JP4183240B2 - 金および金合金の電着浴とその用法 - Google Patents

金および金合金の電着浴とその用法 Download PDF

Info

Publication number
JP4183240B2
JP4183240B2 JP2002568818A JP2002568818A JP4183240B2 JP 4183240 B2 JP4183240 B2 JP 4183240B2 JP 2002568818 A JP2002568818 A JP 2002568818A JP 2002568818 A JP2002568818 A JP 2002568818A JP 4183240 B2 JP4183240 B2 JP 4183240B2
Authority
JP
Japan
Prior art keywords
bath
use according
gold
compound
bismuth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002568818A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004527653A (ja
Inventor
レーベル スザンネ
シュテュムケ マンフレッド
Original Assignee
ヴィーラント デンタル ウント テクニーク ゲーエムベーハー ウント コー カーゲー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2001110743 external-priority patent/DE10110743A1/de
Application filed by ヴィーラント デンタル ウント テクニーク ゲーエムベーハー ウント コー カーゲー filed Critical ヴィーラント デンタル ウント テクニーク ゲーエムベーハー ウント コー カーゲー
Publication of JP2004527653A publication Critical patent/JP2004527653A/ja
Application granted granted Critical
Publication of JP4183240B2 publication Critical patent/JP4183240B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Dental Preparations (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2002568818A 2001-02-28 2002-02-28 金および金合金の電着浴とその用法 Expired - Fee Related JP4183240B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2001110743 DE10110743A1 (de) 2001-02-28 2001-02-28 Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
EP01108448A EP1236814A1 (de) 2001-02-28 2001-04-04 Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
PCT/EP2002/002128 WO2002068728A1 (de) 2001-02-28 2002-02-28 Bad zur galvanischen abscheidung von gold und goldlegierungen sowie dessen verwendung

Publications (2)

Publication Number Publication Date
JP2004527653A JP2004527653A (ja) 2004-09-09
JP4183240B2 true JP4183240B2 (ja) 2008-11-19

Family

ID=26008695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002568818A Expired - Fee Related JP4183240B2 (ja) 2001-02-28 2002-02-28 金および金合金の電着浴とその用法

Country Status (8)

Country Link
US (1) US20040065225A1 (zh)
EP (1) EP1366219B1 (zh)
JP (1) JP4183240B2 (zh)
CN (1) CN100392155C (zh)
AU (1) AU2002308221A1 (zh)
BR (1) BR0207724A (zh)
CA (1) CA2438207A1 (zh)
WO (1) WO2002068728A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1378590A1 (fr) * 2002-07-04 2004-01-07 Metalor Technologies International S.A. Bain pour dépôts electrolytiques d'or
CA2558475A1 (en) * 2004-02-18 2005-09-01 Marianna Cooley Antimicrobial formulations and methods of using the same
CN1308493C (zh) * 2004-07-27 2007-04-04 滕先弟 硫代硫酸金铵络合物及其制备方法
JP5442400B2 (ja) * 2009-11-13 2014-03-12 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
CN101781758B (zh) * 2010-04-09 2011-12-07 厦门华弘昌科技有限公司 化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
US10889908B2 (en) * 2012-09-17 2021-01-12 Government Of The United States Of America, As Represented By The Secretary Of Commerce Superconformal filling composition and superconformally filling a recessed feature of an article
ITFI20120208A1 (it) * 2012-10-12 2014-04-13 Bluclad S R L Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante.
ITFI20130057A1 (it) * 2013-03-18 2014-09-19 Bluclad S R L Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante.
CN103938232B (zh) * 2014-03-04 2015-04-01 深圳市联合蓝海新技术有限公司 一种无氰电镀液及其应用
CN103938231B (zh) * 2014-03-04 2015-04-01 深圳市联合蓝海科技开发有限公司 一种电镀黄金的方法和硬质黄金的制备方法
CN104047037B (zh) * 2014-06-16 2015-06-03 深圳市联合蓝海科技开发有限公司 一种硬化剂
CN104862752B (zh) * 2015-06-12 2016-02-17 深圳市联合蓝海投资控股集团有限公司 改性无氰镀金液及其应用和硬质黄金的制备方法
WO2023041972A1 (en) * 2021-09-16 2023-03-23 Galvasols P & S High-speed pure gold electroforming/electroplating bath
JP7219847B1 (ja) 2022-09-26 2023-02-08 Ｅｅｊａ株式会社 金電気めっき液および金電気めっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE754151A (fr) * 1969-08-08 1970-12-31 Sel Rex Corp Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
CH622829A5 (zh) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
JP2592246B2 (ja) * 1987-04-10 1997-03-19 株式会社ジーシー 歯冠修復用複合冠の内側冠の作製方法及び装置
DE3805627A1 (de) * 1988-02-24 1989-09-07 Wieland Edelmetalle Goldbad
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
DE19845506A1 (de) * 1998-10-02 2000-04-06 Wieland Edelmetalle Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil

Also Published As

Publication number Publication date
WO2002068728A1 (de) 2002-09-06
CN1494606A (zh) 2004-05-05
BR0207724A (pt) 2004-03-23
CA2438207A1 (en) 2002-09-06
CN100392155C (zh) 2008-06-04
US20040065225A1 (en) 2004-04-08
EP1366219A2 (de) 2003-12-03
AU2002308221A1 (en) 2002-09-12
EP1366219B1 (de) 2014-09-03
WO2002068728A8 (de) 2003-09-18
JP2004527653A (ja) 2004-09-09

Similar Documents

Publication Publication Date Title
JP4183240B2 (ja) 金および金合金の電着浴とその用法
JP4832962B2 (ja) 改善された金合金電解質
JP2859316B2 (ja) 白金または白金合金の電気めっき浴および電気めっき方法
US5256275A (en) Electroplated gold-copper-silver alloys
JPS6254397B2 (zh)
CN107604393A (zh) 一种无氰碱铜电镀组合物及其制备方法
US6852207B1 (en) Method for producing prosthetic moulded parts for dental use
US3380898A (en) Electrolyte and method for electrodepositing a pink gold alloy
JPS63203790A (ja) シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴
JPH0270084A (ja) 金めっき浴及び金めっき方法
JPH0424440B2 (zh)
DE102005036133C5 (de) Bad für die galvanische Abscheidung von Gold und Goldlegierungen und Zusatzgemisch für ein solches Bad
JPH0321637B2 (zh)
EP1103637A1 (en) Method of producing AuCuGa alloy coating using electrolysis, and alloys produced by such a method
CA2105814A1 (en) Platinum alloy electrodeposition bath and process for manufacturing platinum alloy electrodeposited product using the same
Kuhn et al. The electroforming of gold and its alloys
EP1236814A1 (de) Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
CA1045577A (en) Electrodeposition of bright tin-nickel alloy
EP0384679A1 (en) Electrolytic deposition of gold-containing alloys
JPS5824509B2 (ja) 銀パラジウム合金メツキ液及び銀パラジウム合金メツキ方法
SU1097717A1 (ru) Электролит дл осаждени сплава серебро-медь
RU2241410C2 (ru) Способ обработки зубных протезов
CA1272160A (en) Gold alloy plating bath and process
JPH07166392A (ja) 金めっき液及び金めっき方法
JPH06264281A (ja) パラジウムメッキ液及び該メッキ液を用いたパラジウムメッキ方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080129

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080401

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080410

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080515

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080710

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080826

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080901

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110912

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4183240

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110912

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120912

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120912

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130912

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees