring board
JP3055499B2 (ja) 1996-07-30 2000-06-26 日立化成工業株式会社 積層フィルム及びプリント配線板の製造法
JPH1051107A (ja) * 1996-08-07 1998-02-20 Ibiden Co Ltd プリント配線板の製造方法、感光性組成物、ドライフィルムフォトレジスト
US5922509A (en) 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
JPH11284336A (ja) * 1998-03-31 1999-10-15 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP4479023B2 (ja) * 1999-01-21 2010-06-09 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2001048982A (ja) 1999-08-09 2001-02-20 Mitsubishi Gas Chem Co Inc 感光性樹脂。

Also Published As

Publication number Publication date
CN1500232A (zh) 2004-05-26
KR20040030544A (ko) 2004-04-09
KR100866180B1 (ko) 2008-10-30
WO2002079877A1 (en) 2002-10-10
CN1282037C (zh) 2006-10-25
US7338751B2 (en) 2008-03-04
KR20080052681A (ko) 2008-06-11
CN1828411B (zh) 2010-11-24
KR100884438B1 (ko) 2009-02-19
JPWO2002079877A1 (ja) 2004-07-22
CN1828411A (zh) 2006-09-06
US20040086801A1 (en) 2004-05-06
TWI296738B (esLanguage) 2008-05-11

Similar Documents

Publication Publication Date Title
JP4200761B2 (ja) プリント配線板の製造法及びそれに用いる感光性樹脂組成物
KR101935609B1 (ko) 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법
WO2007114014A1 (ja) 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5273455B2 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法
JPWO2007049519A1 (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5397681B2 (ja) 感光性樹脂組成物、感光性エレメント、及びプリント配線板の製造方法
JP4428399B2 (ja) プリント配線板の製造に用いる感光性樹脂組成物
JP4172209B2 (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法及びプリント配線板の製造方法
JP2005031583A (ja) 感光性樹脂組成物及びプリント配線板の製造方法
JP4147920B2 (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4752840B2 (ja) 感光性樹脂組成物、感光性エレメント、及びプリント配線板の製造方法
JP3918647B2 (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2010217903A (ja) 感光性樹脂組成物及びプリント配線板の製造方法
JP2011221084A (ja) 感光性樹脂組成物、感光性エレメント、及びプリント配線板の製造方法
JP2007286477A (ja) 感光性樹脂組成物、これを用いた感光性エレメント及びプリント配線板の製造方法
JP5294008B2 (ja) 感光性樹脂組成物を用いたプリント配線板の製造方法
JP4238631B2 (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2009180796A (ja) 感光性樹脂組成物、感光性エレメント、及びプリント配線板の製造方法
CN101278235A (zh) 感光性树脂组合物、感光性元件及印刷电路板的制造方法
JP2009223277A (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法、リードフレームの製造方法及びプリント配線板の製造方法
JP4191354B2 (ja) プリント配線板の製造法
JP4517257B2 (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2010160417A (ja) 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法
JP4561560B2 (ja) 感光性樹脂組成物、これを用いた感光性エレメント及びプリント配線板の製造方法
JP4127946B2 (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法、プリント配線板の製造法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070313

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070511

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080401

RD13 Notification of appointment of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7433

Effective date: 20080516

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080529

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20080519

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080916

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080929

R151 Written notification of patent or utility model registration

Ref document number: 4200761

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111017

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121017

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131017

Year of fee payment: 5

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131017

Year of fee payment: 5

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

EXPY Cancellation because of completion of term