JP4197951B2 - ニッケルの酸化特性を抑制する方法 - Google Patents
ニッケルの酸化特性を抑制する方法 Download PDFInfo
- Publication number
- JP4197951B2 JP4197951B2 JP2002575343A JP2002575343A JP4197951B2 JP 4197951 B2 JP4197951 B2 JP 4197951B2 JP 2002575343 A JP2002575343 A JP 2002575343A JP 2002575343 A JP2002575343 A JP 2002575343A JP 4197951 B2 JP4197951 B2 JP 4197951B2
- Authority
- JP
- Japan
- Prior art keywords
- oxidation
- alloy
- resinate
- suppressing
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052759 nickel Inorganic materials 0.000 title claims description 10
- 238000000034 method Methods 0.000 title claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title description 40
- 230000003647 oxidation Effects 0.000 title description 19
- 238000007254 oxidation reaction Methods 0.000 title description 19
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 10
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000012298 atmosphere Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0433—Nickel- or cobalt-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Powder Metallurgy (AREA)
Description
Claims (2)
- Ni/Pt合金を製造する方法であって、
Ni粉末とPtレジネートとを、Ni95%及びPt5%からなる合金を形成する割合で混合する工程;
形成されたNi/Ptレジネート混合物を、還元性雰囲気下、500℃からNiの融点までの間の温度まで加熱処理し、これによって、レジネートが気化し、Ni/Pt合金から放出される工程;
を本質的に含んでなる、Ni/Pt合金の製造方法。 - 還元性雰囲気が、水素約1%及び窒素約99%の還元性雰囲気である、請求項1記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27746501P | 2001-03-21 | 2001-03-21 | |
US09/824,321 US20020139457A1 (en) | 2001-04-02 | 2001-04-02 | Method of suppressing the oxidation characteristics of nickel |
PCT/US2001/010897 WO2002077306A1 (en) | 2001-03-21 | 2001-04-04 | Method of suppressing the oxidation characteristics of nickel |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005505096A JP2005505096A (ja) | 2005-02-17 |
JP2005505096A5 JP2005505096A5 (ja) | 2008-03-21 |
JP4197951B2 true JP4197951B2 (ja) | 2008-12-17 |
Family
ID=26958500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002575343A Expired - Fee Related JP4197951B2 (ja) | 2001-03-21 | 2001-04-04 | ニッケルの酸化特性を抑制する方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7208218B2 (ja) |
EP (1) | EP1370701A1 (ja) |
JP (1) | JP4197951B2 (ja) |
WO (1) | WO2002077306A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4548392B2 (ja) * | 2003-02-05 | 2010-09-22 | Tdk株式会社 | 電子部品の内部電極層形成用合金粉、導電性粒子、導電性ペーストおよびそれを用いた電子部品の製造方法 |
CN100550231C (zh) * | 2003-02-05 | 2009-10-14 | Tdk株式会社 | 电子器件及其制造方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3855612A (en) | 1972-01-03 | 1974-12-17 | Signetics Corp | Schottky barrier diode semiconductor structure and method |
US3872360A (en) * | 1973-01-08 | 1975-03-18 | Du Pont | Capacitors with nickel containing electrodes |
US3757177A (en) * | 1973-01-15 | 1973-09-04 | Johanson Mfg | Monolithic base metal electrode capacitor |
GB1507031A (en) * | 1974-08-01 | 1978-04-12 | Standard Telephones Cables Ltd | Preparation of alloys |
US4097911A (en) * | 1975-10-06 | 1978-06-27 | Erie Technological Products, Inc. | Base metal electrode capacitor and method of making the same |
US4055850A (en) * | 1975-12-23 | 1977-10-25 | Union Carbide Corporation | Capacitor with electrode containing nickel |
US4241378A (en) * | 1978-06-12 | 1980-12-23 | Erie Technological Products, Inc. | Base metal electrode capacitor and method of making the same |
JPS57153253A (en) | 1981-03-17 | 1982-09-21 | Ngk Spark Plug Co Ltd | Gas sensing element |
US4604676A (en) * | 1984-10-02 | 1986-08-05 | Murata Manufacturing Co., Ltd. | Ceramic capacitor |
JPS6333563A (ja) * | 1986-07-25 | 1988-02-13 | Tanaka Kikinzoku Kogyo Kk | スパツタリング用Pt−Ni合金タ−ゲツトの製造方法 |
JPH01210035A (ja) | 1988-02-18 | 1989-08-23 | Tanaka Kikinzoku Kogyo Kk | 白金触媒とその製造方法 |
GB2242203A (en) * | 1990-03-21 | 1991-09-25 | Johnson Matthey Plc | Catalyst material comprising platinum alloy supported on carbon |
JP2885886B2 (ja) * | 1990-06-07 | 1999-04-26 | 田中貴金属工業株式会社 | 耐熱基材への金属薄膜形成方法 |
JPH06103285B2 (ja) * | 1992-01-16 | 1994-12-14 | 新コスモス電機株式会社 | 半導体ガス検出素子 |
JPH08115851A (ja) * | 1994-10-14 | 1996-05-07 | Ngk Spark Plug Co Ltd | 薄膜コンデンサ付きセラミック基板および その製造方法 |
US7625420B1 (en) | 1997-02-24 | 2009-12-01 | Cabot Corporation | Copper powders methods for producing powders and devices fabricated from same |
JP3484983B2 (ja) | 1998-07-28 | 2004-01-06 | 株式会社村田製作所 | 導電性ペースト及びガラス回路基板 |
JP4136113B2 (ja) * | 1998-09-18 | 2008-08-20 | Tdk株式会社 | チップ型積層電子部品 |
WO2001033589A1 (fr) * | 1999-11-01 | 2001-05-10 | Tdk Corporation | Composant electronique ceramique multicouche |
US20020139457A1 (en) | 2001-04-02 | 2002-10-03 | Coppola Vito A. | Method of suppressing the oxidation characteristics of nickel |
TWI260657B (en) * | 2002-04-15 | 2006-08-21 | Avx Corp | Plated terminations |
US7054137B1 (en) * | 2004-11-29 | 2006-05-30 | Kemet Electronic Corporation | Refractory metal nickel electrodes for capacitors |
-
2001
- 2001-04-04 JP JP2002575343A patent/JP4197951B2/ja not_active Expired - Fee Related
- 2001-04-04 EP EP01924652A patent/EP1370701A1/en not_active Withdrawn
- 2001-04-04 WO PCT/US2001/010897 patent/WO2002077306A1/en not_active Application Discontinuation
-
2005
- 2005-09-06 US US11/219,792 patent/US7208218B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1370701A1 (en) | 2003-12-17 |
JP2005505096A (ja) | 2005-02-17 |
US7208218B2 (en) | 2007-04-24 |
WO2002077306A1 (en) | 2002-10-03 |
US20060039821A1 (en) | 2006-02-23 |
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